Foshan Nationstar Optoelectronics Co., Ltd. Patent applications |
Patent application number | Title | Published |
20130322088 | Large-Angle Lens and Large-Angle Emission LED Light Source Module - Disclosed is a large-angle LED lens including a main body which has an incident surface on the inner side of the main body and an exit surface on the outer side thereof. The surfaces are provided symmetrically about the central axis of the main body. The incident and exit surfaces are transparent concave and convex surfaces, respectively. The maximum thickness d | 12-05-2013 |
20130121007 | Manufacture Method for a Surface Mounted Power LED Support and its Product - A manufacture method for a surface mounted power LED support comprises providing a wiring board having both sided metal layers. In addition, the method comprises forming a hole. Further, the method comprises setting a metal layer in the surface of the hole. Still further, the method comprises thickening the metal layer of the wiring board. The method also comprises etching the metal layer of the wiring board. Moreover, the method comprises cutting the wiring board to form single support unit. A surface mounted power LED support comprises a both sided wiring board, a hole formed in the wiring board and wiring layers set on the surface of the wiring board. | 05-16-2013 |
20100110692 | STRUCTURE OF HEAT DISSIPATION SUBSTRATE FOR POWER LED AND A DEVICE MANUFACTURED BY IT - A structure of heat dissipation substrate of power LED and a device made thereof overcomes drawbacks such as complex structure of power LED, strict manufacturing process, low production efficiency, high production cost, and unreliable product quality. The structure of heat dissipation substrate includes a one-piece circuit board having a counterbore and metal lines thereon, wherein the counterbore is formed by a through hole and a blind hole communicating with each other, and the through hole is smaller than the blind hole, and both of them share the same direction of axis; the heat sink has a one-piece terraced structure formed by a upper terrace and a lower terrace; the heat sink matches the counterbore to form a firm fit; a plurality of counterbores may be arranged on the circuit board; the circuit board may also comprise a plurality of position lines for cutting and a plurality of slots and/or holes. The power LED device manufactured by using the heat dissipation substrate includes a heat sink, a circuit board with a counterbore, a LED chip, bonding wires, and encapsulation colloid. The encapsulation colloid covers the side of the circuit board carrying the chip and lead lines, and an external electrode part is kept outside. The encapsulation colloid functions not only as a sealing layer for sealing the chip and the bonding wire, but also as an optical lens integrated with the device. | 05-06-2010 |