LPKF LASER & ELECTRONICS AG Patent applications |
Patent application number | Title | Published |
20150021841 | BEAM-SUPPORTED JOINING MACHINE, IN PARTICULAR LASER TRANSMISSION WELDING DEVICE - A beam-supported joining machine, in particular laser transmission welding device, including a beam head for providing a joining beam producing a joining seam between two components, a receiver for mounting the first component, and a clamping mechanism for clamping the components, in particular to clamp components with a joining seam running three-dimensionally. The clamping mechanism has a clamping device adapted to the course of the joining seam to produce a clamping force between the two components at least in the region of the respective joining zone acted upon by the joining beam, wherein a magnetic or magnetisable strip adapted to the course of the joining seam is provided as the clamping device, which strip, at least in the region of the respective joining zone acted upon by the joining beam, applies a clamping force to the components by a control magnet guided with the joining beam due to the magnetic forces acting between the strip and control magnet. | 01-22-2015 |
20140216648 | METHOD AND APPARATUS FOR LASER WELDING OF TWO JOINING MEMBERS OF PLASTIC MATERIAL - In a method and an apparatus for laser welding of two joining members of plastic material in which a focussed laser beam is emitted into a welding zone in the region of the boundary surfaces of the joining members arranged in such a way as to face one another so as to form a weld seam having a particular seam depth between the joining members, it is provided that the laser power density is modulated during the welding process in a direction of the seam depth in the welding zone. | 08-07-2014 |
20140150953 | Device and method for performing and monitoring a plastic laser transmission welding process - A device and a method for performing and monitoring a plastic laser transmission welding process includes a processing beam source for emitting a processing radiation into a joining zone between two joining members so that a weld seam is formed, a measuring beam source for irradiating a measuring zone with a measuring radiation, a detection unit for detecting the measuring radiation reflected by an interface between the weld seam and its surroundings in the joining members, and an evaluation unit connected to the detection unit for determining the depth position of the interface in the joining members from the detected reflected measuring radiation. | 06-05-2014 |
20130055566 | METHOD FOR INTRODUCING ELECTRICAL INSULATIONS IN PRINTED CIRCUIT BOARDS - A method for introducing electrical insulations in a printed circuit board includes selectively introducing groove-shaped recesses between different regions of an electrically conductive layer on a substrate along a machining path using a thermal energy input such that end portions of each of the recesses or different ones of the recesses are joined to one another. The end portions are introduced parallel to one another without overlap such that a strip-shaped region of the conductive layer is initially retained between the end portions so as to insulate the different regions. | 03-07-2013 |
20130048618 | METHOD FOR PARTIALLY STRIPPING A DEFINED AREA OF A CONDUCTIVE LAYER - A method for partial detachment of a defined area of a conductive layer using a laser beam includes forming a conductor track with a defined path from the conductive layer on the substrate, the path defining main axes. The area is segmented into zones. A linear recess is provided along a respective perimeter of each of the zones. Each of the zones has a strip shape such that the recesses extend along paths that are substantially straight lines not parallel to either of the main axes. One of the zones to be removed is heated using laser radiation until adhesion of the conductive layer to the substrate is substantially reduced and the zone to be removed is detached in a surface-wide manner from the substrate under external influences. Laser-beam parameters are set such that only the conductive layer is removed without affecting an underlying substrate. | 02-28-2013 |
20120279867 | METHOD FOR PRODUCING METAL COATINGS ON PLASTICS MATERIAL PARTS - A method for producing a metal coating on a plastics material part includes connecting each of a plurality of plastics material parts to a flexible support via a respective connecting part so as to temporarily chain the plurality of plastics material parts together. Each connecting part is attached to a respective one of the plurality of plastics material parts on at least one side. An electrically conductive connection is provided between the flexible support and each of the plurality of plastics material parts via the respective connecting part so as to provide a current supply for producing a galvanic metal coating layer on a conductive layer of each of the plurality of plastics material parts. | 11-08-2012 |
20120198977 | METHOD FOR MAKING AN OPENING IN A SUBSTRATE - A method for making an opening in a substrate includes creating a cutting path in the substrate for cutting out a polygonal area along predetermined side paths which enclose the opening and are connected to each other via respective corner points. The cutting path is started in an internal region of the polygonal area at a distance from the side paths. The cutting path is continued in a recess in the internal region to a start point on a first one of the side paths, the start point being disposed along the first one of the side paths at a substantial distance from each of the respective corner points so as to divide the first one of the side paths into a long side path portion and a short side path portion. The cutting path is continued, from the start point, along each of the side paths. | 08-09-2012 |
20120183793 | METHOD FOR SELECTIVELY METALLIZING A SUBSTRATE AND INTERCONNECT DEVICE PRODUCED BY THIS METHOD - A method for selectively metallizing a substrate having a significant content of a plastics material includes ablating a layer of the substrate close to a surface of the substrate in a region of the substrate to be metallized so as to provide access to an additive having at least one compound from a substance family of aluminosilicates that is incorporated in the plastics material and to open one of a pore or a pore structure of the aluminosilicates in the region of the substrate to be metallized. The substrate is metallized with no external current starting inside the pore or the pore structure so as to incorporate a precious metal in the substrate and then at an outer edge region of the pores so as to form a planar metallization layer on the surface of the substrate | 07-19-2012 |
20110222572 | LASER ARRANGEMENT - A laser arrangement includes an optical resonator having a V arrangement of two resonator branches. At least one active medium includes an active volume associated with each resonator branch. The arrangement also includes folding element that is highly reflective for a fundamental wavelength of the laser arrangement and an optical pump imaging system configured to unidirectionally pump the two resonator branches. The optical pump imaging system includes a common objective lens for both resonator branches. The folding element is transparent for the pump wavelength. | 09-15-2011 |
20100320178 | DEVICE FOR MACHINING A WORKPIECE BY MEANS OF PARALLEL LASER BEAMS - A device for processing a workpiece using a plurality of parallel laser beams includes a focusing optical system displaceable in a direction of an axis of symmetry configured to focus each of the plurality of parallel laser beams onto a common focusing plane, and wherein the plurality of laser beams include a first and a second laser beam pair, each containing two laser beams equidistant from the axis of symmetry. The device further includes a reflector assembly having at least two reflectors each having a plurality of reflection surfaces displaceable relative to one another in a direction of the axis of symmetry. | 12-23-2010 |
20100140232 | CLAMPING APPARATUS FOR CLAMPING AT LEAST TWO COMPONENT PARTS - The invention relates to a clamping device for clamping at least two components ( | 06-10-2010 |