LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD. Patent applications |
Patent application number | Title | Published |
20150009673 | ILLUMINATION DEVICE - An illumination device includes a base, a light-emitting module, a first layer, and a second layer. The light-emitting module is disposed on the base for generating a progressive-type light-emitting intensity. The first layer encapsulates the light-emitting module. The second layer encloses the first layer. The second layer has a progressive-type thickness corresponding to the progressive-type light-emitting intensity, and both the progressive-type light-emitting intensity and the progressive-type thickness are decreased or increased gradually, thus the progressive-type light-emitting intensity can be transformed into the uniform light-emitting intensity of the second light through the progressive-type thickness of the second layer. | 01-08-2015 |
20140341381 | LOUDSPEAKER NOISE INSPECTION METHOD, LOUDSPEAKER NOISE INSPECTION DEVICE AND RECORDING MEDIUM FOR RECORDING A LOUDSPEAKER NOISE INSPECTION PROGRAM - A loudspeaker noise inspection method is to be implemented by an electronic device and includes the steps of: obtaining a frequency sweeping audio signal from an audio output generated by a loudspeaker in response to a frequency sweeping input signal; performing differentiation upon the frequency sweeping audio signal so as to generate a differentiated frequency sweeping audio signal; and dividing the differentiated frequency sweeping audio signal by a constant which is greater than 2π times a maximum frequency of the frequency sweeping audio signal, so as to obtain an attenuated frequency sweeping audio signal for inspection of a noise pulse in the frequency sweeping audio signal. | 11-20-2014 |
20140340353 | LIGHT-EMITTING TOUCH-SWITCH DEVICE AND LIGHT-EMITTING TOUCH-SWITCH MODULE - A light-emitting touch-switch device includes a first circuit board, a cap unit and a light-emitting element. The first circuit board is electrically coupled to a sensing chip. The cap unit is disposed on the first circuit board and that is at least partially made of an electrically conductive plastic material having a resistance of equal to or smaller than 1×10 | 11-20-2014 |
20140299894 | LIGHT EMITTING DIODE PACKAGE - A light emitting diode (LED) package including a substrate unit, a light emitting unit and an encapsulant. The substrate unit includes a metal substrate and a circuit board. The metal substrate has a first carrier portion and a second carrier portion. The second carrier portion is projected from the first carrier portion. The first carrier portion has a first carrier face. The second carrier portion has a second carrier face located higher than the first carrier face. The circuit board is disposed on the first carrier face, and the second carrier portion passes through the circuit board. The light emitting unit includes at least one LED chip disposed on the second carrier face of the second carrier portion, and the LED chip electrically connected to the circuit board. The encapsulant encapsulates the LED chip. | 10-09-2014 |
20140146536 | LED COMPONENT, LED MODULE AND METHOD FOR MANUFACTURING THE LED COMPONENT - A light emitting diode (LED) component includes a base having a main body and a wiring pattern. The main body defines an axis and includes two connecting surfaces respectively located at two opposite sides thereof, and a plurality of interconnected mounting surfaces surrounding the axis and connected between the connecting surfaces. The wiring pattern is at least disposed on the mounting surfaces and includes electrically insulated anode and cathode. A plurality of light emitting diode (LED) chips are disposed on the mounting surfaces. Each LED chip is electrically connected to the anode and the cathode. | 05-29-2014 |