OMG ELECTRONIC CHEMICALS, LLC Patent applications |
Patent application number | Title | Published |
20120177925 | ELECTROLESS PLATING BATH COMPOSITION AND METHOD OF PLATING PARTICULATE MATTER - An electroless plating bath composition for plating particulate matter is provided. The plating bath composition includes a metal-containing component and a reducing component. The particulate matter is plated with at least one metal layer including at least two metals by electroless metal deposition in order to provide cutting and grinding tools with improved wear resistance. | 07-12-2012 |
20120058259 | ELECTROLESS NICKEL ALLOY PLATING BATH AND PROCESS FOR DEPOSITING THEREOF - An aqueous nickel phosphorus tin alloy electroless plating bath and process for depositing a nickel phosphorus tin alloy onto a substrate, particularly an aluminum substrate for memory disk applications, wherein the nickel phosphorus tin alloy deposit provides enhanced thermal stability, as defined by the inhibition of crystallization and suppression of magnetization upon high temperature annealing when compared to typical NiP deposits. | 03-08-2012 |