HEADWAY TECHNOLOGIES, INC. Patent applications |
Patent application number | Title | Published |
20160115612 | METHOD OF MANUFACTURING A THIN-FILM MAGNETIC HEAD INCLUDING A COIL AND A MAGNETIC PATH FORMING SECTION - A thin-film magnetic head includes a coil, a magnetic path forming section, and an insulating film. The magnetic path forming section includes first and second magnetic material portions. The coil includes first and second coil elements located between the first and second magnetic material portions. The insulating film includes an underlying portion located under the first and second coil elements. In a method of manufacturing the thin-film magnetic head, the insulating film is formed to cover the first and second magnetic material portions, and then a seed layer is formed selectively on the underlying portion of the insulating film. The coil is formed by plating using the seed layer. | 04-28-2016 |
20160055869 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING INCLUDING TWO SIDE SHIELDS - A first side shield has a first sidewall and a second sidewall. A second side shield has a third sidewall and a fourth sidewall. The distance between the first sidewall and the third sidewall decreases with increasing proximity to the top surface of a substrate. The second and fourth sidewalls are close to perpendicular to the top surface of the substrate. Each of the second and fourth sidewalls has an edge farthest from the top surface of the substrate, the edge being parallel to the medium facing surface. The main pole has a first, a second, a third and a fourth side surface. The first side surface is opposed to the first sidewall. A portion of the second side surface is opposed to the second sidewall. The third side surface is opposed to the third sidewall. A portion of the fourth side surface is opposed to the fourth sidewall. | 02-25-2016 |
20150380016 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING INCLUDING ANGLED SIDE SHIELDS SURFACES - A first side shield has a first sidewall and a second sidewall. A second side shield has a third sidewall and a fourth sidewall. The distance between the first sidewall and the third sidewall decreases with increasing proximity to the top surface of a substrate. The second and fourth sidewalls are close to perpendicular to the top surface of the substrate. Each of the second and fourth sidewalls has an edge farthest from the top surface of the substrate, the edge being parallel to the medium facing surface. The main pole has a first, a second, a third and a fourth side surface. The first side surface is opposed to the first sidewall. A portion of the second side surface is opposed to the second sidewall. The third side surface is opposed to the third sidewall. A portion of the fourth side surface is opposed to the fourth sidewall. | 12-31-2015 |
20150333254 | Reduction of Barrier Resistance X Area (RA) Product and Protection of Perpendicular Magnetic Anisotropy (PMA) for Magnetic Device Applications - A method of forming a MTJ with a tunnel barrier having a high tunneling magnetoresistance ratio, and low resistance x area value is disclosed. The method preserves perpendicular magnetic anisotropy in bottom and top magnetic layers that adjoin bottom and top surfaces of the tunnel barrier. A key feature is a passive oxidation step of a first Mg layer that is deposited on the bottom magnetic layer wherein a maximum oxygen pressure is 10 | 11-19-2015 |
20150262593 | THERMALLY-ASSISTED MAGNETIC RECORDING HEAD INCLUDING A PLASMON GENERATOR - A return path section includes first and second yoke portions and first, second and third columnar portions. The first and second yoke portions and the first columnar portion are located on the front side in the direction of travel of a recording medium relative to a waveguide core. The second and third columnar portions are located on opposite sides of a plasmon generator and connected to a shield. The first yoke portion connects a main pole to the first columnar portion. The second yoke portion connects the first columnar portion to the second and third columnar portions. A coil is wound around the first columnar portion. A heater and an expansion layer are located on the rear side in the direction of travel of the recording medium relative to the core. | 09-17-2015 |
20150255096 | NEAR-FIELD LIGHT GENERATOR INCLUDING A WAVEGUIDE AND A PLASMON GENERATOR - A plasmon generator includes a first portion and a second portion. A core of a waveguide includes a main body portion and a protruding portion. The main body portion has a first surface and a second surface parallel to each other. The protruding portion lies on the first surface. A cladding of the waveguide includes a receiving-portion-forming layer lying on the first surface. At least part of the first portion of the plasmon generator is received in a receiving portion defined by the protruding portion and the receiving-portion-forming layer. | 09-10-2015 |
20150243306 | Magnetic Pole Self-Annealing with Current Injection in Perpendicular Magnetic Recording (PMR) - A main pole structure is selectively annealed by attaching a lead to a back side thereof and electrically connecting a lead to a front end of a narrow pole tip portion such that when a first current passes between the leads there is resistive heating that raises the temperature in the narrow pole tip to 250° C. to 400° C. As a result, defects and stress level are reduced in the narrow pole tip portion without substantially increasing a temperature in adjacent regions including the read head. Annealing may be performed with a partially completed main pole structure or with a completely fabricated write head. Leads may be removed or left in place after annealing is finished. The extent of annealing may be determined by calculating a difference between resistance measurements taken before and after annealing. | 08-27-2015 |
20150235659 | MAGNETIC HEAD INCLUDING TWO CONTACT SENSORS - A magnetic head includes a medium facing surface, a read head unit, a write head unit, and a protrusion device. The protrusion device causes part of the medium facing surface to protrude toward a recording medium. The read head unit has a first end face located in the medium facing surface and includes a first contact sensor for detecting contact of the first end face with the recording medium. The write head unit has a second end face located in the medium facing surface and includes a second contact sensor for detecting contact of the second end face with the recording medium. The first end face and the second end face are located at positions different from each other in a direction of travel of the recording medium. | 08-20-2015 |
20150138671 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING INCLUDING A HEATER - A magnetic head includes a main pole, an expansion member, and a heater. The main pole has an end face located in a medium facing surface. The expansion member is located farther from the medium facing surface than is the main pole and adjacent to the main pole in a direction perpendicular to the medium facing surface. The heater heats the expansion member. The expansion member has a linear expansion coefficient higher than that of the main pole. | 05-21-2015 |
20150124575 | NEAR-FIELD LIGHT GENERATOR INCLUDING A WAVEGUIDE AND A PLASMON GENERATOR - A plasmon generator includes a first portion and a second portion that are adjacent in a first direction orthogonal to the direction of travel of light propagating through a core. The second portion includes a front end face located in a medium facing surface of a magnetic head. The core has a concave portion recessed from the top surface of the core. At least part of the first portion is received in the concave portion. The concave portion has a surface including an evanescent light generating portion. The first portion includes a plasmon exciting portion opposed to the evanescent light generating portion. The evanescent light generating portion is inclined relative to a first surface. | 05-07-2015 |
20150098154 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, and a thin-film coil are laminated on a substrate. The thin-film magnetic head has a leading shield part opposing the main magnetic pole layer on the substrate side of the main magnetic pole layer, a substrate side shield part has contact with the leading shield part. The thin-film coil has a substrate side coil layer between the main magnetic pole layer and substrate. The spaces to the substrate about a leading lower end face of the leading shield part, a shield upper end face of the substrate side shield part, and coil upper end face of the substrate side coil layer are formed to be equal to each other. The depth of the leading shield part is formed to be smaller than the depth of the substrate side shield part. | 04-09-2015 |
20150092525 | THERMALLY-ASSISTED MAGNETIC RECORDING HEAD HAVING A HEAT SINK - A thermally-assisted magnetic recording head includes a main pole, a waveguide, a plasmon generator, and a heat sink. The heat sink includes a first metal layer, a second metal layer, and an intermediate layer. The intermediate layer is interposed between the first metal layer and the second metal layer. Each of the first and second metal layers is formed of a metal material. The intermediate layer is formed of a material that is higher in Vickers hardness than the metal material used to form the first metal layer and the metal material used to form the second metal layer. | 04-02-2015 |
20150085629 | THERMALLY ASSISTED MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thermally assisted magnetic head includes a main magnetic pole layer, a near-field light generating layer having a generating end part generating near-field light arranged within a medium-opposing surface, and an optical waveguide guiding light to the near-field light generating layer. The near-field light generating layer has a laminated structure in which a first thin-film metal layer formed in a thin film form along a direction intersecting the medium-opposing surface and a second thin-film metal layer formed in a thin film form and formed using a second metal larger in hardness than a first metal forming the first thin-film metal layer are alternately laminated. Further, in the second thin-film metal layer, a defect part is formed, the defect part is a part smaller in thickness than another part or is a hole part, and a flat layer part other than the defect part surrounds the defect part. | 03-26-2015 |
20140347918 | MRAM Write Pulses to Dissipate Intermediate State Domains - A write method for a STT-RAM MTJ is disclosed that substantially reduces the bit error rate caused by intermediate domain states generated during write pulses. The method includes a plurality of “n” write periods or pulses and “n−1” domain dissipation periods where a domain dissipation period separates successive write periods. During each pulse, a write current is applied in a first direction across the MTJ and during each domain dissipation period, a second current with a magnitude equal to or less than the read current is applied in an opposite direction across the MTJ. Alternatively, no current is applied during one or more domain dissipation periods. Each domain dissipation period has a duration of 1 to 10 ns that is equal to or greater than the precession period of free layer magnetization in the absence of spin torque transfer current. | 11-27-2014 |
20140315045 | Supermalloy and Mu Metal Side and Top Shields for Magnetic Read Heads - The use of supermalloy-like materials for the side and top shields of a magnetic bit sensor is shown to provide better shielding protection from stray fields because of their extremely high permeability. | 10-23-2014 |
20140307348 | High Data Rate Writer Design - A magnetic write head is fabricated with its main pole attached to and magnetically coupled to a tapered yoke. The tapered yoke can be a top yoke (on the trailing side of the pole), a bottom yoke (on the leading side of the pole) or a combination of top and bottom configurations. The tapered portion of the yoke is at the distal end of the yoke and it is an extension of an otherwise uniformly thick yoke. It is found that the taper enables the yoke to be close to the ABS for better response times and a high data rate, while simultaneously being distant, producing less field disturbance by the shields and corresponding improvement of BER, and ATE/WATE. A taper of 45° is optimal for its production of uniform magnetization of the pole and optimal response times. | 10-16-2014 |
20140306302 | Fully Compensated Synthetic Antiferromagnet for Spintronics Applications - A synthetic antiferromagnet serving as a reference layer for a magnetic tunnel junction is a laminate with a plurality of “x+1” magnetic sub-layers and “x” non-magnetic spacers arranged in an alternating fashion, with a magnetic sub-layer at the top and bottom of the laminated stack. Each spacer has a top and bottom surfaces that interface with adjoining magnetic sub-layers generating antiferromagnetic coupling between the adjoining sub-layers. Perpendicular magnetic anisotropy is induced in each magnetic sub-layer through an interface with a spacer. Thus the dipole field exerted on a free layer is substantially reduced compared with that produced by a conventional synthetic antiferromagnetic reference layer. Magnetic sub-layers are preferably Co while Ru, Rh, or Ir may serve as non-magnetic spacers. | 10-16-2014 |
20140291284 | METHOD OF MANUFACTURING A NEAR-FIELD LIGHT GENERATOR INCLUDING A WAVEGUIDE AND A PLASMON GENERATOR - In a method of manufacturing a near-field light generator, a structure including a core and a polishing stopper layer disposed on the top surface of the core is formed on a first cladding layer. Next, a cladding material layer is formed to cover the first cladding layer and the structure. The cladding material layer is then polished until the polishing stopper layer is exposed. Next, the polishing stopper layer is removed so that the cladding material layer has a protruding portion protruding upward to a higher level than the top surface of the core. The cladding material layer is then polished so as to remove the protruding portion and thereby make the cladding material layer into a second cladding layer. Then, a third cladding layer and a plasmon generator are formed. | 10-02-2014 |
20140269237 | MULTILAYER PLASMON GENERATOR - A plasmon generator has a front end face, a first metal layer, a second metal layer, and an intermediate layer. The front end face generates near-field light based on a surface plasmon. The intermediate layer is interposed between the first metal layer and the second metal layer. Each of the first metal layer, the second metal layer and the intermediate layer has an end located in the front end face. Each of the first and second metal layers is formed of a metal material. The intermediate layer is formed of a material higher in Vickers hardness than the metal material used to form the first metal layer and the metal material used to form the second metal layer. | 09-18-2014 |
20140268423 | Dual-Piece Heat Sink Layer for Robust Reader in Magnetic Recording Head - A read head structure is disclosed with a dual piece heat sink layer having a front piece formed over a front portion of a dynamic flying height (DFH) element and a back piece above a back portion of the DFH element. A first (S1) shield is formed on the front piece and between the front piece and air bearing surface (ABS). Front and back pieces are separated by an insulator gap. The front piece is used to help control read gap protrusion. As a result, a bottom portion of the S1 shield protrudes to a greater extent than a top portion adjacent to the sensor thereby protecting the sensor from unwanted contact with the magnetic media. The dual piece heat sink layer also enables an improved Figure of Merit in terms of temperature rise in the reader per unit of actuation (nm) delivered by the DFH element. | 09-18-2014 |
20140264665 | Reader Sensor Structure and its Method of Construction - A TMR (tunneling magnetoresistive) read sensor is formed in which a portion of the sensor stack containing the ferromagnetic free layer and the tunneling barrier layer is patterned to define a narrow trackwidth, but a synthetic antiferromagnetic pinning/pinned layer is left substantially unpatterned and extends in substantially as-deposited form beyond the lateral edges bounding the patterned portion. The narrow trackwidth of the patterned portion permits high resolution for densely recorded data. The larger pinning/pinned layer significantly improves magnetic stability and reduces thermal noise, while the method of formation eliminates possible ion beam etch (IBE) or reactive ion etch (RIE) damage to the edges of the pinning/pinned layer. | 09-18-2014 |
20140252518 | High Moment Wrap-Around Shields for Magnetic Read Head Improvements - A wrap around shield structure is disclosed for biasing a free layer in a sensor and includes a bottom shield, side shields, and top shield in which each shield element comprises a high moment layer with a magnetization saturation greater than that of Ni | 09-11-2014 |
20140252517 | Thin Seeded Antiferromagnetic Coupled Side Shield for Sensor Biasing Applications - A composite side shield structure is disclosed for providing biasing to a free layer in a sensor structure. The sensor is formed between a bottom shield and top shield each having a magnetization in a first direction that is parallel to an ABS. The side shield is stabilized by an antiferromagnetic (AFM) coupling scheme wherein a bottom (first) magnetic layer is AFM coupled to a second magnetic layer which in turn is AFM coupled to an uppermost (third) magnetic layer. First and third magnetic layers each have a magnetization aligned in the first direction and are coupled to bottom and top shields, respectively, for additional stabilization. The top shield may be modified to include an AFM scheme for providing additional stabilization and guidance to magnetic moments within AFM coupled magnetic layers in the top shield, and to the third magnetic layer in the side shield. | 09-11-2014 |
20140241137 | Tilted Structures to Reduce Reflection in Laser-Assisted TAMR - A TAMR (Thermal Assisted Magnetic Recording) write head uses the energy of optical-laser excited surface plasmons in a plasmon generator to locally heat a magnetic recording medium and reduce its coercivity and magnetic anisotropy. The optical radiation is transmitted to the plasmon generator by means of a waveguide, whose optical axis (centerline) is tilted relative to either or both the backside surface normal and ABS surface normal in order to eliminate back reflections of the optical radiation that can adversely affect the properties and performance of the laser. Variations of the disclosure include tilting the plasmon generator, the waveguide and the laser diode. | 08-28-2014 |
20140220708 | MR Enhancing Layer (MREL) For Spintronic Devices - The performance of an MR device has been improved by inserting one or more Magneto-Resistance Enhancing Layers (MRELs) into approximately the center of one or more of the magnetic layers such as an inner pinned (AP1) layer, spin injection layer (SIL), field generation layer (FGL), and a free layer. An MREL is a layer of a low band gap, high electron mobility semiconductor such as ZnO or a semimetal such as Bi. The MREL may further comprise a first conductive layer that contacts a bottom surface of the semiconductor or semimetal layer, and a second conductive layer that contacts a top surface of the semiconductor or semimetal layer. | 08-07-2014 |
20140220385 | MR Enhancing Layer (MREL) For Spintronic Devices - The performance of an MR device has been improved by inserting one or more Magneto-Resistance Enhancing Layers (MRELs) into approximately the center of one or more of the magnetic layers such as an inner pinned (AP1) layer, spin injection layer (SIL), field generation layer (FGL), and a free layer. An MREL is a layer of a low band gap, high electron mobility semiconductor such as ZnO or a semimetal such as Bi. The MREL may further comprise a first conductive layer that contacts a bottom surface of the semiconductor or semimetal layer, and a second conductive layer that contacts a top surface of the semiconductor or semimetal layer. | 08-07-2014 |
20140220240 | Patterned MR Device with Controlled Shape Anisotropy - A magnetic sensor with increased sensitivity, lower noise, and improved frequency response is described. The sensor's free layer is ribbon shaped and is closely flanked at each long edge by a ribbon of magnetically soft, high permeability material. The side stripes of soft magnetic material absorb external field flux and concentrate the flux to flow into the sensor's edges to promote larger MR sensor magnetization rotation. The free layer may be deposited simultaneously with the soft magnetic layer when they are aligned in the same plane. When the flux absorbing stripes are positioned above or below the MR sensor, then the free layer and flux absorbing stripes are deposited in separate steps. | 08-07-2014 |
20140218020 | Patterned MR Device with Controlled Shape Anisotropy - A magnetic sensor with increased sensitivity, lower noise, and improved frequency response is described. The sensor's free layer is ribbon shaped and is closely flanked at each long edge by a ribbon of magnetically soft, high permeability material. The side stripes of soft magnetic material absorb external field flux and concentrate the flux to flow into the sensor's edges to promote larger MR sensor magnetization rotation. Side stripes may be located in the plane of the free layer a maximum distance of 0.1 microns, above a plane that includes a top surface of the free layer, or below a plane that includes the bottom surface of the magnetic sensor. Edges of each side stripe may be aligned above or below a portion of the magnetic sensor. | 08-07-2014 |
20140217531 | Co/Ni Multilayers with Improved Out-of-Plane Anisotropy for Magnetic Device Applications - A MTJ for a spintronic device is disclosed and includes a thin seed layer that enhances perpendicular magnetic anisotropy (PMA) in an overlying laminated layer with a (Co/X) | 08-07-2014 |
20140217530 | Co/Ni Multilayers with Improved Out-of-Plane Anisotropy for Magnetic Device Applications - A MTJ for a spintronic device that is a domain wall motion device is disclosed and includes a thin seed layer that enhances perpendicular magnetic anisotropy (PMA) in an overlying laminated layer with a (Co/X) | 08-07-2014 |
20140217529 | Co/Ni Multilayers with Improved Out-of-Plane Anisotropy for Magnetic Device Applications - A MTJ for a spintronic device is disclosed and includes a thin seed layer that enhances perpendicular magnetic anisotropy (PMA) in an overlying laminated layer with a (Co/X) | 08-07-2014 |
20140211550 | READ CIRCUIT FOR MEMORY - Embodiments are directed to detecting a state of a memory element in a memory device, comprising: applying a pulse of a predetermined magnitude and duration to the memory element to induce a transition in the state of the memory element when a polarity of the pulse is opposite to the state, monitoring, by a device, a signal associated with the memory element to detect a presence or absence of a transition in the signal in an amount greater than a threshold, and determining the state of the memory element based on said monitoring. | 07-31-2014 |
20140210022 | Magnetic Seed for Improving Blocking Temperature and Shield to Shield Spacing in a TMR Sensor - The blocking temperature of the AFM layer in a TMR sensor has been raised by inserting a magnetic seed layer between the AFM layer and the bottom shield. This gives the device improved thermal stability, including improved SNR and BER. | 07-31-2014 |
20140197504 | Mg Discontinuous Insertion Layer for Improving MTJ Shunt - A MTJ is disclosed with a discontinuous Mg or Mg alloy layer having a thickness from 1 to 3 Angstroms between a free layer and a capping layer in a bottom spin valve configuration. It is believed the discontinuous Mg layer serves to block conductive material in the capping layer from diffusing through the free layer and into the tunnel barrier layer thereby preventing the formation of conductive channels that function as electrical shunts within the insulation matrix of the tunnel barrier. As a result, the “low tail” percentage in a plot of magnetoresistive ratio vs Rp is minimized which means the number of high performance MTJ elements in a MTJ array is significantly increased, especially when a high temperature anneal is included in the MTJ fabrication process. The discontinuous layer is formed by a low power physical vapor deposition process. | 07-17-2014 |
20140183673 | Magnetic Read Head with MR Enhancements - A TMR stack or a GMR stack, ultimately formed into a sensor or MRAM element, include insertion layers of Fe or iron rich layers of FeX in its ferromagnetic free layer and/or the AP1 layer of its SyAP pinned layer. X is a non-magnetic, metallic element (or elements) chosen from Ta, Hf, V, Co, Mo, Zr, Nb or Ti whose total atom percent is less than 50%. The insertion layers are between 1 and 10 angstroms in thickness, with between 2 and 5 angstroms being preferred and, in the TMR stack, they are inserted adjacent to the interfaces between a tunneling barrier layer and the ferromagnetic free layer or the tunneling barrier layer and the AP1 layer of the SyAP pinned layer in the TMR stack. The insertion layers constrain interdiffusion of B and Ni from CoFeB and NiFe layers and block NiFe crystalline growth. | 07-03-2014 |
20140177103 | PMR Writer Device with Multi-Level Tapered Write Pole - A perpendicular magnetic recording (PMR) head is fabricated with a multi-level tapered write pole. The write pole comprises a main pole with a tapered tip on a leading edge or a trailing edge, on which is formed at least one yoke that has a tapered edge. The edge of the yoke is recessed from the ABS of the main pole, giving the head a stepped profile. The yoke can be a single yoke formed on one side of the main pole or it can be two yokes formed on both the leading and trailing sides of the main pole. The write pole structure creates an efficient channeling of magnetic flux to the ABS surface of the pole tip which produces magnetic recording field at high area densities. | 06-26-2014 |
20140175053 | TAPER-ETCHING METHOD AND METHOD OF MANUFACTURING NEAR-FIELD LIGHT GENERATOR - A method of taper-etching a layer to be etched that is made of a dielectric material and has a top surface. The method includes the steps of: forming an etching mask with an opening on the top surface of the layer to be etched; and taper-etching a portion of the layer to be etched, the portion being exposed from the opening, by reactive ion etching so that a groove having two wall faces intersecting at a predetermined angle is formed in the layer to be etched. The step of taper-etching employs an etching gas containing a first gas contributing to the etching of the layer to be etched and a second gas contributing to the deposition of a sidewall protective film, and changes, during the step, the ratio of the flow rate of the second gas to the flow rate of the first gas so that the ratio increases. | 06-26-2014 |
20140145792 | Free Layer with Out-of-Plane Anisotropy for Magnetic Device Applications - Synthetic antiferromagnetic (SAF) and synthetic ferrimagnetic (SyF) free layer structures are disclosed that reduce Ho (for a SAF free layer), increase perpendicular magnetic anisotropy (PMA), and provide higher thermal stability up to at least 400° C. The SAF and SyF structures have a FL1/DL1/spacer/DL2/FL2 configuration wherein FL1 and FL2 are free layers with PMA, the coupling layer induces antiferromagnetic or ferrimagnetic coupling between FL1 and FL2 depending on thickness, and DL1 and DL2 are dusting layers that enhance the coupling between FL1 and FL2. The SAF free layer may be used with a SAF reference layer in STT-MRAM memory elements or in spintronic devices including a spin transfer oscillator. Furthermore, a dual SAF structure is described that may provide further advantages in terms of Ho, PMA, and thermal stability. | 05-29-2014 |
20140138783 | MR Device with Synthetic Free Layer Structure - A magneto-resistive device having a large output signal as well as a high signal-to-noise ratio is described along with a process for forming it. This improved performance was accomplished by expanding the free layer into a multilayer laminate comprising at least three ferromagnetic layers separated from one another by antiparallel coupling layers. The ferromagnetic layer closest to the transition layer must include CoFeB while the furthermost layer is required to have low Hc as well as a low and negative lambda value. One possibility for the central ferromagnetic layer is NiFe but this is not mandatory. | 05-22-2014 |
20140133283 | Plasmon Resonator with Dual Waveguide Excitation for TAMR - A TAMR (Thermal Assisted Magnetic Recording) write head uses the near field energy of optical-laser excited plasmon eigenmodes in a plasmon resonator to locally heat a magnetic recording medium and reduce its coercivity and magnetic anisotropy. The plasmon resonator is formed as a conducting disk-shaped structure with an extending peg that serves to further confine the near fields within a small region of the recording medium. The resonator eigenmodes are excited, through direct or evanescent coupling, by an interference pattern formed by the overlap of optical waves within a dual-channel waveguide, the interference pattern being the result of the waves in one branch being phase-shifted relative to the waves in the other branch. | 05-15-2014 |
20140124959 | MEMORY DEVICE, LAMINATED SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A memory device has a laminated chip package and a controller chip. In the laminated chip package, a plurality of memory chips are laminated. An interposed chip is laminated between the laminated chip package and the controller chip. The memory chips have a plurality of first wiring electrodes. The interposed chip has a plurality of second wiring electrodes. The second wiring electrodes are formed with a common arrangement pattern common with an arrangement pattern of a plurality of wiring electrodes for controller which are formed in the controller chip. The controller chip is laid on the interposed chip. | 05-08-2014 |
20140123473 | Method of Forming a TAMR Writer with a Concave Leading Shield for Enhanced Field Magnitude - A method of forming a TAMR (Thermal Assisted Magnetic Recording) write head that uses the energy of optical-laser excited plasmons to locally heat a magnetic recording medium and reduce its coercivity and magnetic anisotropy. The magnetic field of the write head is enhanced by the formation of a leading shield that is formed in a concave geometrical shape and partially surrounds the waveguide portion of the head within the concavity, which allows the distal end of the waveguide to extend to the ABS plane of the write head. This arrangement reduces the gap between the shield and the magnetic pole and does not interfere with the ability of the waveguide to efficiently transfer its optical energy to the plasmon generator and, ultimately, to the surface of the magnetic recording medium. | 05-08-2014 |
20140119105 | Adaptive Reference Scheme for Magnetic Memory Applications - A structure and method is described for an adaptive reference used in reading magnetic tunneling memory cells. A collection of magnetic tunneling memory cells are used to form a reference circuit and are coupled in parallel between circuit ground and a reference input to a sense amplifier. Each of the magnetic memory cells used to form the reference circuit are programmed to a magnetic parallel state or a magnetic anti-parallel state, wherein each different state produces a different resistance. By varying the number of parallel states in comparison to the anti-parallel states, where each of the two sates produce a different resistance, the value of the reference circuit resistance can be adjusted to adapt to the resistance characteristics of a magnetic memory data cell to produce a more reliable read of the data programmed into the magnetic memory data cell. | 05-01-2014 |
20140116984 | Two Step Method to Fabricate Small Dimension Devices for Magnetic Recording Applications - A two part ion beam etch sequence involving low energy (<300 eV) is disclosed for fabricating a free layer width (FLW) as small as 20-25 nm in a MTJ element. A first etch process has one or more low incident angles and accounts for removal of 70% to 100% of the MTJ stack that is not covered by an overlying photoresist layer. The second etch process employs one or more high incident angles and a sweeping motion that is repeated during a plurality of cycles. Sidewall slope may be adjusted by varying the incident angle during either of the etch processes. FLW is about 30 nm less than an initial critical dimension in the photoresist layer while maintaining a MR ratio over 60% and low RA (resistance×area) value of 1.0 ohm-μm | 05-01-2014 |
20140112115 | Reduced Plasmon Shield-Generator Gap Structure and Process - Three structures, and processes for manufacturing them, that improve the performance of a TAMR feature in a magnetic write head are disclosed. This improvement is achieved by making the separation between the edge plasmon generator and the plasmon shield less than the separation between the edge plasmon generator and the optical wave-guide. | 04-24-2014 |
20140111887 | Graded Bevel Tapered Write Pole Design for Field Enhancement - A structure and a process for a perpendicular write pole that provides increased magnetic flux at the ABS is disclosed. This is accomplished by increasing the amount of write flux that originates above the write gap, without changing the pole taper at the ABS. Three embodiment of the invention are discussed. | 04-24-2014 |
20140111886 | Graded Bevel Tapered Write Pole Design for Field Enhancement - A structure and a process for a perpendicular write pole that provides increased magnetic flux at the ABS is disclosed. This is accomplished by increasing the amount of write flux that originates above the write gap, without changing the pole taper at the ABS. Three embodiment of the invention are discussed. | 04-24-2014 |
20140106182 | High Coercivity Magnetic Film for Use as a Hot Seed in a Magnetic Write Head and Method to Grow It - A sub-structure, suitable for use as a hot seed on which to form a perpendicular magnetic main write pole, is described. It is made up of a buffer layer of atomic layer deposited alumina on which there are one or more seed layers having a body-centered cubic (bcc) crystal structure. Finally, the high coercivity magnetic film lies on the seed layer(s). It is critical that the high coercivity magnetic film be deposited at a very low deposition rate (around 1 Angstrom per second). | 04-17-2014 |
20140103469 | Seed Layer for Multilayer Magnetic Materials - A magnetic element is disclosed wherein a composite seed layer such as TaN/Mg enhances perpendicular magnetic anisotropy (PMA) in an overlying magnetic layer that may be a reference layer, free layer, or dipole layer. The first seed layer is selected from one or more of Ta, Zr, Nb, TaN, ZrN, NbN, and Ru. The second seed layer is selected from one or more of Mg, Sr, Ti, Al, V, Hf, B, and Si. A growth promoting layer made of NiCr or an alloy thereof may be inserted between the seed layer and magnetic layer. The magnetic element has thermal stability to at least 400° C. | 04-17-2014 |
20140091055 | Method of Making a PMR Writer with Graded Side Shield - A perpendicular magnetic recording (PMR) head is fabricated with a pole tip shielded laterally by a graded side shield that is conformal to the shape of the pole tip at an upper portion of the shield but not conformal to the pole tip at a lower portion. The shield includes a trailing shield, that is conformal to the trailing edge of the pole tip and may include a leading edge shield that magnetically connects two bottom ends of the graded side shield. | 04-03-2014 |
20140078619 | Shield Designs with Internal Magnetization Control for ATE Improvement - A magnetic recording head is fabricated with a pole tip shielded laterally on its sides by a pair of symmetrically disposed side shields formed of porous heterogeneous material that contains non-magnetic inclusions. The non-magnetic inclusions, when properly incorporated within the magnetic matrix of the shields, promote the formation of flux loops within the shields that have portions that are parallel to the ABS and do not display locally disorganized and dynamic regions of flux during the creation of magnetic transitions within the recording medium by the magnetic pole. These flux loop portions, combine with the magnetic flux emerging from the main pole to create a net writing field that significantly reduces adjacent track erasures (ATE) and wide area erasures (WATE). | 03-20-2014 |
20140077318 | Storage Element for STT MRAM Applications - An improved PMA STT MTJ storage element, and a method for forming it, are described. By inserting a suitable oxide layer between the storage and cap layers, improved PMA properties are obtained, increasing the potential for a larger Eb/kT thermal factor as well as a larger MR. Another important advantage is better compatibility with high processing temperatures, potentially facilitating integration with CMOS. | 03-20-2014 |
20140071562 | Magnetic Recording Assisted by Spin Torque Oscillator with a Radio Frequency Current Bias - A design is disclosed for a microwave assisted magnetic recording device wherein direct current and rf current are simultaneously injected from a bias tee into a spin transfer oscillator (STO) between a main pole and write shield to improve the assist process. The STO oscillation layer (OL) has a large angle magnetization oscillation frequency that is locked to a magnetic medium bit resonance frequency f0 when the rf current has a frequency f=f0 and a threshold current density is applied. Alternatively, the OL magnetization oscillation frequency may be adjusted closer to f0 to improve the assist process. A third advantage is lowering the threshold current density when both direct current and rf current are injected into the STO during a write process. The main pole is grounded when direct current and rf current are injected into a write shield. | 03-13-2014 |
20140071560 | MAGNETIC RECORDING ASSISTED BY SPIN TORQUE OSCILLATOR WITH A RADIO FREQUENCY CURRENT BIAS - A method to tune an oscillation layer frequency in a spin torque oscillator (STO) during a microwave assisted magnetic recording (MAMR) process is described. The STO oscillation layer (OL) has a large angle magnetization oscillation frequency that is locked to a magnetic medium bit resonance frequency f | 03-13-2014 |
20140070341 | Minimal Thickness Synthetic Antiferromagnetic (SAF) Structure with Perpendicular Magnetic Anisotropy for STT-MRAM - A synthetic antiferromagnetic (SAF) structure for a spintronic device is disclosed and has an AP2/antiferromagnetic (AF) coupling/CoFeB configuration. The SAF structure is thinned to reduce the fringing (Ho) field while maintaining high coercivity. The AP2 reference layer has intrinsic perpendicular magnetic anisotropy (PMA) and induces PMA in a thin CoFeB layer through AF coupling. In one embodiment, AF coupling is improved by inserting a Co dusting layer on top and bottom surfaces of a Ru AF coupling layer. When AP2 is (Co/Ni) | 03-13-2014 |
20140061827 | Metal Protection Layer over SiN Encapsulation for Spin-Torque MRAM Device Applications - A magnetic thin film deposition is patterned and protected from oxidation during subsequent processes, such as bit line formation, by an oxidation-prevention encapsulation layer of SiN. The SiN layer is then itself protected during the processing by a metal overlayer, preferably of Ta, Al, TiN, TaN or W. A sequence of low pressure plasma etches, using Oxygen, Cl | 03-06-2014 |
20140037989 | Thin Seeded Co/Ni Multilayer Film with Perpendicular Anisotropy for Read Head Sensor Stabilization - A hard bias (HB) structure for producing longitudinal bias to stabilize a free layer in an adjacent spin valve is disclosed and includes a composite seed layer made of at least Ta and a metal layer having a fcc(111) or hcp(001) texture to enhance perpendicular magnetic anisotropy (PMA) in an overlying (Co/Ni) | 02-06-2014 |
20140037861 | Method of Forming a Writer with an AFM Write Gap - A perpendicular magnetic recording (PMR) head is fabricated with main pole and a trailing edge shield antiferromagnetically coupled across a write gap by either having the write gap layer formed as a synthetic antiferromagnetic tri-layer (SAF) or formed as a monolithic layer of antiferromagnetic material. The coupling improves the write performance of the writer by enhancing the perpendicular component of the write field and its gradient. Methods of fabricating the writer are provided. | 02-06-2014 |
20140037836 | Thin Seeded Co/Ni Multilayer Film with Perpendicular Anisotropy for Read Head Sensor Stabilization - A method for producing a hard bias (HB) structure that stabilizes a free layer in an adjacent spin valve is disclosed. The HB structure includes a composite seed layer and a metal layer having a fcc(111) or hcp(001) texture to enhance perpendicular magnetic anisotropy (PMA) in an overlying (Co/Ni) | 02-06-2014 |
20140036384 | ABS Design for Uniform Touch-Down and Back-Off in DFH Applications - A DFH (Dynamic Flying Height) type slider ABS design has significantly improved DFH efficiency and back-off efficiency as well as uniform touchdown detectability. This is the result of decoupling the local pressure variations at the read/write head that result from skew angle variations across a disk, from local stiffness due to ABS protrusion caused by heater activation. The decoupling, which allows the heater activation stiffness to be carefully tuned, is a result of the effects of airflow channeled by a wide down-track channel onto a narrow down-track channel formed in an extended finger of the central pad of the slider. Airflow impinges on the finger channel in a manner that eliminates variations in air pressure at the central pad due to variations in skew angle. | 02-06-2014 |
20140016232 | Non-Uniform Write Gap Perpendicular Writer for Shingle Writing - A PMR writer is disclosed that includes at least one of a recessed center section in the write pole trailing edge and a center recessed trailing shield to improve the field gradient at track edge. In all embodiments, there is a non-uniform write gap between the trailing edge and the trailing shield. The recessed portion of the write pole trailing edge and/or center recess of the trailing shield has a thickness from 10 to 40 nm in a down-track direction and a width in a cross-track direction of 20 to 200 nm. The distance between the center recess and a corner of the trailing edge is from 20 to 80 nm. A sequence of steps is provided to fabricate the two embodiments of the present invention. | 01-16-2014 |
20140014617 | Method of Forming a Non-Uniform Write Gap Perpendicular Writer for Shingle Writing - A method of forming a PMR writer is disclosed wherein at least one of a recessed center section in the write pole trailing edge and a center recessed trailing shield is used to improve the field gradient at track edge. In all embodiments, there is a non-uniform write gap formed between the trailing edge and the trailing shield. The recessed portion of the write pole trailing edge and/or center recess of the trailing shield has a thickness from 10 to 40 nm in a down-track direction and a width in a cross-track direction of 20 to 200 nm. The distance between the center recess and a corner of the trailing edge is from 20 to 80 nm. A sequence of steps is provided to fabricate the two embodiments of the present invention. | 01-16-2014 |
20130334629 | MTJ Element for STT MRAM - An all (111) MTJ stack is disclosed in which there are no transitions between different crystalline orientations when going from layer to layer. This is accomplished by providing strongly (111)-textured layers immediately below the MgO tunnel barrier to induce a (111) orientation therein. | 12-19-2013 |
20130334051 | Novel Plating Method - An electroplating method is disclosed that selectively deposits a greater thickness of a metal or alloy layer on a region of wafer that has a higher thickness loss during a subsequent chemical mechanical polish process. A paddle assembly has three rectangular sides joined at their edges to form a triangle shape from an end view, and a notch in a bottom side that faces a wafer during the plating process. The notch extends along second and third paddle sides to a height up to about 50% of the paddle thickness. The thickness in a K-block region that has two sides formed parallel to the wafer flat is selectively increased by aligning a first side of the paddle notch side directly over one K-block side and aligning a second notch side directly over a second K-block side during a paddle movement cycle. The notch may be rectangular shaped or tapered. | 12-19-2013 |
20130329319 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A RETURN PATH SECTION - A magnetic head includes first and second coils, a main pole, a write shield, a return path section, and a core part. The return path section includes a yoke part magnetically connected to the write shield, and a coupling part located away from a medium facing surface and magnetically coupling the yoke part and the main pole to each other. The first coil is located on the front side in the direction of travel of a recording medium relative to the main pole and wound around the coupling part. The core part is located farther from the medium facing surface than is the coupling part, and is magnetically connected to the main pole. The second coil is located on the front side in the direction of travel of the recording medium relative to the main pole and wound around the core part. | 12-12-2013 |
20130316367 | Discrete Contact MR Bio-Sensor with Magnetic Label Field Alignment - The invention describes a family of sensors for assaying macro-molecules and/or biological cells in solution. The invention also describes methods of making and using the sensors. Each sensor has the form of a well (a hollow cylinder having a floor but no lid) or a trench whose walls comprise a plurality of GMR or TMR devices. Suitably shaped magnets located below each well's floor pull labeled particles into the well/trench and up against the inner wall where a field gradient orients them for optimum detection. Any unattached labels that happen to also be in the well/trench are removed through suitably sized holes in the floor. | 11-28-2013 |
20130308227 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A MAIN POLE AND A SHIELD - A magnetic head includes a magnetic structure incorporating a write shield. The magnetic structure is formed to include a first magnetic layer, a second magnetic layer stacked on the first magnetic layer, and a seed layer. The first magnetic layer has a front end face located in the medium facing surface and a top surface. The second magnetic layer has a front end face located in the medium facing surface and a bottom surface. The top surface of the first magnetic layer includes a first region including an end located in the medium facing surface and a second region farther from the medium facing surface than the first region. The seed layer is not present on the first region of the top surface of the first magnetic layer but is present on the second region. | 11-21-2013 |
20130302912 | Method to Reduce Magnetic Film Stress for Better Yield - A method of forming a thin-film deposition, such as an MTJ (magnetic tunneling junction) layer, on a wafer-scale CMOS substrate so that the thin-film deposition is segmented by walls or trenches and not affected by thin-film stresses due to wafer warpage or other subsequent annealing processes. An interface layer is formed on the CMOS substrate and is patterned by either forming undercut trenches extending into its upper surface or by fabricating T-shaped walls that extend along its upper surface. The thin-film is deposited continuously over the patterned surface, whereupon either the trenches or walls segment the deposition and serve as stress-relief mechanisms to eliminate adverse effects of processing as stresses such as those caused by wafer warpage. | 11-14-2013 |
20130283601 | METHOD OF MANUFACTURING MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A RETURN PATH SECTION - A method of manufacturing a magnetic head includes the step of forming an accommodation part and the step of forming a return path section. The return path section lies between a main pole and a top surface of a substrate, and connects a shield and part of the main pole away from a medium facing surface to each other so that a space through which part of a coil passes is defined. The accommodation part accommodates at least part of the return path section. The step of forming the return path section forms first to third portions simultaneously. The first portion is located closer to the top surface of the substrate than is the space. The second portion is located closer to the medium facing surface than is the space. The third portion is located farther from the medium facing surface than is the space. | 10-31-2013 |
20130270523 | Free Layer with High Thermal Stability for Magnetic Device Applications by Insertion of a Boron Dusting Layer - A boron or boron containing dusting layer such as CoB or FeB is formed along one or both of top and bottom surfaces of a free layer at interfaces with a tunnel barrier layer and capping layer to improve thermal stability while maintaining other magnetic properties of a MTJ stack. Each dusting layer has a thickness from 0.2 to 20 Angstroms and may be used as deposited, or at temperatures up to 400° C. or higher, or following a subsequent anneal at 400° C. or higher. The free layer may be a single layer of CoFe, Co, CoFeB or CoFeNiB, or may include a non-magnetic insertion layer. The resulting MTJ is suitable for STT-MRAM memory elements or spintronic devices. Perpendicular magnetic anisotropy is maintained in the free layer at temperatures up to 400° C. or higher. Ku enhancement is achieved and the retention time of a memory cell for STT-MRAM designs is increased. | 10-17-2013 |
20130264665 | Reduction of Capping Layer Resistance Area Product for Magnetic Device Applications - A ferromagnetic layer is capped with a metallic oxide (or nitride) layer that provides a perpendicular-to-plane magnetic anisotropy to the layer. The surface of the ferromagnetic layer is treated with a plasma to prevent diffusion of oxygen (or nitrogen) into the layer interior. An exemplary metallic oxide layer is formed as a layer of metallic Mg that is plasma treated to reduce its grain size and enhance the diffusivity of oxygen into its interior. Then the plasma treated Mg layer is naturally oxidized and, optionally, is again plasma treated to reduce its thickness and remove the oxygen rich upper surface. | 10-10-2013 |
20130250455 | Measurement of Spacing Fluctuation by HDI Sensor - A method for determining the surface distortions of a disk in a spin-stand or single or multiple disk hard disk drive (HDD) utilizing a DFH type write head. A stepwise power curve is supplied to the DFH head, the head is flown over a chosen track on the disk, and the high frequency signal from a HDI sensor is analyzed in order to determine the step of an initial touchdown power and the step of a complete touchdown power as a function of individual sectors in a sector subdivision along a chosen track. The HDI sensor signal is averaged within each step of the power curve between these two steps and a Ratio variable, | 09-26-2013 |
20130250446 | Spacing Fluctuation Compensation - A method to compensate for spacing variations between a dynamic fly height (DFH) controlled read/write head and a rotating disk surface. Using a HDI sensor or equivalent indicator of touchdowns, a power profile is calculated for an arbitrary track on a disk. The profile tracks disk topography by recording touchdown power at each of a series of sectors into which the track is subdivided. The resulting power profile, smoothed and expressed as a function of sector position, substitutes for the usual constant TD power setting that provides only an uncompensated range of spacing variations. A fixed back-off spacing power is added to the power profile enabling the head to fly over the track at a constant spacing. The power profile can be calculated to account for various temperature and pressure conditions. | 09-26-2013 |
20130244342 | Reverse Partial Etching Scheme for Magnetic Device Applications - A magnetic tunnel junction (MTJ) structure is provided over a device wherein the MTJ comprises a tunnel barrier layer between a free layer and a pinned layer; and a top and bottom electrode inside the MTJ structure. A hard mask layer is formed on the top electrode. The hard mask layer, top electrode, free layer, tunnel barrier layer, and pinned layer are patterned to define the magnetic tunnel junction (MTJ) structures. A first dielectric layer is deposited over the MTJ structures and planarized to expose the top electrode. Thereafter, the top electrode and free layer are patterned. A second dielectric layer is deposited over the MTJ structures and planarized to expose the top electrode. A third dielectric layer is deposited over the MTJ structures and a metal line contact is formed through the third dielectric layer to the top electrode to complete fabrication of the magnetic device. | 09-19-2013 |
20130241081 | COMBINATION FOR COMPOSITE LAYERED CHIP PACKAGE - A main package includes a plurality of stacked semiconductor chips and a plurality of first terminals associated with different ones of the semiconductor chips. An additional package includes an additional semiconductor chip and at least one second terminal electrically connected to the additional semiconductor chip. The additional semiconductor chip is to substitute for one of the plurality of semiconductor chips in the main package. The main package and the additional package are arranged in one of a plurality of relative positional relationships that is selected according to which one of the plurality of semiconductor chips in the main package is to be substituted with the additional semiconductor chip. | 09-19-2013 |
20130240963 | STT-MRAM Reference Layer Having Substantially Reduced Stray Field and Consisting of a Single Magnetic Domain - An STT MTJ cell is formed with a magnetic anisotropy of its free and reference layers that is perpendicular to their planes of formation. The reference layer of the cell is an SAF multilayered structure with a single magnetic domain to enhance the bi-stability of the magnetoresistive states of the cell. The free layer of the cell is etched back laterally from the reference layer, so that the fringing stray field of the reference layer is no more than 15% of the coercivity of the free layer and has minimal effect on the free layer. | 09-19-2013 |
20130230741 | High Thermal Stability Free Layer with High Out-of-Plane Anisotropy for Magnetic Device Applications - A CoFeB or CoFeNiB magnetic layer wherein the boron content is 25 to 40 atomic % and with a thickness <20 Angstroms is used to achieve high perpendicular magnetic anisotropy and enhanced thermal stability in magnetic devices. A dusting layer made of Co, Ni, Fe or alloy thereof is added to top and bottom surfaces of the CoFeB layer to increase magnetoresistance as well as improve Hc and Hk. Another embodiment includes a non-magnetic metal insertion in the CoFeB free layer. The CoFeB layer with elevated B content may be incorporated as a free layer, dipole layer, or reference layer in STT-MRAM memory elements or in spintronic devices including a spin transfer oscillator. Thermal stability is increased such that substantial Hk is retained after annealing to at least 400° C. for 1 hour. Ku enhancement is achieved and the retention time of a memory cell for STT-MRAM designs is increased. | 09-05-2013 |
20130224521 | High Thermal Stability Reference Structure with Out-of-Plane Aniotropy for Magnetic Device Applications - Enhanced Hc and Hk in addition to higher thermal stability to 400° C. are achieved in magnetic devices by adding dusting layers on top and bottom surfaces of a spacer in a synthetic antiferromagnetic (SAF) structure to give a RL1/DL1/spacer/DL2/RL2 reference layer configuration where RL1 and RL2 layers exhibit perpendicular magnetic anisotropy (PMA), the spacer induces antiferromagnetic coupling between RL1 and RL2, and DL1 and DL2 are dusting layers that enhance PMA. RL1 and RL2 layers are selected from laminates such as (Ni/Co)n, L1 | 08-29-2013 |
20130221460 | Engineered Magnetic Layer with Improved Perpendicular Anisotropy using Glassing Agents for Spintronic Applications - A magnetic element in a spintronic device or serving as a propagation medium in a domain wall motion device is disclosed wherein first and second interfaces of a free layer with a perpendicular Hk enhancing layer and tunnel barrier, respectively, produce enhanced surface perpendicular anisotropy to increase thermal stability in a magnetic tunnel junction. The free layer may be a single layer or a composite and is comprised of a glassing agent that has a first concentration in a middle portion thereof and a second concentration less than the first concentration in regions near first and second interfaces. A CoFeB free layer selectively crystallizes along first and second interfaces but maintains an amorphous character in a middle region containing a glass agent providing the annealing temperature is less than the crystallization temperature of the middle region. | 08-29-2013 |
20130221459 | Engineered Magnetic Layer with Improved Perpendicular Anisotropy using Glassing Agents for Spintronic Applications - A magnetic element is disclosed wherein first and second interfaces of a free layer with a perpendicular Hk enhancing layer and tunnel barrier, respectively, produce enhanced surface perpendicular anisotropy to increase thermal stability in a magnetic tunnel junction (MTJ). The free layer may be a single layer or a composite and is comprised of one or more glassing agents that have a first concentration in a middle portion thereof and a second concentration less than the first concentration in regions near first and second interfaces. As a result, a CoFeB free layer, for example, selectively crystallizes along first and second interfaces but maintains an amorphous character in a middle region containing a glass agent providing the annealing temperature is less than the crystallization temperature of the middle region. The magnetic element may be part of a spintronic device or serve as a propagation medium in a domain wall motion device. | 08-29-2013 |
20130186854 | TAPER-ETCHING METHOD AND METHOD OF MANUFACTURING NEAR-FIELD LIGHT GENERATOR - A method of taper-etching a layer to be etched that is made of a dielectric material and has a top surface. The method includes the steps of: forming an etching mask with an opening on the top surface of the layer to be etched; and taper-etching a portion of the layer to be etched, the portion being exposed from the opening, by reactive ion etching so that a groove having two wall faces intersecting at a predetermined angle is formed in the layer to be etched. The step of taper-etching employs an etching gas containing a first gas contributing to the etching of the layer to be etched and a second gas contributing to the deposition of a sidewall protective film, and changes, during the step, the ratio of the flow rate of the second gas to the flow rate of the first gas so that the ratio increases. | 07-25-2013 |
20130176773 | Reference Averaging for MRAM Sense Amplifiers - A sense amplifier comprising a reference current developed from a programmed and a non-programmed reference cell is used to read a signal from a magnetic random access memory (MRAM) comprising magnetic tunnel junction (MTJ) cells. The average current is determined from reference cells in as few as one sense amplifier and as many as n sense amplifiers, and is an average current between the programmed reference cell and the non-programmed reference cell that approximates the mid point between the two states. The sense amplifier can be fully differential or a non differential sense amplifier. | 07-11-2013 |
20130176644 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, a thin-film coil and a shield magnetic layer are laminated on a substrate. The thin-film magnetic head has a shield magnetic layer. This thin-film magnetic head has a hard guard frame layer surrounding an equidistant coil part, disposed at a position equidistant from the substrate, from outside and being in direct contact with almost a whole outside surface defining an outer shape of the equidistant coil part. | 07-11-2013 |
20130175644 | Spin Torque Transfer Magnetic Tunnel Junction Fabricated with a Composite Tunneling Barrier Layer - A STT-RAM MTJ is disclosed with a composite tunnel barrier comprised of a CoMgO layer that contacts a pinned layer and a MgO layer which contacts a free layer. A CoMg layer with a Co content between 20 and 40 atomic % is deposited on the pinned layer and is then oxidized to produce Co nanoconstrictions within a MgO insulator matrix. The nanoconstrictions control electromigration of Co into an adjoining MgO layer. The free layer may comprise a nanocurrent channel (NCC) layer such as FeSiO or a moment dilution layer such as Ta between two ferromagnetic layers. Furthermore, a second CoMgO layer or a CoMgO/MgO composite may serve as a perpendicular Hk enhancing layer formed between the free layer and a cap layer. One or both of the pinned layer and free layer may exhibit in-plane anisotropy or perpendicular magnetic anisotropy. | 07-11-2013 |
20130155550 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, and a thin-film coil are laminated on a substrate. The thin-film magnetic head has a shield magnetic layer. The shield magnetic layer has a leading shield part. The leading shield part is disposed on a substrate side of the main magnetic pole layer. The leading shield part has a variable distance structure in which a rearmost part most distanced from the medium-opposing surface is distanced more from the main magnetic pole layer than is a foremost part on the main magnetic pole layer side. | 06-20-2013 |
20130148485 | Planar Plasmon Generator with a Scalable Feature for TAMR - A TAMR (Thermal Assisted Magnetic Recording) write head uses the energy of optical-laser excited surface plasmons in a scalable planar plasmon generator to locally heat a magnetic recording medium and reduce its coercivity and magnetic anisotropy. The planar plasmon generator is formed as a multi-layered structure in which one planar layer supports a propagating surface plasmon mode that is excited by evanescent coupling to an optical mode in an adjacent waveguide. A peg, which can be a free-standing element or an integral projection from one of the layers, is positioned between the ABS end of the generator and the surface of the recording medium, confines and concentrates the near field of the plasmon mode immediately around and beneath it. | 06-13-2013 |
20130140268 | Heat Assisted Narrow Pole Design with Trailing Shield - A TAMR (Thermally Assisted Magnetic Recording) write head is formed with a narrow pole tip, a trailing edge magnetic shield and, optionally, a plasmon shield. The narrow pole tipped write head uses the energy of laser generated edge plasmons, formed in a plasmon generating layer, to locally heat a PMR magnetic recording medium slightly below its Curie temperature, Tc. When combined with the effects of the narrow tip, this local heating to a temperature below Tc is sufficient to create good transitions and narrow track widths in the magnetic medium. The write head is capable of writing effectively on state-of-the-art PMR recording media having Hk of 20 kOe or more. | 06-06-2013 |
20130107681 | PLASMON GENERATOR INCLUDING TWO PORTIONS MADE OF DIFFERENT METALS | 05-02-2013 |
20130100555 | METHOD OF MANUFACTURING THE THIN-FILM MAGNETIC HEAD, THE THIN-FILM MAGNETIC HEAD, HEAD GIMBAL ASSEMBLY AND HARD DISK DRIVE - A thin-film magnetic head is constructed such that a main magnetic pole layer, a lower shield layer, an upper shield layer and a thin-film coil are laminated on a substrate. A method of manufacturing the thin-film magnetic head has a lower shield layer forming step. This step comprises a step of forming a first lower shield part in a lower shield planned area, including a planned line along the medium-opposing surface, a step of forming a partial lower seed layer having a partial arrangement structure in which the partial lower seed layer is arranged on a lower formation zone except a lower exception zone including the planned line, a step of forming a second lower shield part on the partial lower seed layer. | 04-25-2013 |
20130089675 | CPP Device with Improved Current Confining Structure and Process - Plasma nitridation, in place of plasma oxidation, is used for the formation of a CCP layer. Al, Mg, Hf, etc. all form insulating nitrides under these conditions. Maintaining the structure at a temperature of at least 150° C. during plasma nitridation and/or performing post annealing at a temperature of 220° C. or higher, ensures that no copper nitride can form. Additionally, unintended oxidation by molecular oxygen of the exposed magnetic layers (mainly the pinned and free layers) is also avoided | 04-11-2013 |
20130088797 | CPP Device with Improved Current Confining Structure and Process - Plasma nitridation, in place of plasma oxidation, is used for the formation of a CCP layer. Al, Mg, Hf, etc. all form insulating nitrides under these conditions. Maintaining the structure at a temperature of at least 150° C. during plasma nitridation and/or performing post annealing at a temperature of 220° C. or higher, ensures that no copper nitride can form. Additionally, unintended oxidation by molecular oxygen of the exposed magnetic layers (mainly the pinned and free layers) is also avoided | 04-11-2013 |
20130084452 | Very thin high coercivity film and process for making it - High Hc (>4,000 Oe) and high Hk (>1 Tesla) has been achieved in FePt films as thin as 70 Angstroms. This was accomplished by starting with a relatively thick film having the required high coercivity, coating it with a suitable material such as Ta, and then using ion beam etching to remove surface material until the desired thickness was reached. | 04-04-2013 |
20130075935 | COMPOSITE LAYERED CHIP PACKAGE - A composite layered chip package includes first and second subpackages that are stacked. Each subpackage includes a main body and wiring. The main body includes: a main part having a top surface and a bottom surface; first terminals disposed on the top surface of the main part; and second terminals disposed on the bottom surface of the main part. The first and second terminals are electrically connected to the wiring. The first and second subpackages are arranged in a specific relative positional relationship, different from a reference relative positional relationship, with each other. | 03-28-2013 |
20130068722 | METHOD OF MANUFACTURING PLASMON GENERATOR - A method of manufacturing the plasmon generator includes the steps of: forming a base part made of a dielectric material; forming a metal film that is to later become the plasmon generator; and forming a filler layer made of a dielectric material. The base part includes a base surface and a protruding part that protrudes from the base surface. The protruding part has a top surface that is different in level from the base surface, and a first sidewall connecting the top surface of the protruding part to the base surface. The metal film includes an adhesion part adhering to the first sidewall. The filler layer has a second sidewall disposed such that the adhesion part is interposed between the first sidewall and the second sidewall. | 03-21-2013 |
20130057987 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, and a thin-film coil are laminated on a substrate. The thin-film magnetic head has a leading shield part opposing the main magnetic pole layer on the substrate side of the main magnetic pole layer. The thin-film magnetic head has a substrate side coil layer disposed between the main magnetic pole layer and the substrate. In the thin-film magnetic head, a space between a lower end face of the leading shield part and the substrate and a space between an upper end face in the substrate side coil layer and the substrate are formed equal to each other. | 03-07-2013 |
20130038966 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDINGHAVING A MAIN POLE, A SHIELD AND A COIL CORE PART SETBACK AWAY FROM THE MEDIUM FACING SURFACE A SPECIFIED DISTANCE - A magnetic head includes: a main pole; a coil; a first shield having an end face that is located in a medium facing surface at a position forward of an end face of the main pole along a direction of travel of a recording medium; and a first return path section disposed forward of the main pole along the direction of travel of the recording medium. The first return path section connects part of the main pole away from the medium facing surface to the first shield so that a first space is defined. The coil includes a first portion having a planar spiral shape and wound around a core part of the first return path section. The first portion includes first and second coil elements that each extend through the first space. No part of the coil other than the first and second coil elements exists in the first space. | 02-14-2013 |
20130029182 | CoFe/Ni Multilayer Film with Perpendicular Anisotropy for Microwave Assisted Magnetic Recording - A spin transfer oscillator with a seed/SIL/spacer/FGL/capping configuration is disclosed with a composite seed layer made of Ta and a metal layer having a fcc(111) or hcp(001) texture to enhance perpendicular magnetic anisotropy (PMA) in an overlying (A1/A2) | 01-31-2013 |
20130029035 | CoFe/Ni Multilayer Film with Perpendicular Anisotropy for Microwave Assisted Magnetic Recording - A spin transfer oscillator with a seed/SIL/spacer/FGL/capping configuration is disclosed with a composite seed layer made of Ta and a metal layer having a fcc(111) or hcp(001) texture to enhance perpendicular magnetic anisotropy (PMA) in an overlying (A1/A2) | 01-31-2013 |
20130027809 | HIGH DATA RATE MAGNETIC WRITER DESIGN - A high speed magnetic data writer containing a stitched pole tip that works in conjunction with the main pole is disclosed, together with a process for their manufacture. The material composition of each of these two sub-structures is slightly different; one sub-structure is optimized for high magnetic damping while the other sub-structure is optimized for high saturation magnetization. | 01-31-2013 |
20130020723 | COMPOSITE LAYERED CHIP PACKAGE - A composite layered chip package includes a plurality of subpackages stacked on each other. Each subpackage includes a main body and wiring. The main body includes a main part including a plurality of layer portions, and further includes first terminals and second terminals that are disposed on top and bottom surfaces of the main part, respectively. The wiring is electrically connected to the first and second terminals. The number of the plurality of layer portions included in the main part is the same for all the plurality of subpackages, and the plurality of layer portions in every subpackage include at least one first-type layer portion. In each of at least two of the subpackages, the plurality of layer portions further include at least one second-type layer portion. The first-type layer portion includes a semiconductor chip connected to the wiring, whereas the second-type layer portion includes a semiconductor chip not connected to the wiring. | 01-24-2013 |
20130003226 | PMR Writer Device with Multi-Level Tapered Write Pole - A perpendicular magnetic recording (PMR) head is fabricated with a multi-level tapered write pole. The write pole comprises a main pole with a tapered tip on a leading edge or a trailing edge, on which is formed at least one yoke that has a tapered edge. The edge of the yoke is recessed from the ABS of the main pole, giving the head a stepped profile. The yoke can be a single yoke formed on one side of the main pole or it can be two yokes formed on both the leading and trailing sides of the main pole. The write pole structure creates an efficient channeling of magnetic flux to the ABS surface of the pole tip which produces magnetic recording field at high area densities. | 01-03-2013 |
20130001190 | Method of Forming a PMR Writer Device with Multi-Level Tapered Write Pole - A perpendicular magnetic recording (PMR) head is fabricated with a multi-level tapered write pole which creates an efficient channeling of magnetic flux to the pole tip. The write pole comprises a main pole with a tapered tip on which is formed at least one yoke that has a tapered edge. The edge of the yoke is recessed from the ABS of the tapered tip, giving the write pole a stepped profile. The tapered tip can be two sloped surfaces that are symmetric about a mid plane of the main pole or a single sloped edge on the leading side or the trailing side of the pole. The yoke structure can consist of a single yoke formed on one side of the main pole or it can consist of two yokes formed symmetrically on both the leading and trailing sides of the main pole. | 01-03-2013 |
20130001189 | TMR Device with Novel Free Layer Structure - A composite free layer having a FL | 01-03-2013 |
20120315716 | TAPER-ETCHING METHOD AND METHOD OF MANUFACTURING NEAR-FIELD LIGHT GENERATOR - A method of taper-etching a layer to be etched that is made of SiO | 12-13-2012 |
20120314324 | Non-uniform write gap perpendicular writer for shingle writing - A PMR writer is disclosed that includes at least one of a recessed center section in the write pole trailing edge and a center recessed trailing shield to improve the field gradient at track edge. In all embodiments, there is a non-uniform write gap between the trailing edge and the trailing shield. The recessed portion of the write pole trailing edge and/or center recess of the trailing shield has a thickness from 10 to 40 nm in a down-track direction and a width in a cross-track direction of 20 to 200 nm. The distance between the center recess and a corner of the trailing edge is from 20 to 80 nm. A sequence of steps is provided to fabricate the two embodiments of the present invention. | 12-13-2012 |
20120314323 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDINGHAVING A MAIN POLE AND A SHIELD AND SPECIFICALLY STRUCTURED AND LOCATED COIL ELEMENTS AND MAGNETIC COUPLING LAYERS - A magnetic head includes a coil, a main pole, a gap part, a write shield, and a return path section. The return path section includes a yoke part and first and second coupling layers. The first coupling layer is connected to the write shield. The second coupling layer magnetically couples the first coupling layer to the yoke part, and has an end face facing toward a medium facing surface and located away from the medium facing surface. The coil includes a first coil element and a plurality of second coil elements that each extend to pass through a space defined by the main pole, the gap part, the write shield, and the return path section. The first coil element is disposed with the first coupling layer interposed between the medium facing surface and the first coil element. The second coil elements are disposed with the second coupling layer interposed between the medium facing surface and the second coil elements, and with the first coil element interposed between the main pole and the second coil elements. The second coil elements are aligned perpendicularly to the medium facing surface. | 12-13-2012 |
20120313260 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body and wiring. The main body includes: a main part having a top surface and a bottom surface and including three or more layer portions stacked on one another; a plurality of first terminals disposed on the top surface of the main part; and a plurality of second terminals disposed on the bottom surface of the main part. Each layer portion includes a semiconductor chip having first and second surfaces, and a plurality of electrodes electrically connected to the wiring. The plurality of electrodes are disposed on a side of the first surface of the semiconductor chip. A first layer portion located closest to the top surface of the main part and a second layer portion located closest to the bottom surface of the main part are arranged so that the second surfaces of their respective semiconductor chips face toward each other. The plurality of first terminals are formed by using the plurality of electrodes of the first layer portion. The plurality of second terminals are formed by using the plurality of electrodes of the second layer portion. | 12-13-2012 |
20120313259 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body and wiring. The main body has a main part. The main part has a top surface and a bottom surface and includes a plurality of layer portions that are stacked. The wiring includes a plurality of lines passing through all the plurality of layer portions. Each layer portion includes a semiconductor chip and a plurality of electrodes. The semiconductor chip has a first surface, and a second surface opposite thereto. The plurality of electrodes are disposed on a side of the first surface of the semiconductor chip. The plurality of layer portions include two or more pairs of first and second layer portions in each of which the first and second layer portions are arranged so that the first or second surfaces of the respective semiconductor chips face each other. The plurality of electrodes include a plurality of first connection parts and a plurality of second connection parts. In the first layer portion, the plurality of first connection parts are in contact with the plurality of lines. In the second layer portion, the plurality of second connection parts are in contact with the plurality of lines. | 12-13-2012 |
20120292287 | METHOD OF FORMING MAIN POLE OF THERMALLY-ASSISTED MAGNETIC RECORDING HEAD - In a method of forming a main pole, an initial accommodation layer is etched by RIE using a first etching mask having a first opening, whereby a groove is formed in the initial accommodation layer. Next, a part of the initial accommodation layer including the groove is etched by RIE using a second etching mask having a second opening, so that the groove becomes an accommodation part. The main pole is then formed in the accommodation part. The first etching mask has first and second sidewalls that face the first opening and are opposed to each other at a first distance in a track width direction. The second etching mask has third and fourth sidewalls that face the second opening and are opposed to each other at a second distance greater than the first distance. | 11-22-2012 |
20120282492 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, and a thin-film coil are laminated on a substrate. The thin-film magnetic head includes a return magnetic pole layer and a connecting magnetic layer. The return magnetic pole layer is formed at a position distanced from the medium-opposing surface on the side opposite to the write shield layer with the main magnetic pole layer intervening therebetween. The connecting magnetic layer is formed using a magnetic material so as to connect the return magnetic pole layer to the write shield layer on the side closer to the medium-opposing surface than is the thin-film coil. The thin-film coil is wound as a flat spiral around the write shield layer. A part of the thin-film coil wound as the flat spiral is disposed only at a position distanced from the substrate than is the main magnetic pole layer. | 11-08-2012 |
20120281313 | Perpendicular Shield Pole Writer with Tapered Main Pole and Tapered Non-Magnetic Top Shaping Layer - A PMR writer with a tapered main pole layer and tapered non-magnetic top-shaping layer is disclosed that minimizes trailing shield saturation. A second non-magnetic top shaping layer may be employed to reduce the effective TH size while the bulk of the trailing shield is thicker to allow a larger process window for back end processing. A sloped surface with one end at the ABS and a second end 0.05 to 0.3 microns from the ABS is formed at a 10 to 80 degree angle to the ABS and includes a sloped surface on the upper portion of the main pole layer and on the non-magnetic top shaping layer. An end is formed on the second non-magnetic top shaping layer at the second end of the sloped surface followed by forming a conformal write gap layer and then depositing the trailing shield on the write gap layer and along the ABS. | 11-08-2012 |
20120279051 | Method of Forming a Plasmon Antenna with Magnetic Core for Thermally Assisted Magnetic Recording - A method of forming a TAMR (Thermal Assisted Magnetic Recording) write head that uses the energy of optical-laser generated edge plasmons in a plasmon antenna to locally heat a magnetic recording medium and reduce its coercivity and magnetic anisotropy. The method incorporates forming a magnetic core within the plasmon antenna, so the antenna effectively becomes an extension of the magnetic pole and produces a magnetic field whose maximum gradient overlaps the region being heated by the edge plasmons generated in the conducting layer of the antenna surrounding the antenna's magnetic core. | 11-08-2012 |
20120269048 | METHOD OF MANUFACTURING HEAT-ASSISTED MAGNETIC RECORDING HEAD WITH INTERNAL MIRROR - A manufacturing method for a heat-assisted magnetic recording head includes the step of forming an internal mirror that includes a reflecting film support body and a reflecting film. The reflecting film support body includes first and second inclined surfaces. The reflecting film includes first and second portions that are located on the first and second inclined surfaces, respectively. The step of forming the internal mirror includes the step of forming the reflecting film support body and the step of forming the reflecting film. The step of forming the reflecting film support body forms an initial support body, and performs two taper-etching processes on the initial support body so that the initial support body is provided with the first and second inclined surfaces. | 10-25-2012 |
20120262825 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, and a thin-film coil are laminated on a substrate. The write shield layer has an opposing shield part opposing the main magnetic pole layer and a front shield part. The front shield part is connected to the opposing shield part without straddling the thin-film coil. Besides, the front shield part has a shield front end face disposed in the medium-opposing surface and a shield upper end face formed distanced from the medium-opposing surface. Further, the front shield part has a shield connecting part. The shield front end face is connected to the shield upper end face by the shield connecting part. | 10-18-2012 |
20120257304 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A MAIN POLE AND A SHIELD - A magnetic head includes a coil, a main pole, a write shield, and first and second yoke layers. The first and second yoke layers are magnetically connected to the write shield and aligned along the direction of travel of a recording medium such that the main pole is interposed therebetween. The coil includes a winding portion of planar spiral shape that is formed in one or more layers. The magnetic head further includes: a first coupling part located away from the medium facing surface and magnetically coupling the main pole and the second yoke layer to each other; and a second coupling part located away from the medium facing surface and magnetically coupling the first yoke layer and the second yoke layer to each other without touching the main pole. The winding portion is wound around the first coupling part, and a part of the winding portion passes between the first and second coupling parts. | 10-11-2012 |
20120256321 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body and wiring. The main body includes a main part including a plurality of stacked layer portions, and a plurality of terminals disposed on the top and bottom surfaces of the main part. The wiring includes a plurality of lines electrically connected to the plurality of terminals. The plurality of lines include a plurality of common lines and a plurality of layer-dependent lines. Each of the plurality of layer portions includes: a plurality of common electrodes electrically connected to the plurality of common lines; a plurality of non-contact electrodes that are electrically connected to the layer-dependent lines and are not in contact with the semiconductor chip in the layer portion; and a selective connection electrode selectively electrically connected to only the layer-dependent line that the layer portion uses among the plurality of layer-dependent lines. The layer-dependent lines are greater than the common lines in maximum width. | 10-11-2012 |
20120235258 | TMR Device with Improved MgO Barrier - A method of forming a high performance magnetic tunnel junction (MTJ) is disclosed wherein the tunnel barrier includes at least three metal oxide layers. The tunnel barrier stack is partially built by depositing a first metal layer, performing a natural oxidation (NOX) process, depositing a second metal layer, and performing a second NOX process to give a M | 09-20-2012 |
20120229932 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING - A magnetic layer for writing incorporates: a pole layer having an end face located in a medium facing surface and a lower yoke layer. A first magnetic layer for flux concentration is connected to the lower yoke layer at a location away from the medium facing surface, and passes a magnetic flux corresponding to a magnetic field generated by a first coil. A second magnetic layer for flux concentration is connected to the pole layer at a location away from the medium facing surface, and passes a magnetic flux corresponding to a magnetic field generated by a second coil. A nonmagnetic layer is disposed between the pole layer and the lower yoke layer. The lower yoke layer is connected to the pole layer at a location closer to the medium facing surface than the nonmagnetic layer. | 09-13-2012 |
20120225321 | Electrodeposition of FeCoNiV Films with High Resistivity and High Saturation Magnetization - A magnetic layer that may serve as a top pole layer and bottom pole layer in a magnetic write head is disclosed. The magnetic layer has a composition represented by Fe | 09-06-2012 |
20120218663 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING THAT INCLUDES A SENSOR FOR DETECTING CONTACT WITH A RECORDING MEDIUM - A magnetic head includes a main pole, a write shield, a return path section, a heater that generates heat for making part of a medium facing surface protrude, and a sensor that detects contact of the part of the medium facing surface with a recording medium. The return path section includes: a yoke layer located backward of the main pole along the direction of travel of the recording medium; a first coupling part coupling the yoke layer and the write shield to each other; and a second coupling part located away from the medium facing surface and coupling the yoke layer and the main pole to each other. The first coupling part has an end face facing toward the yoke layer. This end face includes a middle portion spaced from the yoke layer and facing the yoke layer, and two side portions located on opposite sides of the middle portion in a track width direction and in contact with the yoke layer. The sensor is located between the middle portion and the yoke layer. | 08-30-2012 |
20120218662 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING THAT INCLUDES A SENSOR FOR DETECTING CONTACT WITH A RECORDING MEDIUM - A magnetic head for perpendicular magnetic recording includes a read head unit, a write head unit disposed forward of the read head unit along the direction of travel of a recording medium, a heater that generates heat for causing the medium facing surface to protrude in part, an expansion layer that makes part of the medium facing surface protrude, and a sensor that detects contact of the part of the medium facing surface with the recording medium. The write head unit includes a main pole, a write shield, and a return path section. The return path section includes a yoke layer located backward of the main pole along the direction of travel of the recording medium, a first coupling part that couples the yoke layer and the write shield to each other, and a second coupling part that is located away from the medium facing surface and couples the yoke layer and the main pole to each other. | 08-30-2012 |
20120212855 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A POLE LAYER INCLUDING A PLURALITY OF STACKED MAGNETIC FILMS - A magnetic head includes a pole layer accommodated in a groove. The pole layer has a track width defining portion and a wide portion. The pole layer includes a plurality of magnetic films stacked. At least one of the plurality of magnetic films includes a first portion included in the track width defining portion, a second portion included in the wide portion, and a third portion coupling the first and second portions to each other. In a cross section passing through the center of the pole layer taken in the track width direction, the second portion is smaller than the first portion in thickness and the top surface of the third portion is inclined with respect to a direction perpendicular to a medium facing surface. | 08-23-2012 |
20120210566 | METHOD OF MANUFACTURING A MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING - A method of manufacturing a magnetic head includes the steps of: forming a pole-layer-encasing layer having a pole-layer-encasing section; and forming a pole layer in the pole-layer-encasing section. The pole layer includes a first layer, and a second layer formed thereon. The step of forming the pole layer includes the steps of: forming an initial first layer by physical vapor deposition; etching the surface of the initial first layer by dry etching so that the initial first layer becomes the first layer; and forming the second layer on the first layer. | 08-23-2012 |
20120193738 | TMR Device with Low Magnetorestriction Free Layer - A high performance TMR sensor is fabricated by employing a free layer with a trilayer configurations represented by FeCo/CoFeB/CoB, FeCo/CoB/CoFeB, FeCo/CoFe/CoB, or FeCo/FeB/CoB may also be employed. Alternatively, CoNiFeB or CoNiFeBM formed by co-sputtering CoB with CoNiFe or CoNiFeM, respectively, where M is V, Ti, Zr, Nb, Hf, Ta, or Mo may be included in a composite free layer or as a single free layer in the case of CoNiFeBM. A 15 to 30% in improvement in TMR ratio over a conventional CoFe/NiFe free layer is achieved while maintaining low Hc and RA <3 ohm-um | 08-02-2012 |
20120188666 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A MAIN POLE AND A SHIELD - A magnetic head includes: a main pole; a coil; a first shield with an end face located in a medium facing surface at a position forward of an end face of the main pole along a direction of travel of a recording medium; a gap part including a portion located between the main pole and the first shield; and a first return path section disposed forward of the main pole along the direction of travel of the recording medium. The first return path section connects the first shield and the main pole to each other so that a first space is defined by the main pole, the gap part, the first shield, and the first return path section. The coil includes a plurality of first coil elements extending to pass through the first space and aligned in a row in the direction of travel of the recording medium. | 07-26-2012 |
20120187575 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME - A layered chip package includes a main body and wiring. The main body includes a main part including a plurality of stacked layer portions, and a plurality of terminals disposed on the top and bottom surfaces of the main part. The wiring includes a plurality of lines electrically connected to the plurality of terminals. The plurality of lines include a plurality of common lines and a plurality of layer-dependent lines. Each of the plurality of layer portions includes a plurality of common electrodes electrically connected to the plurality of common lines, and a selective connection electrode selectively electrically connected to only the layer-dependent line that the layer portion uses among the plurality of layer-dependent lines. The selective connection electrode varies in shape depending on which of the layer-dependent lines it is electrically connected to. | 07-26-2012 |
20120187574 | MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME - A memory device has a laminated chip package and a controller plate. In the laminated chip package, a plurality of memory chips are laminated. An interposed chip is laminated between the laminated chip package and the controller plate. A plurality of opposing wiring electrodes are formed at an opposing surface of the controller plate. A plurality of outside wiring electrodes are formed on the rear side of the opposing surface. Connection electrodes connecting the opposing wiring electrodes and the outside wiring electrodes are formed on the side surface of the controller plate. The interposed chip has a plurality of interposed wiring electrodes. The plurality of interposed wiring electrodes are formed with a common arrangement pattern common with an arrangement pattern of the plurality of opposing wiring electrodes. The controller plate is laid on the interposed chip. | 07-26-2012 |
20120170156 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A MAIN POLE AND TWO SHIELDS - A magnetic head includes: a coil; a main pole; a first shield disposed backward of the main pole along a direction of travel of a recording medium; a first return path section connecting the first shield to the main pole; a second shield disposed forward of the main pole along the direction of travel of the recording medium; and a second return path section connecting the second shield to the main pole. An interface between the first return path section and the main pole has an end closest to a medium facing surface, and an interface between the second return path section and the main pole has an end closest to the medium facing surface, the latter being closer to the medium facing surface than the former. The second return path section includes a yoke layer located away from the medium facing surface and in contact with the main pole. The coil includes at least one coil element that passes between the second shield and the yoke layer. | 07-05-2012 |
20120170154 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, and a thin-film coil are laminated on a substrate. The thin-film coil has a coil-layer. The coil-layer has a turn part arranged closer to an ABS than is a rear end part of the main magnetic pole layer farthest from the ABS. Regarding a substrate side coil-layer, arranged between the main magnetic pole layer and the substrate, of the coil-layer, a thickness of a non-corresponding magnetic pole part other than a magnetic pole corresponding part corresponding to an arrangement space of the main magnetic pole layer is larger than a thickness of the magnetic pole corresponding part. | 07-05-2012 |
20120149123 | Low Temperature Method to Enhance Detection of Magnetic Beads - Detection of magnetic beads at temperature below room temperature can increase the signal level significantly as compared to the same detection when performed at room temperature. Additional improvement is obtained if the beads are below 30 nm in size and if deviations of bead size from the median are small. A preferred format for the beads is a suspension of super-paramagnetic particles in a non-magnetic medium. | 06-14-2012 |
20120147501 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING WITH SHIELD AROUND MAIN POLE - A magnetic head includes a shield, and first and second return path sections. The shield has an end face that is located in a medium facing surface to wrap around an end face of a main pole. The shield includes a bottom shield, two side shields, and a top shield. The first return path section includes a yoke layer, and first and second coupling layers that magnetically couple the bottom shield and the yoke layer to each other. The first coupling layer is magnetically connected to the bottom shield. The second coupling layer magnetically couples the first coupling layer to the yoke layer. No end faces of the second coupling layer are exposed in the medium facing surface. The second return path section magnetically couples the top shield and the main pole to each other. | 06-14-2012 |
20120147500 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A TAPERED MAIN POLE - A bottom end of a main pole includes first, second, and third portions that are contiguously arranged in order of increasing distance from the medium facing surface. A top surface of the main pole includes fourth, fifth, and sixth portions that are contiguously arranged in order of increasing distance from the medium facing surface. A distance from the top surface of the substrate to any given point on each of the first and second portions decreases with increasing distance from the given point to the medium facing surface. The second portion has an angle of inclination greater than that of the first portion with respect to a direction perpendicular to the medium facing surface. A distance from the top surface of the substrate to any given point on each of the fourth and fifth portions increases with increasing distance from the given point to the medium facing surface. The fifth portion has an angle of inclination greater than that of the fourth portion with respect to the direction perpendicular to the medium facing surface. | 06-14-2012 |
20120147499 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING WITH SHIELD AROUND MAIN POLE - A magnetic head includes a shield, and first and second return path sections. The shield has an end face that is located in a medium facing surface to wrap around an end face of a main pole. The shield includes a bottom shield, two side shields, and a top shield. The first return path section is magnetically connected to the bottom shield and is greater than the bottom shield in length in a direction perpendicular to the medium facing surface. The second return path section magnetically couples the top shield and the main pole to each other. The coil includes a first portion that passes through a space defined by the main pole and the first return path section, and a second portion that passes through a space defined by the main pole and the second return path section. | 06-14-2012 |
20120145551 | Electroplated Magnetic Film for Read-Write Applications - A process is described for the fabrication, through electrodeposition, of Fe | 06-14-2012 |
20120142146 | METHOD OF MANUFACTURING LAYERED CHIP PACKAGE - A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes a plurality of stacked layer portions. A method of manufacturing the layered chip package includes the step of fabricating a layered substructure and the step of cutting the layered substructure. The layered substructure includes: a plurality of arrayed pre-separation main bodies; a plurality of accommodation parts disposed between two adjacent pre-separation main bodies; and a plurality of preliminary wires accommodated in the accommodation parts. The accommodation parts are formed in a photosensitive resin layer by photolithography. In the step of cutting the layered substructure, the plurality of pre-separation main bodies are separated from each other, and the wires are formed by the preliminary wires. | 06-07-2012 |
20120140358 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING WITH SHIELD AROUND MAIN MAGNETIC POLE - A magnetic head includes a main magnetic pole, a shield having an end face located in a medium facing surface to wrap around an end face of the main magnetic pole, and a gap part provided between the main magnetic pole and the shield. The shield includes a bottom shield, two side shields, and a top shield. The gap part includes first and second gap layers. In a manufacturing method of the magnetic head, a mold is formed on the top surface of the bottom shield, the mold having a shape determined by photolithography and being intended to be removed later. Next, the two side shields are formed on the top surface of the bottom shield by performing plating without forming a seed layer. Next, the mold is removed and then the first gap layer, the main magnetic pole, the second gap layer, and the top shield are formed in succession. | 06-07-2012 |
20120137507 | Write Head Having Recessed Magnetic Material In Gap Region - As track densities increase, it becomes increasingly important, while writing in a given track, not to inadvertently write data in adjoining tracks. This problem has been overcome by limiting the width of material in the ABS plane to what it is at the write gap. The part of the lower pole that is wider than this is recessed back away from the ABS, thereby greatly reducing its magnetic influence on adjacent tracks. Four different embodiments of write heads that incorporate this notion are described together with a description of a general process for their manufacture. | 06-07-2012 |
20120134052 | Write Head Having Recessed Magnetic Material In Gap Region - As track densities increase, it becomes increasingly important, while writing in a given track, not to inadvertently write data in adjoining tracks. This problem has been overcome by limiting the width of material in the ABS plane to what it is at the write gap. The part of the lower pole that is wider than this is recessed back away from the ABS, thereby greatly reducing its magnetic influence on adjacent tracks. Four different embodiments of write heads that incorporate this notion are described together with a description of a general process for their manufacture. | 05-31-2012 |
20120134051 | Write Head Having Recessed Magnetic Material In Gap Region - As track densities increase, it becomes increasingly important, while writing in a given track, not to inadvertently write data in adjoining tracks. This problem has been overcome by limiting the width of material in the ABS plane to what it is at the write gap. The part of the lower pole that is wider than this is recessed back away from the ABS, thereby greatly reducing its magnetic influence on adjacent tracks. Four different embodiments of write heads that incorporate this notion are described together with a description of a general process for their manufacture. | 05-31-2012 |
20120134050 | Write Head Having Recessed Magnetic Material In Gap Region - As track densities increase, it becomes increasingly important, while writing in a given track, not to inadvertently write data in adjoining tracks. This problem has been overcome by limiting the width of material in the ABS plane to what it is at the write gap. The part of the lower pole that is wider than this is recessed back away from the ABS, thereby greatly reducing its magnetic influence on adjacent tracks. Four different embodiments of write heads that incorporate this notion are described together with a description of a general process for their manufacture. | 05-31-2012 |
20120126427 | MEMORY DEVICE, LAMINATED SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A memory device has a laminated chip package and a controller chip. In the laminated chip package, a plurality of memory chips are laminated. An interposed chip is laminated between the laminated chip package and the controller chip. The memory chips have a plurality of first wiring electrodes. The interposed chip has a plurality of second wiring electrodes. The second wiring electrodes are formed with a common arrangement pattern common with an arrangement pattern of a plurality of wiring electrodes for controller which are formed in the controller chip. The controller chip is laid on the interposed chip. | 05-24-2012 |
20120087217 | THERMALLY ASSISTED MAGNETIC HEAD, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thermally assisted magnetic head is formed by performing a head forming process, a mounting part forming process and a light source mounting process in that order. In the head forming process, a planned area is secured on a light source placing surface of a slider substrate, then a magnetic head part is formed on a head area other than the planned area and a spacer for securing a mounting space for the laser diode is formed on the planned area. In the mounting part forming process, a light source mounting part is formed by removing the spacer. In the light source mounting process, a laser diode is mounted on the light source mounting part formed by the mounting part forming step. | 04-12-2012 |
20120086130 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body. The main body includes a main part, and further includes first terminals and second terminals disposed on the top and bottom surfaces of the main part, respectively. The main part includes first and second layer portions, and through electrodes penetrating them. The through electrodes are electrically connected to the first and second terminals. Each of the layer portions includes a semiconductor chip having a first surface and a second surface opposite thereto, and further includes surface electrodes. The surface electrodes are disposed on a side of the semiconductor chip opposite to the second surface. The first and second layer portions are bonded to each other such that the respective second surfaces face each other. The first terminals are formed by using the surface electrodes of the first layer portion. The second terminals are formed by using the surface electrodes of the second layer portion. | 04-12-2012 |
20120080782 | METHOD OF MANUFACTURING LAYERED CHIP PACKAGE - A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes: a main part including first and second layer portions; and a plurality of first and second terminals that are disposed on the top and bottom surfaces of the main part, respectively, and are electrically connected to the plurality of wires. The first and second terminals are formed by using electrodes of the first and second layer portions. The layered chip package is manufactured by fabricating a layered substructure by stacking two substructures each of which includes an array of a plurality of preliminary layer portions, and then cutting the layered substructure. The layered substructure includes a plurality of preliminary wires that are disposed between two adjacent pre-separation main bodies and are to become the plurality of wires. | 04-05-2012 |
20120056333 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes: a main part including first and second layer portions; and a plurality of first and second terminals that are disposed on the top and bottom surfaces of the main part, respectively, and are electrically connected to the plurality of wires. Each layer portion includes a semiconductor chip having a first surface and a second surface opposite thereto, and includes a plurality of electrodes. The electrodes are disposed on a side of the semiconductor chip opposite to the second surface. The first and second layer portions are bonded to each other such that the respective second surfaces face each other. The first terminals are formed by using the electrodes of the first layer portion, and the second terminals are formed by using the electrodes of the second layer portion. | 03-08-2012 |
20120032318 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes: a main part including a plurality of layer portions; a plurality of first terminals disposed on the top surface of the main part and connected to the wiring; and a plurality of second terminals disposed on the bottom surface of the main part and connected to the wiring. Each layer portion includes a semiconductor chip. The plurality of second terminals are positioned to overlap the plurality of first terminals as viewed in a direction perpendicular to the top surface of the main body. A plurality of pairs of first and second terminals that are electrically connected via the wires include a plurality of pairs of a first terminal and a second terminal that are positioned not to overlap each other. | 02-09-2012 |
20120025355 | LAMINATED SEMICONDUCTOR SUBSTRATE, LAMINATED CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME - In a laminated semiconductor substrate, a plurality of semiconductor substrates are laminated. Each of the semiconductor substrate has a plurality of scribe-groove parts formed along scribe lines. Further, each of the semiconductor substrate has a plurality of device regions insulated from each other and has a semiconductor device formed therein. Further, an uppermost substrate and a lowermost substrate have electromagnetic shielding layer formed in regions other than the scribe-groove parts using a ferromagnetic body. Further, in the laminated semiconductor substrate, a through hole which penetrates the plurality of semiconductor substrates laminated in a laminated direction is formed in the scribe-groove part, and the laminated semiconductor substrate has a through electrode penetrating the plurality of semiconductor substrates through the through hole. | 02-02-2012 |
20120025354 | LAMINATED SEMICONDUCTOR SUBSTRATE, LAMINATED CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME - In a laminated semiconductor substrate, a plurality of semiconductor substrates are laminated. Each of the semiconductor substrate has a plurality of scribe-groove parts formed along scribe lines. Further, each of the semiconductor substrate has a plurality of device regions insulated from each other and has a semiconductor device formed therein. Further, an uppermost substrate and a lowermost substrate have an electromagnetic shielding layer formed using a ferromagnetic body. The electromagnetic shielding layer is formed in a shielding region except the extending zone. The extending zone is set a part which the wiring electrode crosses, in a peripheral edge part of the device region. | 02-02-2012 |
20120013025 | Layered Chip Package and Method of Manufacturing Same - A layered chip package includes a main body and wiring, the wiring including a plurality of wires disposed on a side surface of the main body. The main body includes a main part and a plurality of terminals. The main part includes a plurality of layer portions stacked. The terminals are disposed on at least either one of the top and bottom surfaces of the main part and electrically connected to the wires. Each of the layer portions includes a semiconductor chip. The plurality of wires include a plurality of common wires and a plurality of layer-dependent wires. In at least one of the layer portions, the semiconductor chip is electrically connected to the plurality of common wires and is selectively electrically connected to only the layer-dependent wire that the layer portion uses, among the plurality of layer-dependent wires. | 01-19-2012 |
20120013024 | Layered Chip Package and Method of Manufacturing Same - A layered chip package includes a main body and wiring, the wiring including a plurality of wires disposed on a side surface of the main body. The main body includes a main part and a plurality of terminals. The main part includes a plurality of layer portions stacked. The terminals are disposed on at least either one of the top and bottom surfaces of the main part and electrically connected to the wires. Each of the layer portions includes a semiconductor chip, and a plurality of electrodes that are electrically connected to the wires. The electrodes include a plurality of first electrodes that are intended to establish electrical connection to the semiconductor chip, and a plurality of second electrodes that are not in contact with the semiconductor chip. In at least one of the layer portions, the first electrodes are in contact with and electrically connected to the semiconductor chip. | 01-19-2012 |
20110316141 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body, and wiring disposed on a side surface of the main body. The main body includes: a main part including a plurality of layer portions stacked; a plurality of first terminals disposed on the top surface of the main part and connected to the wiring; and a plurality of second terminals disposed on the bottom surface of the main part and connected to the wiring. The plurality of layer portions include a first-type layer portion and a second-type layer portion. The first-type layer portion includes a conforming semiconductor chip, and a plurality of first-type electrodes that are connected to the semiconductor chip and the wiring. The second-type layer portion includes a defective semiconductor chip, and a plurality of second-type electrodes that are connected to the wiring and not to the semiconductor chip. | 12-29-2011 |
20110316123 | Laminated semiconductor substrate, laminated chip package and method of manufacturing the same - In a laminated semiconductor substrate, a plurality of semiconductor substrates are laminated. Each of the semiconductor substrate has a plurality of scribe-groove parts formed along scribe lines. Further, each of the semiconductor substrate has a plurality of device regions insulated from each other and has a semiconductor device formed therein, a first wiring electrode and a second wiring electrode extend to the inside of a interposed groove part from a first device region and a second device region respectively, and are separated from each other. In the laminated semiconductor substrate, a through hole which the first wiring electrode appears is formed. The laminated semiconductor substrate has a through electrode. The through electrode is contact with all of the first wiring electrodes appearing in the through hole. The laminated semiconductor substrate has a plurality of laminated chip regions. | 12-29-2011 |
20110303637 | METHOD OF MANUFACTURING NEAR-FIELD LIGHT GENERATOR INCLUDING WAVEGUIDE AND PLASMON GENERATOR - A near-field light generator includes: a waveguide; a clad layer having a penetrating opening and disposed on the waveguide; a plasmon generator accommodated in the opening; and a dielectric film interposed between the plasmon generator and each of the waveguide and the clad layer. In a method of manufacturing the near-field light generator, an initial clad layer is initially formed on the waveguide, and then the initial clad layer is taper-etched by RIE to form a recess that does not reach the top surface of the waveguide. Subsequently, the recess is etched by wet etching until the top surface of the waveguide is exposed in part. Next, the dielectric film is formed in the opening, and the plasmon generator is formed on the dielectric film. | 12-15-2011 |
20110266692 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body and a plurality of through electrodes. The main body includes a plurality of layer portions stacked and a plurality of through holes that penetrate all the plurality of layer portions. The plurality of through electrodes are provided in the plurality of through holes of the main body and penetrate all the plurality of layer portions. Each of the plurality of layer portions includes a semiconductor chip. At least one of the plurality of layer portions includes wiring that electrically connects the semiconductor chip to the plurality of through electrodes. The wiring includes a plurality of conductors that make contact with a through electrode that is exposed in the wall faces of any one of the plurality of through holes and passes through the through hole. | 11-03-2011 |
20110242703 | Thermally assisted magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive - A thermally assisted magnetic head includes a main magnetic pole layer, a near-field light generating layer having a generating end part generating near-field light arranged within a medium-opposing surface, and an optical waveguide guiding light to the near-field light generating layer. The thermally assisted magnetic head includes a base layer which a base groove part having a width gradually getting smaller along a depth direction and extending in an intersecting direction intersecting with the medium-opposing surface is formed. The near-field light generating layer has an in-groove generating layer formed inside of the base groove part. The in-groove generating layer is formed along an inner wall surface of the base groove part and has a thin-film like structure. | 10-06-2011 |
20110228653 | LIGHT SOURCE UNIT FOR THERMALLY-ASSISTED MAGNETIC RECORDING CAPABLE OF MONITORING OF LIGHT OUTPUT - Provided is a light source unit that is to be joined to a slider to form a thermally-assisted magnetic recording head. The light source unit comprises: a unit substrate having a source-installation surface; a light source provided in the source-installation surface and emitting thermal-assist light; and a photodetector bonded to a rear joining surface of the unit substrate in such a manner that a rear light-emission center of the light source is covered with a light-receiving surface of the photodetector. The photodetector can be sufficiently close to the light source; thus, constant feedback adjustment with high efficiency for the light output of the light source can be performed. This adjustment enables light output from the light source to be controlled in response to changes in light output due to surroundings and to changes with time to stabilize the intensity of light with which a magnetic recording medium is irradiated. | 09-22-2011 |
20110228650 | METHOD FOR MANUFACTURING THERMALLY-ASSISTED MAGNETIC RECORDING HEAD COMPRISING LIGHT SOURCE UNIT AND SLIDER - A method for manufacturing a thermally-assisted magnetic recording head is provided, in which a light source unit including a light source and a slider including an optical system are bonded. A unit substrate is made of a material transmitting light having a predetermined wavelength, and a unit adhesion material layer that contains Sn, Sn alloy, Pb alloy or Bi alloy is formed on the light source unit and/or the slider. The manufacturing method includes: aligning the light source unit and the slider in such a way that a light from the light source can enter the optical system and the unit adhesion material layer is sandwiched therebetween; and causing a light including the predetermined wavelength to enter the unit substrate to melt the unit adhesion material layer. The unit adhesion material layer melted by the light including the predetermined wavelength can ensure high alignment accuracy as well as higher bonding strength and less change with time. | 09-22-2011 |
20110228649 | METHOD FOR MANUFACTURING THERMALLY-ASSISTED MAGNETIC RECORDING HEAD COMPRISING LIGHT SOURCE UNIT AND SLIDER - A method for manufacturing a thermally-assisted magnetic recording head is provided, in which a light source unit including a light source and a slider including an optical system are bonded. A unit substrate is made of a material transmitting light having a predetermined wavelength, and an adhesion material layer is formed on the light source unit and/or the slider. The manufacturing method includes: aligning the light source unit and the slider in such a way that a light from the light source can enter the optical system and the adhesion material layer is sandwiched therebetween; irradiating the adhesion material layer with a light including the predetermined wavelength through the unit substrate; and bonding them. The adhesion material layer melted by the light including the predetermined wavelength and transmitted through the unit substrate can ensure high alignment accuracy as well as higher bonding strength and less change with time. | 09-22-2011 |
20110228418 | HEAT-ASSISTED MAGNETIC RECORDING HEAD WITH NEAR-FIELD LIGHT GENERATING ELEMENT - A near-field light generating element has an outer surface including a bottom surface that lies at an end closer to a top surface of a substrate, a waveguide facing surface that lies at an end farther from the top surface of the substrate and faces a waveguide, a front end face located in a medium facing surface, and a side surface that connects the bottom surface, the waveguide facing surface and the front end face to each other. The front end face includes a first side that lies at an end of the bottom surface, a tip that lies at an end farther from the top surface of the substrate and forms a near-field light generating part, a second side that connects an end of the first side to the tip, and a third side that connects the other end of the first side to the tip. The waveguide facing surface includes a width changing portion that has a width in a direction parallel to the bottom surface and the front end face, the width decreasing with decreasing distance to the front end face. | 09-22-2011 |
20110228417 | HEAT-ASSISTED MAGNETIC RECORDING HEAD WITH NEAR-FIELD LIGHT GENERATING ELEMENT - A near-field light generating element has an outer surface. The outer surface includes a bottom surface, first and second inclined surfaces, an edge part that connects the first and second inclined surfaces to each other, and a front end face located in a medium facing surface. The front end face includes a first side that lies at an end of the first inclined surface, a second side that lies at an end of the second inclined surface, and a tip that is formed by contact of the first and second sides with each other and forms a near-field light generating part. Each of the first side and the second side has a lower part and an upper part that are continuous with each other. An angle formed between the upper part of the first side and the upper part of the second side is smaller than that formed between the lower part of the first side and the lower part of the second side. | 09-22-2011 |
20110228416 | A METHOD OF MANUFACTURING A THERMALLY ASSISTED MAGNETIC HEAD - A thermally assisted magnetic head is formed by performing a head forming process, a mounting part forming process and a light source mounting process in that order. In the head forming process, a planned area is secured on a light source placing surface of a slider substrate, then a magnetic head part is formed on a head area other than the planned area and a spacer for securing a mounting space for the laser diode is formed on the planned area. In the mounting part forming process, a light source mounting part is formed by removing the spacer. In the light source mounting process, a laser diode is mounted on the light source mounting part formed by the mounting part forming step. | 09-22-2011 |
20110221073 | Layered chip package with wiring on the side surfaces - A layered chip package has a main body including pairs of layer portions, and wiring disposed on a side surface of the main body. Each layer portion includes a semiconductor chip. The pairs of layer portions include specific pairs of layer portions. Each of the specific pairs of layer portions includes a first-type layer portion and a second-type layer portion. The first-type layer portion includes electrodes each connected to the semiconductor chip and each having an end face located at the side surface of the main body on which the wiring is disposed, whereas the second-type layer portion does not include such electrodes. The specific pairs of layer portions are provided in an even number. | 09-15-2011 |
20110210095 | METHOD OF MANUFACTURING NEAR-FIELD LIGHT GENERATING ELEMENT AND METHOD OF MANUFACTURING HEAT-ASSISTED MAGNETIC RECORDING HEAD - A near-field light generating element has an outer surface including first and second inclined surfaces and an edge part that connects the first and second inclined surfaces to each other. In a method of manufacturing the near-field light generating element, a polishing stopper layer is initially formed on a metal layer, and the polishing stopper layer and the metal layer are etched so that the metal layer is provided with the first inclined surface. Next, a coating layer is formed to cover the metal layer and the polishing stopper layer. The coating layer is made of a non-metallic inorganic material that has an etching rate lower than that of the metal layer in a second etching step to be performed later. Next, the coating layer is polished until the polishing stopper layer is exposed. Next, the second etching step is performed to etch the polishing stopper layer and the metal layer using the coating layer as the etching mask. This provides the metal layer with the second inclined surface and the edge part, and thereby makes the metal layer into the near-field light generating element. | 09-01-2011 |
20110201137 | Method of manufacturing layered chip package - A method of manufacturing a layered chip package that includes a main body, and wiring disposed on a side surface of the main body. The main body includes a plurality of layer portions. The method includes fabricating a plurality of substructures, and completing the layered chip package by fabricating the main body using the plurality of substructures and by forming the wiring on the main body. Each substructure is fabricated through the steps of: fabricating a pre-substructure wafer including a plurality of pre-semiconductor-chip portions aligned; distinguishing between a normally functioning pre-semiconductor-chip portion and a malfunctioning pre-semiconductor-chip portion among the plurality of pre-semiconductor-chip portions included in the pre-substructure wafer; and forming electrodes connected to the normally functioning pre-semiconductor-chip portion and having respective end faces located in the side surface of the main body on which the wiring is disposed, without forming any electrode connected to the malfunctioning pre-semiconductor-chip portion. | 08-18-2011 |
20110189822 | METHOD OF MANUFACTURING LAYERED CHIP PACKAGE - A layered chip package includes a main body and wiring. The main body includes a plurality of layer portions stacked. The wiring is disposed on at least one side surface of the main body. In the method of manufacturing the layered chip package, first, a plurality of substructures each of which includes an array of a plurality of preliminary layer portions are used to fabricate a layered substructure that includes a plurality of pre-separation main bodies arranged in rows. Next, the layered substructure is cut into a plurality of blocks each of which includes a row of a plurality of pre-separation main bodies, and the wiring is formed on the plurality of pre-separation main bodies included in each block simultaneously. The plurality of pre-separation main bodies are then separated from each other. Each of the plurality of blocks includes a row of three, four, or five pre-separation main bodies. | 08-04-2011 |
20110189820 | METHOD OF MANUFACTURING LAYERED CHIP PACKAGE - In a method of manufacturing a layered chip package, a layered substructure is fabricated and used to produce a plurality of layered chip packages. The layered substructure includes first to fourth substructures stacked, each of the substructures including an array of a plurality of preliminary layer portions. In the step of fabricating the layered substructure, initially fabricated are first to fourth pre-polishing substructures each having first and second surfaces. Next, the first and second pre-polishing substructures are bonded to each other with the first surfaces facing each other, and then the second surface of the second pre-polishing substructure is polished to form a first stack. Similarly, the third and fourth pre-polishing substructures are bonded to each other and the second surface of the third pre-polishing substructure is polished to form a second stack. Then, the first and second stacks are bonded to each other. | 08-04-2011 |
20110188354 | HEAT-ASSISTED MAGNETIC RECORDING HEAD WITH CONVERGENT LENS - A heat-assisted magnetic recording head includes a magnetic pole, a waveguide that allows light to propagate therethrough, a near-field light generating element that generates near-field light based on the light propagating through the waveguide, a convergent lens, and a laser diode disposed above the waveguide. The convergent lens transmits light that is emitted from the laser diode, so that the light transmitted through the convergent lens is incident on the waveguide. | 08-04-2011 |
20110186985 | Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same - A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: a unit region in contact with at least any one of the plurality of groove portions; and a wiring electrode with a portion thereof arranged within the unit region. Further, the plurality of groove portions have a wide-port structure in which a wide width portion wider in width than a groove lower portion including a bottom portion is formed at an inlet port thereof. | 08-04-2011 |
20110180932 | METHOD OF MANUFACTURING LAYERED CHIP PACKAGE - A layered chip package includes a main body, and wiring including a plurality of wires disposed on a side surface of the main body. The main body includes a plurality of semiconductor chips stacked, and a plurality of electrodes that electrically connect the semiconductor chips to the wires. A method of manufacturing the layered chip package includes the steps of: fabricating a substructure that includes an array of a plurality of pre-separation main bodies and a plurality of holes for accommodating a plurality of preliminary wires, the holes being formed between two adjacent pre-separation main bodies; forming the preliminary wires in the plurality of holes by plating; and cutting the substructure so that the plurality of pre-separation main bodies are separated from each other and the preliminary wires are split into two sets of wires of two separate main bodies, whereby a plurality of layered chip packages are formed. | 07-28-2011 |
20110170216 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING - A magnetic layer for writing incorporates: a pole layer having an end face located in a medium facing surface; and an upper yoke layer. A first magnetic layer for flux concentration is connected to the pole layer at a location away from the medium facing surface, and passes a magnetic flux corresponding to a magnetic field generated by a first coil. A second magnetic layer for flux concentration is connected to the upper yoke layer at a location away from the medium facing surface, and passes a magnetic flux corresponding to a magnetic field generated by a second coil. A nonmagnetic layer is disposed between the pole layer and the upper yoke layer. The upper yoke layer is connected to the pole layer at a location closer to the medium facing surface than the nonmagnetic layer. | 07-14-2011 |
20110164333 | Thermally assisted magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive - A thermally assisted magnetic head includes a main magnetic pole layer, a near-field light generating layer having a generating end part generating near-field light arranged within a medium-opposing surface, and an optical waveguide guiding light to the near-field light generating layer. The near-field light generating layer has a near-field light generating part in a triangle shape with the generating end part being one vertex, and is formed in a triangle pole shape. The optical waveguide is formed to be opposed to a ridge part of the near-field light generating layer via an interposed layer. The main magnetic pole layer is formed to be opposed to the generating end part via the interposed layer. The thermally assisted magnetic head further includes a heat radiating layer in contact with an opposite side of the near-field light generating layer from the optical waveguide. | 07-07-2011 |
20110149426 | Heat-assisted magnetic recording head with internal mirror - A heat-assisted magnetic recording head has an internal mirror that includes a reflecting film support body and a reflecting film. The internal mirror reflects light that comes from above a waveguide so that the reflected light travels through the waveguide toward a medium facing surface. The reflecting film support body includes first and second inclined surfaces. The reflecting film includes first and second portions that are located on the first and second inclined surfaces, respectively. The step of forming the reflecting film support body includes two-taper etching operations to be performed on an initial support body. | 06-23-2011 |
20110147343 | Method of manufacturing magnetic head for perpendicular magnetic recording - A magnetic head includes: a pole layer including a track width defining portion and a wide portion; and an accommodation layer disposed on a bottom forming layer and having a groove that accommodates the pole layer. The groove includes a first portion for accommodating at least part of the track width defining portion, and a second portion for accommodating at least part of the wide portion. A manufacturing method for the magnetic head includes the steps of; forming a groove defining layer on a nonmagnetic layer that is intended to later become the accommodation layer; forming a mask that covers an area of the nonmagnetic layer where to form the first portion of the groove; etching the nonmagnetic layer so that the second portion of the groove is formed in the nonmagnetic layer; removing the mask; and taper-etching the nonmagnetic layer so that the first portion of the groove is formed in the nonmagnetic layer and the groove is thereby completed. | 06-23-2011 |
20110115079 | Wafter and substructure for use in manufacturing electronic component packages - A wafer for electronic component packages is used for manufacturing a plurality of electronic component packages, each of the plurality of electronic component packages including: a base incorporating a plurality of external connecting terminals; and at least one electronic component chip bonded to the base and electrically connected to the plurality of external connecting terminals. The wafer has a plurality of sets of external connecting terminals corresponding to the plurality of electronic component packages, a retainer for retaining the plurality of sets of external connecting terminals, and a coupling portion for coupling the plurality of sets of external connecting terminals to one another. The wafer includes a plurality of pre-base portions that will each be subjected to bonding of the at least one electronic component chip thereto and will be subjected to separation from one another later so that each of them will thereby become the base. | 05-19-2011 |
20110096443 | MTJ incorporating CoFe/Ni multilayer film with perpendicular magnetic anisotropy for MRAM application - A MTJ for a spintronic device is disclosed and includes a thin composite seed layer made of at least Ta and a metal layer having fcc(111) or hcp(001) texture as in Ta/Ti/Cu to enhance perpendicular magnetic anisotropy (PMA) in an overlying laminated layer with a (CoFe/Ni) | 04-28-2011 |
20110096435 | Heat-assisted magnetic recording head with laser diode fixed to slider - A heat-assisted magnetic recording head includes a slider, an edge-emitting laser diode fixed to the slider, and an external mirror fixed to the laser diode. The laser diode has an emitting end face that includes an emission part for emitting laser light; a mounting surface that lies at an end in a direction perpendicular to the plane of an active layer and faces the slider; and a rear surface opposite to the mounting surface. The external mirror includes: a first to-be-fixed part disposed along the emitting end face; a second to-be-fixed part disposed along the rear surface; and a coupling part that couples the first and second to-be-fixed parts to each other. The first to-be-fixed part has a reflecting surface that reflects the laser light emitted from the emission part toward the waveguide. | 04-28-2011 |
20110095414 | Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same - A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: a device region in contact with at least any one of the plurality of groove portions and having a semiconductor device formed therein; a surface insulating layer formed to cover the device region and constituting a surface layer of the semiconductor substrate; and a wiring electrode connected to the semiconductor device and formed in a protruding shape rising above a surface of the surface insulating layer. The semiconductor substrate can be manufactured by forming a plurality of groove portions along scribe lines; applying an insulating material to a surface on a side where the plurality of groove portions are formed to form a surface insulating layer; and forming a wiring electrode connected to the semiconductor device and in a protruding shape rising above a surface of the surface insulating layer, after the formation of the surface insulating layer. | 04-28-2011 |
20110095289 | Laminated chips package, semiconductor substrate and method of manufacturing the laminated chips package - In a laminated chip package, a plurality of semiconductor plates each having a semiconductor device and a wiring electrode connected to the semiconductor device are laminated. On a side surface for wiring of the laminated chip package, an end face of an inner electrode for examination formed inside the side surface for wiring in the semiconductor plate is formed. The laminated chip package further has an outer electrode for examination connecting the end faces of the inner electrodes for examination along a lamination direction of the semiconductor plates, only for two adjacent semiconductor plates among the semiconductor plates. | 04-28-2011 |
20110068456 | Layered chip package and method of manufacturing same - A layered chip package includes a plurality of layer portions that are stacked, each of the layer portions including a semiconductor chip. The plurality of layer portions include at least one first-type layer portion and at least one second-type layer portion. The semiconductor chip has a circuit, a plurality of electrode pads electrically connected to the circuit, and a plurality of through electrodes. In every vertically adjacent two of the layer portions, the plurality of through electrodes of the semiconductor chip of one of the two layer portions are electrically connected to the respective corresponding through electrodes of the semiconductor chip of the other of the two layer portions. The first-type layer portion includes a plurality of wires for electrically connecting the plurality of through electrodes to the respective corresponding electrode pads, whereas the second-type layer portion does not include the wires. | 03-24-2011 |
20110058273 | Heat-assisted magnetic recording head with laser diode fixed to slider - A heat-assisted magnetic recording head includes a slider, an edge-emitting laser diode fixed to the slider, and an external mirror provided outside the slider. The slider includes a magnetic pole, a waveguide, and a near-field light generating element. The laser diode includes: an emitting end face that lies at an end in a direction parallel to the plane of an active layer and includes a laser-light emission part; and a mounting surface that lies at an end in a direction perpendicular to the plane of the active layer and faces the slider. The external mirror includes: a first reference surface that is parallel to the emitting end face and faces the emitting end face; a second reference surface that is parallel to the mounting surface and faces toward the same direction as the mounting surface does; and a reflecting surface that connects the first and second reference surfaces to each other and reflects the laser light emitted from the emission part toward the waveguide. | 03-10-2011 |
20110041322 | Method of manufacturing magnetic head for perpendicular magnetic recording including two side shields - A magnetic head includes a pole layer, first and second side shields, and an encasing layer having a pole groove that accommodates the pole layer and first and second side shield grooves that accommodate the first and second side shields. In a manufacturing method for the magnetic head, the pole groove and first and second initial side shield grooves are formed in a nonmagnetic layer using an etching mask layer having first to third openings. In the manufacturing method, a wall face of the first initial side shield groove that is closer to the pole groove and a wall face of the second initial side shield groove that is closer to the pole groove are etched by dry etching to thereby complete the first and second side shield grooves. | 02-24-2011 |
20110013497 | Heat-assisted magnetic recording head with laser diode fixed to slider - A heat-assisted magnetic recording head includes a slider, an edge-emitting laser diode fixed to the slider, and an external mirror provided outside the slider. The slider includes a magnetic pole, a waveguide, a near-field light generating element, and a substrate. The substrate has a top surface facing toward the magnetic pole, the near-field light generating element and the waveguide. The slider has a top surface that lies above the top surface of the substrate, at an end of the slider farther from the top surface of the substrate. The laser diode includes: an active layer; an emitting end face that lies at an end in a direction parallel to the plane of the active layer and includes an emission part for emitting laser light; and a bottom surface that lies at an end in a direction perpendicular to the plane of the active layer. The laser diode is arranged so that the bottom surface faces the top surface of the slider. The external mirror reflects the laser light emitted from the emission part toward the waveguide. | 01-20-2011 |
20100328806 | Near-field light generating device that includes near-field light generating element accommodated in a groove of an encasing layer - A near-field light generating element accommodated in a groove of an encasing layer has an outer surface that includes a first end face including a near-field light generating part, a second end face opposite to the first end face, and a coupling portion that couples the first and second end faces. The coupling portion includes a top surface, and first and second side surfaces that decrease in distance from each other with increasing distance from the top surface. The first end face includes a first side located at an end of the first side surface, and a second side located at an end of the second side surface. Each of the first and second sides includes an upper part and a lower part continuous with each other. An angle formed between the respective lower parts of the first and second sides is smaller than that formed between the respective upper parts of the first and second sides. | 12-30-2010 |
20100327464 | Layered chip package - A layered chip package includes a main body including a plurality of layer portions, and wiring disposed on a side surface of the main body. Each layer portion includes a semiconductor chip, an insulating portion covering at least one side surface of the semiconductor chip, and a plurality of electrodes connected to the semiconductor chip. The insulating portion has an end face located at the side surface of the main body on which the wiring is disposed. Each electrode has an end face surrounded by the insulating portion and located at the side surface of the main body on which the wiring is disposed. | 12-30-2010 |
20100304531 | Method of manufacturing layered chip package - A layered chip package includes a plurality of layer portions stacked, each layer portion including a semiconductor chip having a first surface with a device formed thereon and a second surface opposite thereto. The plurality of layer portions include at least a pair of layer portions disposed such that the first surfaces of the respective semiconductor chips face toward each other. A manufacturing method for the layered chip package includes the steps of: fabricating a layered substructure by stacking a plurality of substructures each including a plurality of layer portions corresponding to the plurality of layer portions of the layered chip package; and fabricating a plurality of layered chip packages by using the layered substructure. The step of fabricating the layered substructure includes: fabricating a first and a second pre-polishing substructure each having a first surface and a second surface; bonding the pre-polishing substructures to each other such that their respective first surfaces face toward each other; and forming a first and a second substructure by polishing the second surfaces. | 12-02-2010 |
20100301007 | Method of manufacturing magnetic head for perpendicular magnetic recording including two side shields - A magnetic head includes a pole layer, first and second side shields, and an encasing layer having first to third grooves that accommodate the pole layer and the first and second side shields. A manufacturing method for the magnetic head includes the step of forming the first to third grooves in a nonmagnetic layer by using an etching mask layer having first to third openings. This step includes the steps of forming the first groove by etching the nonmagnetic layer using the first opening, with the second and third openings covered with a first mask; and forming the second and third grooves by etching the nonmagnetic layer using the second and third openings, with the first opening covered with a second mask. | 12-02-2010 |
20100277832 | PMR writer device with multi-level tapered write pole - A perpendicular magnetic recording (PMR) head is fabricated with a multi-level tapered write pole. The write pole comprises a main pole with a tapered tip on which is formed at least one yoke that has a tapered edge. The edge of the yoke is recessed from the ABS of the tapered tip, giving the write pole a stepped profile. The tapered tip can be two sloped surfaces that are symmetric about a mid plane of the main pole or the taper can be a single sloped edge on the leading side or the trailing side of the pole. The yoke structure can consist of a single yoke formed on one side of the main pole or it can consist of two yokes formed symmetrically on both the leading and trailing sides of the main pole. Other yoke/pole combinations are also described as are various shield formations. The write pole structure creates an efficient channeling of magnetic flux to the ABS surface of the pole tip which produces magnetic recording field at high area densities. | 11-04-2010 |
20100260015 | Heat-assisted magnetic recording head with near-field light generating element - A heat-assisted magnetic recording head includes a magnetic pole, a waveguide, a near-field light generating element, and a substrate on which they are stacked. The near-field light generating element and the waveguide are disposed farther from the top surface of the substrate than is the magnetic pole. The near-field light generating element has an outer surface including: a first end face located in the medium facing surface; a second end face farther from the medium facing surface; and a coupling portion coupling the first and second end faces to each other. The first end face includes a near-field light generating part. The waveguide has an outer surface including an opposed portion opposed to a part of the coupling portion. The head further includes a mirror that reflects light emitted from a light source disposed above the waveguide, so as to let the light travel through the waveguide toward the medium facing surface. | 10-14-2010 |
20100200977 | Layered chip package and method of manufacturing same - A layered chip package has a main body including a plurality of pairs of layer portions, and wiring disposed on a side surface of the main body. Each layer portion includes a semiconductor chip. The plurality of pairs of layer portions include at least one specific pair of layer portions consisting of a first-type layer portion and a second-type layer portion. The first-type layer portion includes a plurality of electrodes each connected to the semiconductor chip and each having an end face located at the side surface of the main body on which the wiring is disposed, whereas the second-type layer portion does not include such electrodes. A layered substructure formed of a stack of two substructures each of which includes a plurality of preliminary layer portions aligned is used to fabricate a stack of a predetermined two or greater number of pairs of layer portions, and the main body is fabricated by stacking an additional first-type layer portion together with the stack, the number of the additional first-type layer portion being equal to the number of the specific pair(s) of layer portions included in the stack. | 08-12-2010 |
20100200959 | SEMICONDUCTOR SUBSTRATE, LAMINATED CHIP PACKAGE, SEMICONDUCTOR PLATE AND METHOD OF MANUFACTURING THE SAME - A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: insulating layers formed in the plurality of groove portions; a rectangular unit region in contact with at least any one of the plurality of groove portions; and a wiring electrode including an extended terminal portion extended from the unit region to the inside of the groove portion. The semiconductor substrate is manufactured by forming a plurality of groove portions along scribe lines; embedding an insulating material in the plurality of groove portions and planarizing a surface to form insulating layers; and forming a wiring electrode including an extended terminal portion extended from a rectangular unit region in contact with at least any one of the plurality of groove portions to the inside of the groove portion. | 08-12-2010 |
20100195264 | CERAMIC CAPACITOR AND METHOD OF MANUFACTURING SAME - In a ceramic capacitor according to the present invention, an interdiginated pair of internal electrodes are arranged, on a substrate, perpendicular to a surface of the substrate, and a ceramic dielectric member is filled into a gap between this pair of internal electrodes. For this reason, the dimensions of the internal electrodes do not substantially change before and/or after the formation of the ceramic dielectric member, whereby the dimensions formed at the time of internal electrode can be maintained. According to this ceramic capacitor, since the internal electrode dimensions can be easily controlled like this, dimensional control of internal electrode spacing can also be easily carried out. | 08-05-2010 |
20100195262 | CERAMIC CAPACITOR AND METHOD OF MANUFACTURING SAME - In a ceramic capacitor according to the present invention, the electrode strips of an internal electrode and the dielectric strips of a ceramic dielectric member are arranged perpendicularly to the surface of a substrate, and as such, the plurality of electrode strips and the plurality of dielectric strips are arranged alternately along a parallel direction relative to the substrate surface. That is, the electrode strips and the dielectric strips are multi-layered along a parallel direction relative to the substrate surface, thereby facilitating the realization of multi-layering in the ceramic capacitor by a known patterning technology. | 08-05-2010 |
20100192343 | METHOD OF MANUFACTURING CERAMIC CAPACITOR - In a method of manufacturing ceramic capacitor according to the present invention, a pair of interdigitated internal electrodes are arranged perpendicularly to the surface of the substrate, subsequent to which the respective end faces of this pair of internal electrodes are exposed, and a pair of external electrodes are formed at these exposed end faces. In this method of manufacturing ceramic capacitor, formation of the external electrodes on the end faces of the respective internal electrodes, with these internal electrodes being interdigitately integrally-formed and the end faces thereof being exposed, it possible to reliably and easily form the external electrodes. | 08-05-2010 |
20100182003 | MAGNETIC FILM SENSOR AND METHOD OF MANUFACTURING THE SAME - A magnetic film sensor comprises a magnetic film for generating a magnetostriction, and a magnetostrictive structure for generating a magnetostriction in the magnetic film. The magnetostrictive structure is constructed so as to generate a magnetostriction by curving the magnetic film, for example. The magnetostrictive structure is obtained, for example, by providing a depressed insulating layer having a surface formed with a depression and forming the magnetic film across the depression. | 07-22-2010 |
20100165517 | Magnetic head for perpendicular magnetic recording having side shield layer and method of manufacturing same - A magnetic head includes a side shield layer and an encasing layer. The side shield layer has a first end face located in the medium facing surface, a second end face opposite to the first end face, and a first groove accommodating a portion of a pole layer. The first end face includes two portions located on both sides of an end face of the pole layer that are opposite to each other in a track width direction. The encasing layer is formed of a nonmagnetic material and disposed on a side of the side shield layer opposite to a medium facing surface. The encasing layer has a front end face touching the second end face of the side shield layer, and a second groove accommodating another portion of the pole layer. The distance from the medium facing surface to an arbitrary point on the second end face of the side shield layer decreases with decreasing distance from the arbitrary point to the top surface of a substrate. | 07-01-2010 |
20100154198 | Sensing unit and method of making same - In a sensing unit according to the present invention, a spring portion having a support portion and a movable portion is conductive. A signal of a sensor portion provided on the movable portion of the spring portion is transmitted via the spring portion. Hence, the sensing unit according to the present invention has a simple constitution with a small number of components, and a wire does not necessarily have to be provided for each sensor portion. As a result, a reduction in manufacturing cost, simplification of the manufacturing process, and so on are achieved. | 06-24-2010 |
20100149687 | Magnetic head that suppresses protrusion of medium facing surface caused by heat of coil - A magnetic head includes a coil, a pole layer, and a coil adjacent layer. The coil includes a winding portion having two side surfaces. The coil adjacent layer is adjacent to at least part of the whole of the two side surfaces of the winding portion. The coil adjacent layer is formed of a nonmagnetic material having a linear thermal expansion coefficient of 5×10 | 06-17-2010 |
20100118438 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY AND HARD DISK DRIVE - A thin-film magnetic head is manufactured as follows. First, a base insulating layer having a magnetic pole forming depression sunken into a form corresponding to the main magnetic pole layer is formed, a stop film for CMP is formed such as to fill the magnetic pole forming depression, and then a magnetic layer is formed on the stop film. Next, the magnetic layer is separated by forming a separation groove substantially surrounding the magnetic pole forming depression on the outside thereof, and thus separated magnetic layer is formed with a cover insulating film adapted to cover the whole upper face. The surface is polished by CMP until the stop film is exposed, so that the part of magnetic layer remaining on the inside of the magnetic pole forming depression is used as the main magnetic pole layer. Further, a recording gap layer, a write shield layer, and a thin-film coil are formed. | 05-13-2010 |
20100109137 | Layered chip package with heat sink - A layered chip package includes: a plurality of layer portions stacked, each of the layer portions including a semiconductor chip; and a heat sink. Each of the plurality of layer portions has a top surface, a bottom surface, and four side surfaces. The heat sink has at least one first portion, and a second portion coupled to the at least one first portion. The at least one first portion is adjacent to the top surface or the bottom surface of at least one of the layer portions. The second portion is adjacent to one of the side surfaces of each of at least two of the plurality of layer portions. | 05-06-2010 |
20100044879 | Layered chip package and method of manufacturing same - A layered chip package includes a main body including a plurality of layer portions, and wiring disposed on a side surface of the main body. The plurality of layer portions include at least one layer portion of a first type and at least one layer portion of a second type. The layer portions of the first and second types each include a semiconductor chip. The layer portion of the first type further includes a plurality of electrodes each connected to the semiconductor chip and each having an end face located at the side surface of the main body on which the wiring is disposed, whereas the layer portion of the second type does not include any electrode connected to the semiconductor chip and having an end face located at the side surface of the main body on which the wiring is disposed. The wiring is connected to the end face of each of the plurality of electrodes. | 02-25-2010 |