KULICKE & SOFFA DIE BONDING GMBH Patent applications |
Patent application number | Title | Published |
20130025791 | METHOD AND APPARATUS FOR INSPECTING A SEMICONDUCTOR CHIP PRIOR TO BONDING - A chip handling apparatus, unit and method is presented. The chip handling apparatus comprises a chip supply station; a chip mounting station; and one or more chip handling units configured to pick a chip from the supply station, transport the chip to the mounting station, and place the chip at a mounting location; wherein each chip handling unit is configured to temporarily retain the chip in a defined position relative to the chip handling unit. The chip handling apparatus further comprises means for inducing sonic vibrations in the chip when retained by one of the chip handling units; and means for measuring the vibrations induced in the chip. | 01-31-2013 |
20120168089 | TOOL FOR PICKING A PLANAR OBJECT FROM A SUPPLY STATION - A pick tool for picking a planar object from a supply station is presented, in particular to be used for picking a semiconductor die from a carrier tape, said pick tool comprising: a work surface, said work surface comprising at least one contact region that may be brought into contact with a first surface on a first side of the planar object; one or more vacuum outlets in the work surface that may be connected to a vacuum source to allow for temporarily fixing the planar object to the work surface; and wherein a flexible seal is provided to maintain vacuum if the planar object becomes deformed. | 07-05-2012 |