KOKI COMPANY LIMITED Patent applications |
Patent application number | Title | Published |
20130186519 | SOLDERING PASTE AND FLUX - The object of the present invention is to provide a solder paste that enables to form a surface mounting structure for electronic components that exhibits crack resistance in a solder joint section even in 100 heat-shock cycles at −40° C. to 150° C. as required for use in the vicinity of engines for vehicular applications. A flux including an amine halogen salt and a dicarboxylic acid is kneaded with a Sn—Ag—Bi—In alloy powder. As a result, a solder paste exhibiting long continuous printability, little occurrence of solder balls, and excellent joining ability with no cracking in 100 heat-shock cycles at −40° C. to 150° C. is obtained. | 07-25-2013 |
20120291922 | SOLDER PASTE - A solder paste according to an aspect of the invention includes, within a flux, an activator that has a dibasic acid with a molecular weight of 250 or less, a monobasic acid with a molecular weight of 150 or greater and 300 or less, and a dibasic acid with a molecular weight of 300 or greater and 600 or less; and at least one resin additive selected from the group consisting of high-density polyethylenes and polypropylenes. The solder paste has the resin additive in an amount of 4% by weight or greater and 12% by weight or less when the total amount of the flux is taken as 100% by weight, and has a viscosity of | 11-22-2012 |
20120291921 | FLUX FOR SOLDER PASTE, AND SOLDER PASTE - A flux for a solder paste according to an aspect of the invention includes an acrylic resin obtained by radically copolymerizing a (meth)acrylate having a C | 11-22-2012 |
20110274937 | LEAD-FREE SOLDER ALLOY, FATIGUE RESISTANT SOLDERING MATERIALS CONTAINING THE SOLDER ALLOY, AND JOINED PRODUCTS USING THE SOLDERING MATERIALS - [PROBLEMS TO BE SOLVED] To provide a low-silver lead-free solder alloy having an excellent wettability and being excellent in heat-fatigue resistance, and a solder-paste soldering material and resin-flux cored soldering material being excellent in fatigue resistance, and a joined product by using the soldering material. | 11-10-2011 |