NAGANO KEIKI CO., LTD.
|NAGANO KEIKI CO., LTD. Patent applications|
|Patent application number||Title||Published|
|20100206085||SENSOR - In a sensor, a joint is provided with a sensor module, and the sensor module is accommodated in a housing. The housing is provided with a terminal, and a flexible circuit board electrically connects a diaphragm of the sensor module with the terminal. The joint is also provided with a cap-shaped base, and the top of the base is provided with an opening through which the diaphragm is exposed. A lateral surface of the base, which is crosswise with the top where the opening is provided, is provided with a part of the flexible circuit board, and the part is provided with an electronic component. With this arrangement, no plate-shaped circuit board for mounting the electronic component is required, thereby reducing the manufacturing cost. Moreover, since the electronic component is provided on the lateral surfaces of the base, the base and the electronic component are horizontally arranged.||08-19-2010|
|20100090859||INDICATOR - A numeral-displaying face provided with a numeral-display and an exterior wall intersecting a periphery of the numeral-displaying face are provided on a cover and a case body of an indicator. A monitor indicator for checking an operating condition of the indicator is provided on the exterior wall. An outer circumference of the monitor indicator is flush with the exterior wall. A fallen object does not collide with the monitor indicator, so that damage on the monitor indicator can be prevented.||04-15-2010|
|20090255343||PHYSICAL QUANTITY SENSOR AND METHOD FOR MANUFACTURING THE SAME - A physical quantity sensor includes two substrates and a movable electrode that is disposed between the two substrates and is bonded to the two substrates. In the physical quantity sensor, the movable electrode has an elastically deformable diaphragm and one of the two substrates is an electrode substrate having a detection electrode on a detection surface opposite to the diaphragm to detect capacitance between the diaphragm and the detection electrode. In the physical quantity sensor, in a range between a room temperature and a bonding temperature when the two substrates and the movable electrode are bonded, coefficients of thermal expansion of the two substrates are smaller than that of the movable electrode and in a temperature range where the physical quantity sensor is used, a coefficient of thermal expansion of the movable electrode is between a first and second substrates.||10-15-2009|
|20090056462||MANUFACTURING METHOD OF PRESSURE SENSOR AND PRESSURE SENSOR - A manufacturing method of a pressure sensor that includes a pressure detector having a bottomed cylindrical member with a bottom including a thin-wall portion and a strain detecting mechanism provided on one side of the bottom for detecting a strain of the bottom and a pressure-introducing joint for introducing the fluid to be measured into the bottomed cylindrical member is provided. The method includes: first welding for butt-welding an end of the cylindrical portion of the bottomed cylindrical member and an end of the pressure-introducing joint; and second welding for welding the pressure-introducing joint in parallel to a first weld bead formed by the first welding.||03-05-2009|
|20090038388||Pressure sensor for vehicle and brake fluid pressure control apparatus for vehicle - Disclosed is a pressure sensor||02-12-2009|
|20080236290||SENSOR AND MANUFACTURING METHOD OF SENSOR||10-02-2008|
|20080223142||SENSOR AND MANUFACTURING METHOD OF SENSOR - The following abstract will replace all prior versions of the abstract in the application:||09-18-2008|
Patent applications by NAGANO KEIKI CO., LTD.