INTEL CORPORATON Patent applications |
Patent application number | Title | Published |
20160020304 | INTERLAYER DIELECTRIC FOR NON-PLANAR TRANSISTORS - The present description relates the formation of a first level interlayer dielectric material layer within a non-planar transistor, which may be formed by a spin-on coating technique followed by oxidation and annealing. The first level interlayer dielectric material layer may be substantially void free and may exert a tensile strain on the source/drain regions of the non-planar transistor. | 01-21-2016 |
20150262916 | FLEXIBLE PACKAGE-TO-SOCKET INTERPOSER - A flexible interposer for the attachment of a microelectronic package to a microelectronic socket, wherein a first portion of the flexible substrate may be positioned between the microelectronic package and the microelectronic socket, and a second portion of the flexible interposer may extend from between the microelectronic package and the microelectronic socket to electrically contact an external component. In one embodiment, the external component may be a microelectronic substrate and the microelectronic socket may be attached to the microelectronic substrate. | 09-17-2015 |