H.C. Starck Inc. Patent applications |
Patent application number | Title | Published |
20140102880 | MOLYBDENUM-CONTAINING TARGETS COMPRISING THREE METAL ELEMENTS - The invention relates to sputter targets and methods for depositing a layer from a sputter target. The method preferably includes the steps of: placing a sputter target in a vacuum chamber; placing a substrate having a substrate surface in the vacuum chamber; reducing the pressure in the vacuum chamber to about 100 Torr or less; removing atoms from the surface of the sputter target while the sputter target is in the vacuum chamber (e.g., using a magnetic field and/or an electric field). The deposited layer preferably is a molybdenum containing alloy including about 50 atomic percent or more molybdenum, 0.5 to 45 atomic percent of a second metal element selected from the group consisting of niobium and vanadium; and 0.5 to 45 atomic percent of a third metal element selected from the group consisting of tantalum, chromium, vanadium, niobium, and titanium. | 04-17-2014 |
20130337159 | METHODS OF REJUVENATING SPUTTERING TARGETS - In various embodiments, a sputtering target initially formed by ingot metallurgy or powder metallurgy and comprising a sputtering-target material is provided, the sputtering-target material (i) comprising a metal, (ii) defining a recessed furrow therein, and (iii) having a first grain size and a first crystalline microstructure. A powder is spray-deposited within the furrow to form a layer therein, the layer (i) comprising the metal, (ii) having a second grain size finer than the first grain size, and (iii) having a second crystalline microstructure more random than the first crystalline microstructure. Spray-depositing the powder within the furrow forms a distinct boundary line between the layer and the sputtering-target material. | 12-19-2013 |
20130299347 | MULTI-BLOCK SPUTTERING TARGET WITH INTERFACE PORTIONS AND ASSOCIATED METHODS AND ARTICLES - A sputtering target that includes at least two consolidated blocks, each block including an alloy including a first metal (e.g., a refractory metal such as molybdenum in an amount greater than about 30 percent by weight) and at least one additional alloying ingredient; and a joint between the at least two consolidated blocks, the joint being prepared free of any microstructure derived from a diffusion bond of an added loose powder. A process for making the target includes hot isostatically pressing (e.g., below a temperature of 1080° C.), consolidated preform blocks that, prior to pressing, have interposed between the consolidated powder metal blocks at least one continuous solid interface portion. The at least one continuous solid interface portion may include a cold spray body, which may be a mass of cold spray deposited powders on a surface a block, a sintered preform, a compacted powder body (e.g., a tile), or any combination thereof. | 11-14-2013 |
20130224059 | METHODS OF FORMING MOLYBDENUM SPUTTERING TARGETS - In various embodiments, planar sputtering targets are produced by forming a billet at least by pressing molybdenum powder in a mold and sintering the pressed powder, working the billet to form a worked billet, heat treating the worked billet, working the worked billet to form a final billet, and heat treating the final billet. | 08-29-2013 |
20130082033 | METHODS OF MANUFACTURING LARGE-AREA SPUTTERING TARGETS USING INTERLOCKING JOINTS - In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding. | 04-04-2013 |
20130081944 | LARGE-AREA SPUTTERING TARGETS - In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding. | 04-04-2013 |
20130081943 | METHODS OF MANUFACTUING LARGE-AREA SPUTTERING TARGETS - In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding. | 04-04-2013 |
20130081749 | METHODS OF MANUFACTURING HIGH-STRENGTH LARGE-AREA SPUTTERING TARGETS - In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding. | 04-04-2013 |
20130081748 | METHODS OF MANUFACTURING LARGE-AREA SPUTTERING TARGETS BY COLD SPRAY - In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding. | 04-04-2013 |
20120285826 | MULTI-BLOCK SPUTTERING TARGET AND ASSOCIATED METHODS AND ARTICLES - A sputtering target that includes at least two consolidated blocks, each block including an alloy including molybdenum in an amount greater than about 30 percent by weight and at least one additional alloying ingredient; and a joint between the at least two consolidated blocks, the joint being free of any microstructure due to an added bonding agent (e.g., powder, foil or otherwise), and being essentially free of any visible joint line the target that is greater than about 200 μm width (e.g., less than about 50 μm width). A process for making the target includes hot isostatically pressing, below a temperature of 1080° C., consolidated perform blocks that may be surface prepared (e.g., roughened to a predetermined roughness value) prior to pressing. | 11-15-2012 |
20120117780 | REFRACTORY METAL POTS - In accordance with various embodiments, plates are formed via a plurality of upset-forging and forging-back cycles followed by a plurality of rolling passes. | 05-17-2012 |
20120003486 | MOLYBDENUM CONTAINING TARGETS - The invention is directed at sputter targets including 50 atomic % or more molybdenum, a second metal element of niobium or vanadium, and a third metal element selected from the group consisting of titanium, chromium, niobium, vanadium, and tantalum, wherein the third metal element is different from the second metal element, and deposited films prepared by the sputter targets. In a preferred aspect of the invention, the sputter target includes a phase that is rich in molybdenum, a phase that is rich in the second metal element, and a phase that is rich in the third metal element. | 01-05-2012 |
20110117375 | MOLYBDENUM CONTAINING TARGETS - The invention is directed at sputter targets including 50 atomic % or more molybdenum, a second metal element of titanium, and a third metal element of chromium or tantalum, and deposited films prepared by the sputter targets. In a preferred aspect of the invention, the sputter target includes a phase that is rich in molybdenum, a phase that is rich in titanium, and a phase that is rich in the third metal element. | 05-19-2011 |
20110067524 | TANTALUM BASED ALLOY THAT IS RESISTANT TO AQUEOUS CORROSION - A tantalum or tantalum alloy which contains pure or substantially pure tantalum and at least one metal element selected from the group consisting of Ru, Rh, Pd, Os, Ir, Pt, Mo, W and Re to form a tantalum alloy that is resistant to aqueous corrosion. The invention also relates to the process of preparing the tantalum alloy. | 03-24-2011 |
20110041650 | NIOBIUM BASED ALLOY THAT IS RESISTANT TO AQUEOUS CORROSION - A niobium or niobium alloy which contains pure or substantially pure niobium and at least one metal element selected from the group consisting of Ru, Rh, Pd, Os, Ir, Pt, Mo, W and Re to form a niobium alloy that is resistant to aqueous corrosion. The invention also relates to the process of preparing the niobium alloy. | 02-24-2011 |
20110008201 | NIOBIUM BASED ALLOY THAT IS RESISTANT TO AQUEOUS CORROSION - A niobium or niobium alloy which contains pure or substantially pure niobium and at least one metal element selected from the group consisting of Ru, Rh, Pd, Os, Ir, Pt, Mo, W and Re to form a niobium alloy that is resistant to aqueous corrosion. The invention also relates to the process of preparing the niobium alloy. | 01-13-2011 |
20100196734 | WEAR PROTECTION SHEETS, PROCESSES FOR PRODUCING THE SAME, AND USES THEREOF - Wear protection sheets containing hard material particles having a metallic shell and solder material particles selected from the group consisting of soft solders, hard solders and high-temperature solders, the use of the wear protection sheets and a process for producing them by tape casting are described. | 08-05-2010 |
20100086800 | METHOD OF MANUFACTURING BULK METALLIC STRUCTURES WITH SUBMICRON GRAIN SIZES AND STRUCTURES MADE WITH SUCH METHOD - Three dimensionally large metallic structures comprised of submicron grain sizes are produced by a process which includes directing a supersonic powder jet against a substrate such that the powder adheres to the substrate and to itself to form a dense cohesive deposit. The powder jet may be comprised of refractory metal powders. The powder may be deposited by a supersonic jet and may be extruded by Equi channel angular extrusion. | 04-08-2010 |
20100061876 | DYNAMIC DEHYDRIDING OF REFRACTORY METAL POWDERS - Refractory metal powders are dehydrided in a device which includes a preheat chamber for retaining the metal powder fully heated in a hot zone to allow diffusion of hydrogen out of the powder. The powder is cooled in a cooling chamber for a residence time sufficiently short to prevent re-absorbtion of the hydrogen by the powder. The powder is consolidated by impact on a substrate at the exit of the cooling chamber to build a deposit in solid dense form on the substrate. | 03-11-2010 |
20090186230 | REFRACTORY METAL-DOPED SPUTTERING TARGETS, THIN FILMS PREPARED THEREWITH AND ELECTRONIC DEVICE ELEMENTS CONTAINING SUCH FILMS - Metallic materials consisting essentially of a conductive metal matrix, preferably copper, and a refractory dopant component selected from the group consisting of tantalum, chromium, rhodium, ruthenium, iridium, osmium, platinum, rhenium, niobium, hafnium and mixtures thereof, preferably in an amount of about 0.1 to 6% by weight based on the metallic material, alloys of such materials, sputtering targets containing the same, methods of making such targets, their use in forming thin films and electronic components containing such thin films. | 07-23-2009 |
20080271779 | Fine Grained, Non Banded, Refractory Metal Sputtering Targets with a Uniformly Random Crystallographic Orientation, Method for Making Such Film, and Thin Film Based Devices and Products Made Therefrom - The invention relates to a sputtering target which has a fine uniform equiaxed grain structure of less than 44 microns, no preferred texture orientation as measured by electron back scattered diffraction (“EBSD”) and that displays no grain size banding or texture banding throughout the body of the target. The invention relates a sputtering target with a lenticular or flattened grain structure, no preferred texture orientation as measured by EBSD and that displays no grain size or texture banding throughout the body of the target and where the target has a layered structure incorporating a layer of the sputtering material and at least one additional layer at the backing plate interface, said layer has a coefficient of thermal expansion (“CTE”) value between the CTE of the backing plate and the CTE of the layer of sputtering material. The invention also relates to thin films and their use of using the sputtering target and other applications, such as coatings, solar devices, semiconductor devices etc. The invention further relates to a process to repair or rejuvenate a sputtering target. | 11-06-2008 |
20080267809 | Tantalum Based Alloy That Is Resistant to Aqueous Corrosion - A tantalum or tantalum alloy which contains pure or substantially pure tantalum and at least one metal element selected from the group consisting of Ru, Rh, Pd, Os, Jr, Pt, Mo, W and Re to form a tantalum alloy that is resistant to aqueous corrosion. The invention also relates to the process of preparing the tantalum alloy. | 10-30-2008 |