MATERION CORPORATION Patent applications |
Patent application number | Title | Published |
20160101599 | METAL LAMINATE WITH METALLURGICAL BONDS AND REDUCED DENSITY METAL CORE LAYER AND METHOD FOR MAKING THE SAME - A stiff, lightweight metal laminate includes a first continuous metal layer, a second continuous metal layer, and a reduced density metal core layer disposed between the first and second continuous metal layers. The reduced density metal core layer comprises a core metal and has an average density that is less than the density of the core metal. Planar metallurgical bonds secure the first and second continuous metal layers to the reduced density metal core layer. The metal laminate may be manufactured by press rolling the reduced density metal core layer sandwiched between the two continuous metal layers, after removing or overcoating the native oxide layer on each layer surface that contacts another layer in the metal laminate. | 04-14-2016 |
20150340298 | CERAMIC COMBO LID WITH SELECTIVE AND EDGE METALLIZATIONS - A frame lid for use with a semiconductor package is disclosed. First, a mask is applied to a top surface of the lid and over a central area of the top surface to define a peripheral area. Next, a seal ring is formed by metallizing the peripheral area and the sidewall of the plate. The mask can then be removed obtain the frame lid. Next, a solder preform can be attached to the seal ring. This reduces pullback and shrinkage of the metallized layer, while lowering the manufacturing cost and process times. | 11-26-2015 |
20140311633 | COPPER-NICKEL-TIN ALLOY WITH HIGH TOUGHNESS - A spinodal copper-nickel-tin alloy with a combination of improved impact strength, yield strength, and ductility is disclosed. The alloy is formed by process treatment steps including solution annealing, cold working and spinodal hardening. These include such processes as a first heat treatment/homogenization step followed by hot working, solution annealing, cold working, and a second heat treatment/spinodally hardening step. The spinodal alloys so produced are useful for applications demanding enhanced strength and ductility such as for pipes and tubes used in the oil and gas industry. | 10-23-2014 |
20140307309 | FILTER ARRAY WITH REDUCED STRAY LIGHT - Optical filter elements each include a parallelogram-shaped substrate with parallel light entrance and light exit surfaces and parallel slanted sidewalls slanted at an angle, and an interference filter disposed on one or both of the light entrance surface and the light exit surface. The optical filter elements are bonded together at the slanted sidewalls to form the optical filter array. Light is filtered by illuminating the optical filter array at an angle θ equal to or corresponding to the angle of the slanted sidewalls. In some embodiments the angle of the slanted sidewalls corresponds to the angle-of-incidence θ by Snell's law. | 10-16-2014 |
20140264949 | GOLD DIE BOND SHEET PREFORM - The amount of gold required for bonding a semiconductor die to an electronic package is reduced by using a sheet preform tack welded to the package prior to mounting the die. The preform, only slightly larger than a semiconductor die to be attached to the package, is placed in the die bond location and tack welded to the package at two spaced locations. | 09-18-2014 |
20140264394 | LIGHT EMITTING DIODE - A light emitting diode with a front surface adapted to emit light and a rear surface is provided with a reflective coating on the rear surface, the reflective coating being primarily silver and containing either 0.4% bismuth or a combination of 0.5% tin, 0.2% copper, and 0.2% samarium. | 09-18-2014 |
20140262768 | PLATING STACK TO CONDITION A BONDING SURFACE - A rotary sputtering target assembly and method of making the same including a target and a backing tube having a plated bonding surface. The backing tube and the target are bonded together along the plated bonding surface. | 09-18-2014 |
20140261925 | ULTRA HIGH STRENGTH COPPER-NICKEL-TIN ALLOYS - The present disclosure relates to ultra high strength wrought copper-nickel-tin alloys and processes for improving the yield strength of the copper-nickel-tin alloy such that the resulting 0.2% offset yield strength is at least 175 ksi. The alloy includes about 14.5 wt % to about 15.5% nickel, about 7.5 wt % to about 8.5% tin, and the remaining balance is copper. The steps include cold working the copper-nickel-tin alloy wherein the alloy undergoes between 50%-75% plastic deformation. The alloy is heat treated at elevated temperatures between about 740° F. and about 850° F. for a time period of about 3 minutes to 14 minutes. | 09-18-2014 |
20140261924 | PROCESSES FOR IMPROVING FORMABILITY OF WROUGHT COPPER-NICKEL-TIN ALLOYS - Disclosed are processes for improving the formability of a copper-nickel-tin alloy having a 0.2% offset yield strength that is above 115 ksi. The alloy includes about 14.5 to about 15.5 wt % nickel, about 7.5 to about 8.5 wt % tin, and the remaining balance is copper. The copper-nickel-tin alloy is mechanically cold worked to undergo between 5% and 15% plastic deformation. The alloy is then heat treated at elevated temperatures of about 450° F. to about 550° F. for a period of about 3 hours to about 5 hours. The alloy is then subsequently mechanically cold worked again to undergo between 4% and 12% plastic deformation. The alloy is then further heated to an elevated temperature of about 700° F. to about 850° F. for a period between about 3 minutes and about 12 minutes to relieve stress. The resulting alloy has a combination of good formability ratio and good yield strength. | 09-18-2014 |
20140261923 | PROCESS FOR THE CREATION OF UNIFORM GRAIN SIZE IN HOT WORKED SPINODAL ALLOY - Processes for producing a uniform grain hot worked spinodal alloy are disclosed. The processes generate a uniform grain spinodal alloy without cracking and without the need for a homogenization step. The processes include providing an as-cast spinodal alloy, heating the as-cast spinodal alloy between 1200 and 1300° F. for approximately 12 hours and hot working, allowing the spinodal alloy to cool, performing a second hot work on the as-cast spinodal alloy after it has been heated to 1700° F. for a defined time period, exposing the alloy to a third temperature, performing a second hot work reduction, and cooling the alloy again. | 09-18-2014 |
20140261910 | NICKEL BERYLLIUM ALLOY COMPOSITIONS - Disclosed herein are nickel beryllium alloys having improved corrosion and hardness characteristics relative to known nickel beryllium alloys. The alloys have a chemical composition with about 1.5% to 5% beryllium (Be) by weight, about 0.5% to 7% niobium (Nb) by weight; and nickel (Ni). Up to about 5 wt % chromium (Cr) may also be included. The alloys display improved hardness and corrosion resistance properties. | 09-18-2014 |