MEMSEN ELECTRONICS INC Patent applications |
Patent application number | Title | Published |
20140048910 | SUBSTRATE STRUCTURE AND METHOD FOR MANUFACTURING SAME - Provided is a substrate structure, including: a first substrate and a second substrate arranged correspondingly. A first surface of the first substrate faces a second surface of the second substrate, wherein the first surface is successively arranged with a conductor interconnection layer and a bonding layer, with the bonding layer connecting the first substrate and the conductor interconnection layer to the second substrate. The substrate structure and a method for manufacturing the same. The second substrate can serve as a support substrate and the first substrate as a substrate for directly manufacturing a device. However, the first substrate is formed by the growth of a crystal without the problem of thickness and stress thereof, thereby avoiding unnecessary stress and further improving the performance of the device formed in the first substrate. | 02-20-2014 |
20140003633 | MEMS MICROPHONE AND FORMING METHOD THEREFOR | 01-02-2014 |
20140001584 | MEMS PRESSURE SENSOR AND MANUFACTURING METHOD THEREFOR | 01-02-2014 |
20140001581 | MEMS MICROPHONE AND FORMING METHOD THEREFOR | 01-02-2014 |
20140001579 | MEMS PRESSURE SENSOR AND MANUFACTURING METHOD THEREFOR | 01-02-2014 |
20130340526 | MEMS INERTIAL SENSOR AND FORMING METHOD THEREFOR - A MEMS inertial sensor, may include a movable sensitive element; and second substrate and a third substrate. The movable sensitive element may be formed by using a first substrate which may be formed of a monocrystalline semiconductor material. The first substrate may include a first surface and a second surface which are opposite to each other. One or more conductive layers may be formed on the first surface of the first substrate The second substrate may be coupled to a surface of the one or more conductive layer on the first substrate. The third substrate may be coupled to the second surface of the first substrate. The third substrate and the second substrate are respectively arranged on two opposite sides of the movable sensitive element. | 12-26-2013 |
20130340525 | INTEGRATED INERTIAL SENSOR AND PRESSURE SENSOR, AND FORMING METHOD THEREFOR - An integrated inertial sensor and pressure sensor may include a first substrate including a first surface and a second surface; at least one or more conductive layers, formed on the first surface of the first substrate; a movable sensitive element, formed by using a first region of the first substrate; a second substrate and a third substrate, the second substrate being coupled to a surface of the conductive layer, the third substrate being coupled to the second surface of the first substrate in which the movable sensitive element of the inertial sensor is formed, and the third substrate and the second substrate are respectively arranged on opposite sides of the movable sensitive element; and a sensitive film of the pressure sensor, including at least a second region of the first substrate, or including at least one of the conductive layers on the second region of the first substrate. | 12-26-2013 |