I-CHIUN PRECISION INDUSTRY CO., LTD.
|I-CHIUN PRECISION INDUSTRY CO., LTD. Patent applications|
|Patent application number||Title||Published|
|20150323141||OPTICAL COMPONENT - An optical component includes a light-emitting surface and a bottom surface opposite to the light-emitting surface. The light-emitting surface and the bottom surface cooperatively form a negative lens portion, two first positive lens portions, and two second positive lens portions. The first positive lens portions and the second positive lens portions surround the negative lens portion and arranged in a stagger manner. The first positive lens portion have a first curvature, the second position lens portion have a second curvature smaller larger than the first curvature.||11-12-2015|
|20150176800||SUPPORTING BASE FOR SEMICONDUCTOR CHIP - A supporting base for a semiconductor chip comprises a substrate, a surrounding wall and a reflection plate. The surrounding wall is formed on the substrate, and an accommodating space is formed between the surrounding wall and the substrate and is provided for receiving the semiconductor chip therein. The semiconductor chip is electrically connected to the substrate. The surrounding wall includes a cut-out portion on one side thereof. The reflection plate is extend to be bent from the substrate, and the reflection plate is configured to correspond to the cut-out portion and the semiconductor and is formed of an obtuse angle with the substrate. Therefore, with such structure, the present invention is able to achieve the effect of an increased illumination range.||06-25-2015|
|20150129295||DOUBLE-SHOT INJECTION MOLDING FORMED LED LEAD FRAME STRUCTURE - A double-shot injection molding formed LED lead frame structure includes an inner base having an inner bottom portion and an inner surrounding wall surrounding on top of the inner bottom portion, the inner surrounding wall forming a central hollow portion on top of the inner bottom portion, and the inner bottom portion having an inner surface facing toward the central hollow portion; a plurality of conductive pins with each one thereof constructed by a soldering section, a securement section and an extension section respectively; and an outer base comprising an outer bottom portion attached to a bottom of the inner bottom portion and an outer surrounding wall surrounding on top of the outer bottom portion and enclosing an outer of the inner surrounding wall; wherein each one of the securement sections of the conductive pins extends to arch between the inner bottom portion and the inner surrounding wall.||05-14-2015|
|20140259676||VIBRATING RAZOR - A vibrating razor includes a handle, a razor blade and a flat-type vibration motor. The handle includes a front end having a receiving slot provided thereon; wherein the receiving slot includes a bottom wall. The razor blade is arranged at the front end of the handle. The flat-type vibration motor is arranged within the receiving slot and includes an outer shell with a cover; wherein the cover includes an external protruding dot on one side of an outer surface thereof. The flat-type vibration motor contacts the bottom wall of the receiving slot via the external protruding dot. Therefore, the external protruding dot can be utilized to increase the vibration strength of the razor blade as the flat-type vibration motor rotates to impact the bottom wall of the receiving slot.||09-18-2014|
|20140075751||METHOD FOR MANUFACTURING LED LEAD FRAME - The invention relates to a method for manufacturing LED lead frame. The method comprises steps of: (a) forming a metal base with a plurality of lead areas by injection molding; (b) electroplating the metal base; and (c) forming an insulating casing on each of the lead areas.||03-20-2014|
|20090027884||STRUCTURE OF A SUPPORTING ASSEMBLY FOR SURFACE MOUNT DEVICE LED AND MANUFACTURING METHOD THEREOF - A structure of a supporting assembly for a surface mount device LED and a manufacturing method thereof are provided. The structure of a supporting assembly comprises a plate and a substrate of LEDs. The plate has a plurality of supporting areas and a plurality of lenses each of which is respectively disposed on each supporting area. The substrate of LEDs comprises a metallic plate unit and a plurality of a surface mount device LED units each formed on the metallic plate unit. Moreover, the plate is combined with the metallic plate unit, so that each lens is respectively assembled with the corresponding surface mounting device LED unit. Via the above-mentioned structure, mass produced lenses can be assembled with and positioned on the corresponding LED units at the same time. The processes are modified and the production rate is increased.||01-29-2009|
|20090008755||STRUCTURE AND METHOD FOR MANUFACTURING SMD DIODE FRAME - A structure of an SMD (surface mount device) diode frame is provided that comprises a plastic seat and a plurality of metal pins. One side of the plastic seat has a concave functional area and the other side of the plastic seat corresponding to the functional area has a plurality of concave reserved holes. The functional area and the reserved holes are respectively formed via a forming bolt and a positioning bolt in a mold. If the forming bolt and the positioning bolt abut against the metal pins respectively, the preciseness of the size of the functional area is increased and the overflow of the material of the plastic seat is decreased. Furthermore, the yield of the manufacturing processes is improved.||01-08-2009|
Patent applications by I-CHIUN PRECISION INDUSTRY CO., LTD.