FORMFACTOR, INC. Patent applications |
Patent application number | Title | Published |
20140340103 | Automated Attaching And Detaching Of An Interchangeable Probe Head - A probe card apparatus can comprise a tester interface to a test controller, probes for contacting terminals of electronic devices to be tested, and electrical connections there between. The probe card apparatus can comprise a primary sub-assembly, which can include the tester interface. The probe card apparatus can also comprise an interchangeable probe head, which can include the probes. The interchangeable probe head can be attached to and detached from the primary sub-assembly while the primary sub-assembly is secured to or in a housing of a test system. Different probe heads each having probes disposed in different patterns to test different types of electronic devices can thus be interchanged while the primary sub-assembly is secured to or in a housing of the test system. | 11-20-2014 |
20140327461 | Probe Card Assembly For Testing Electronic Devices - A probe card assembly can comprise a guide plate comprising probe guides for holding probes in predetermined positions. The probe card assembly can also comprise a wiring structure attached to the guide plate so that connection tips of the probes are positioned against and attached to contacts on the wiring structure. The attachment of the guide plate to the wiring structure can allow the wiring structure to expand or contract at a greater rate than the guide plate. The probes can include compliant elements that fail upon high electrical current and thermal stresses located away from the contact tips. | 11-06-2014 |
20140139250 | Contactor Devices With Carbon Nanotube Probes Embedded In A Flexible Film And Processes Of Making Such - Electrically conductive columns of intertwined carbon nanotubes embedded in a mass of material flexible, resilient electrically insulating material can be used as electrically conductive contact probes. The columns can extend between opposing sides of the mass of material. Terminals of a wiring substrate can extend into the columns and be electrically connected to an electrical interface to a tester that controls testing of a device under test. A pair of physically interlocked structures can coupling the mass of material to the wiring substrate. The pair can include a receptacle and a protrusion. | 05-22-2014 |
20140118016 | Probes With Spring Mechanisms For Impeding Unwanted Movement In Guide Holes - Elongated flexible probes can be disposed in holes of upper and lower guide plates of a probe card assembly. Each probe can include one or more spring mechanisms that exert normal forces against sidewalls of holes in one of the guide plates. The normal forces can result in frictional forces against the sidewalls that are substantially parallel to the sidewalls. The frictional forces can reduce or impede movement parallel to the sidewalls of the probes in the holes. | 05-01-2014 |
20140044985 | PROBE FABRICATION USING COMBINED LASER AND MICRO-FABRICATION TECHNOLOGIES - A method of making a probe (and the resulting probe) comprising providing a metal foil, creating a tip on an edge of the foil, and laser cutting a body of the probe from the foil with one or more tips at an end of the body. | 02-13-2014 |
20140043054 | VERTICAL PROBES FOR MULTI-PITCH FULL GRID CONTACT ARRAY - A testing method (and the probes used) comprising providing one or more probes each comprising: a body portion which is substantially straight; an extended portion extending from the body portion and comprising at least two separate probe portions; and a tip portion at the opposite end of the extended portion; and contacting an object to be tested with the one or more probes. | 02-13-2014 |
20130271175 | Wiring Substrate With Filled Vias To Accommodate Custom Terminals - A probe card assembly and associated processes of forming them may include a wiring substrate with a first surface and an opposite surface, an electrically conductive first via comprising electrically conductive material extending into the wiring substrate from the opposite surface and ending before reaching the first surface, and a plurality of electrically conductive second vias, and a custom electrically conductive terminal disposed on the first surface such that said custom terminal covers the first via and contacts one of the second vias adjacent to said first via without electrically contacting the first via. Each of the second vias may be electrically conductive from the first surface to the opposite surface. The first via may include electrically insulating material disposed within a hole in the first via. | 10-17-2013 |
20130169301 | Probes With Programmable Motion - The elongated body of an electrically conductive contact probe can be disposed in a guide hole and can include a patterned region for engaging and riding on a contact region of an inner sidewall of the guide hole as the elongated body moves in the guide hole in response to a force on a tip of the probe. As the patterned region rides the contact region, the tip moves in a lateral pattern that is a function of the surface(s) of the patterned region. | 07-04-2013 |
20130140057 | Carbon Nanotube Contact Structures For Use With Semiconductor Dies And Other Electronic Devices - A method of making carbon nanotube contact structures on an electronic device includes growing a plurality of carbon nanotube columns on a mandrel. Electrically-conductive adhesive is applied to ends of the columns distal from the mandrel, and the columns are transferred to the electronic device. An electrically-conductive material is deposited onto some or all of the columns. The mandrel can be reused to grow a second plurality of carbon nanotube columns. | 06-06-2013 |
20130135001 | Hybrid Electrical Contactor - An electrical connection between an electrically conductive probe on one device and a compliant pad on another device can be formed by piercing the compliant pad with the probe. The probe can contact multiple electrically conductive elements inside the pad and thereby electrically connect to the pad at multiple locations inside the pad. | 05-30-2013 |
20130103338 | METHODS AND APPARATUSES FOR DYNAMIC PROBE ADJUSTMENT - An improved method and apparatus for automatically aligning probe pins to the test or bond pads of semiconductor devices under changing conditions. In at least one embodiment, a dynamic model is used to predict an impact of changing conditions to wafer probing process. This reduces the need for frequent measurements and calibrations during probing and testing, thereby increasing the number of dice that can be probed and tested in a given period of time and increasing the accuracy of probing at the same time. Embodiments of the present invention also make it possible to adjust positions of probe pins and pads in response to the changing conditions while they are in contact with each other. | 04-25-2013 |
20130096866 | Method And Apparatus For Designing A Custom Test System - Methods, apparatus, and computer readable media for designing a custom test system are described. Examples of the invention can relate to a method of generating test system software for a semiconductor test system. In some examples, a method can include obtaining a configuration of the semiconductor test system, the configuration including a description of a device under test (DUT) and a description of test hardware; and generating an application programming interface (API) specific to the configuration of the semiconductor test system, the API being generated based on the description of the DUT and the description of the test hardware, the API providing a programming interface between the test system software and the test hardware to facilitate testing of the DUT. | 04-18-2013 |
20130093450 | VERTICAL PROBE ARRAY ARRANGED TO PROVIDE SPACE TRANSFORMATION - Improved probing of closely spaced contact pads is provided by an array of vertical probes having all of the probe tips aligned along a single contact line, while the probe bases are arranged in an array having two or more rows parallel to the contact line. With this arrangement of probes, the probe base thickness can be made greater than the contact pad spacing along the contact line, thereby advantageously increasing the lateral stiffness of the probes. The probe tip thickness is less than the contact pad spacing, so probes suitable for practicing the invention have a wide base section and a narrow tip section. | 04-18-2013 |
20130082729 | Probe With Cantilevered Beam Having Solid And Hollow Sections - An electrically conductive probe can comprise a post to which a beam structure is attached. The beam structure can comprise a cantilevered portion that extends away from the post to a free end to which a contact structure can be attached. The cantilevered portion of the beam can include both a solid section and a hollow section. Multiple such probes can be used in a test contactor to make electrical connections with an electronic device such as a semiconductor die or dies to be tested. | 04-04-2013 |
20120242363 | Non-Linear Vertical Leaf Spring - An electrically conductive contact element can include a first base and a second base with elongate, spaced apart leaves between the bases. A first end of each leaf can be coupled to the first base and an opposite second end of the leaf can be coupled to the second base. A body of the leaf between the first end and the second end can be sufficiently elongate to respond to a force through said contact element substantially parallel with the first axis and the second axis by first compressing axially while said force is less than a buckling force and then bending while said force is greater than the buckling force. | 09-27-2012 |
20120239339 | WIRELESS PROBE CARD VERIFICATION SYSTEM AND METHOD - A probe card assembly can include a wireless link to an external verifier (e.g., debugger). The wireless link can interface to a boundary scan interface of a controller on the probe card assembly. The wireless link can allow for verification of the probe card assembly while it is installed within a prober. | 09-20-2012 |
20120086004 | ELASTIC ENCAPSULATED CARBON NANOTUBE BASED ELECTRICAL CONTACTS - Contacts of an electrical device can be made of carbon nanotube columns. Contact tips can be disposed at ends of the columns. The contact tips can be made of an electrically conductive paste applied to the ends of the columns and cured (e.g., hardened). The paste can be applied, cured, and/or otherwise treated to make the contact tips in desired shapes. The carbon nanotube columns can be encapsulated in an elastic material that can impart the dominant mechanical characteristics, such as spring characteristics, to the contacts. The contacts can be electrically conductive and can be utilized to make pressure-based electrical connections with electrical terminals or other contact structures of another device. | 04-12-2012 |
20120007626 | TESTING TECHNIQUES FOR THROUGH-DEVICE VIAS - Techniques for testing an electronic device with through-device vias can include using a probe card assembly with probes for contacting connection structures of the electronic device including ends of through-device vias of the electronic device. A pair of the probes can be electrically connected in the probe card assembly and can thus contact and form a direct return loop from one through-device via to another through-device via of a pair of the through-device vias with which the pair of probes is in contact. The electronic device can include test circuitry for driving a test signal onto the one of the through-device vias and a receiver for detecting the test signal on the other of the through-device vias. | 01-12-2012 |
20110267085 | METHOD AND APPARATUS FOR TESTING DEVICES USING SERIALLY CONTROLLED INTELLIGENT SWITCHES - Methods and apparatus for testing devices using serially controlled intelligent switches have been described. In some embodiments, a probe card assembly can be provided that includes a plurality of integrated circuits (ICs) serially coupled to form a chain, the chain coupled to at least one serial control line, the plurality of ICs including switches coupled to test probes, each of the switches being programmable responsive to a control signal on the at least one serial control line. | 11-03-2011 |
20110171838 | SEGMENTED CONTACTOR - A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test. | 07-14-2011 |
20110128029 | STIFFENER ASSEMBLY FOR USE WITH TESTING DEVICES - A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener assembly for use with testing devices can be part of a probe card assembly that can include a stiffener assembly comprising an upper stiffener coupled to a plurality of lower stiffeners; and a substrate constrained between the upper stiffener and the plurality of lower stiffeners, the stiffener assembly restricting non-planar flex of the substrate while facilitating radial movement of the substrate with respect to the stiffener assembly. | 06-02-2011 |
20110050265 | METHOD AND APPARATUS FOR MULTILAYER SUPPORT SUBSTRATE - Embodiments of the present invention can relate to probe card assemblies, multilayer support substrates for use therein, and methods of designing multilayer support substrates for use in probe card assemblies. In some embodiments, a probe card assembly may include a multilayer support substrate engineered to substantially match thermal expansion of a reference material over a desired temperature range; and a probe substrate coupled to the multilayer support substrate. In some embodiments, the reference material may be silicon. | 03-03-2011 |
20100327891 | METHOD AND APPARATUS FOR THERMALLY CONDITIONING PROBE CARDS - Embodiments of probe cards and methods for fabricating and using same are provided herein. In some embodiments, an apparatus for testing a device (DUT) may include a probe card configured for testing a DUT; a thermal management apparatus disposed on the probe card to heat and/or cool the probe card; a sensor disposed on the probe card and coupled to the thermal management apparatus to provide data to the thermal management apparatus corresponding to a temperature of a location of the probe card; a first connector disposed on the probe card and coupled to the thermal management apparatus for connecting to a first power source internal to a tester; and a second connector, different than the first connector, disposed on the probe card and coupled to the thermal management apparatus for connecting to a second power source external to the tester. | 12-30-2010 |
20100271062 | METHOD AND APPARATUS FOR PROBE CARD ALIGNMENT IN A TEST SYSTEM - Embodiments of methods and apparatus for aligning a probe card assembly in a test system are provided herein. In some embodiments, an apparatus for testing devices may include a probe card assembly having a plurality of probes, each probe having a tip for contacting a device to be tested, and having an identified set of one or more features that are preselected in accordance with selected criteria for aligning the probe card assembly within a prober after installation therein. In some embodiments, the identity of the identified set of one or more features may be communicated to the prober to facilitate a global alignment of the probe card assembly that minimizes an aggregate misalignment of all of the tips in the probe card assembly | 10-28-2010 |
20100253374 | Method and apparatus for Terminating A Test Signal Applied To Multiple Semiconductor Loads Under Test - Apparatus for terminating a test signal applied to multiple semiconductor loads under test is described—for example apparatus for interfacing a test signal between a tester and a semiconductor device under test (DUT). In some examples, a probe card assembly may include at least one probe substrate each having test probes configured to contact test features of a DUT; a wiring substrate, coupled to the at least one probe substrate, having a connector configured for coupling with a source termination of a tester; a signal path formed on and/or in the wiring substrate and the at least one probe substrate, the signal path having a trace and trace stubs fanning out from the trace, an input of the trace being coupled to the connector and outputs of the trace stubs being coupled to the test probes; and a resistive termination coupled between the trace and at least one potential. | 10-07-2010 |
20100164323 | BIASED GAP-CLOSING ACTUATOR - A gap-closing actuator includes a stator having one or more first electrodes, a mover having one or more second electrodes interposed among the first electrodes, and a biasing mechanism for applying a non-capacitive bias to the mover for urging the mover to move in a desired direction with respect to the stator. The non-capacitive bias is different from a capacitive force generated between the first and second electrodes when the gap-closing actuator is in operation. | 07-01-2010 |
20100141290 | MICROSPRING ARRAY HAVING REDUCED PITCH CONTACT ELEMENTS - Embodiments of microspring arrays and methods for fabricating and using same are provided herein. In some embodiments, a microspring array may include at least two lithographically formed resilient contact elements, each resilient contact element having a beam and a tip for contacting a device to be tested, wherein the beams extend in substantially the same direction relative to a first end of the beams, and wherein the ends of the at least two beams are separated by a distance defining a central region and wherein the respective tips of the at least two beams extend away from the beams in a non-zero, non-perpendicular direction into the central region. | 06-10-2010 |
20100140793 | Process For Manufacturing Contact Elements For Probe Card Assembles - A process for making contact elements for a probe card assembly includes steps of forming a first continuous trench in a substrate along a first direction, and forming simultaneously a plurality of tip structures adjacent one to another in the first continuous trench in a second direction substantially normal to the first direction, each of the tip structures being part of, or adapted to be part of at least one corresponding contact element capable of forming an electrical contact with a terminal of an electronic device. | 06-10-2010 |
20100079159 | METHOD AND APPARATUS FOR PROVIDING A TESTER INTEGRATED CIRCUIT FOR TESTING A SEMICONDUCTOR DEVICE UNDER TEST - Methods and apparatus for providing a tester integrated circuit (IC) for testing a semiconductor device under test (DUT) are described. Examples of the invention can relate to an apparatus for testing a semiconductor device under test (DUT). In some examples, the apparatus can include an integrated circuit (IC) coupled to test probes configured to contact pads on the DUT, the IC including a plurality of dedicated test circuits coupled to programmable logic, the programmable logic responsive to programming data to form a tester for testing the DUT from at least one of the dedicated test circuits. | 04-01-2010 |
20100050029 | Method And Apparatus For Testing Semiconductor Devices With Autonomous Expected Value Generation - Method and apparatus for testing semiconductor devices with autonomous expected value generation is described. Examples of the invention can relate to apparatus for interfacing a tester and a semiconductor device under test (DUT). An apparatus can include output processing logic configured to receive test result signals from the DUT responsive to testing by the tester, the output processing logic voting a logic value of a majority of the test result signals as a correct logic value; and memory configured to store indications of whether each of the test result signals has the correct logic value. | 02-25-2010 |
20100039133 | PROBE HEAD CONTROLLING MECHANISM FOR PROBE CARD ASSEMBLIES - A probe card assembly includes a first probe head having contact elements disposed on a respective surface for forming electrical contacts with corresponding terminals of corresponding electronic devices, a second probe head having contact elements disposed on a respective surface for forming electrical contacts with corresponding terminals of corresponding electronic devices, and a controlling mechanism coupled to the first and second probe heads for controlling movement of the first and second probe heads in a first direction substantially parallel to the respective surfaces more than in a second direction substantially normal to the respective surfaces. | 02-18-2010 |
20090289050 | PROBE CARD THERMAL CONDITIONING SYSTEM - Embodiments of apparatus for thermally conditioning probe cards prior to use in a testing system are provided herein. In some embodiments, a probe card thermal conditioning system may include an enclosure configured to support a probe card and a heat transfer element disposed proximate a bottom of the enclosure for thermally conditioning the probe card prior to installation in a prober. The heat transfer element may be a heating and/or cooling element. A controller may be provided for controlling operation of the heat transfer element, optionally with temperature feedback. Multiple enclosures may be provided for independently conditioning multiple probe cards. The enclosure may be contained in a cart or may be part of shipping container for shipping a probe card. A fan may be provided for circulating air within the enclosure. The fan may facilitate providing a dry purge gas to prevent condensate from forming on the probe card. | 11-26-2009 |
20090261517 | MULTI-STAGE SPRING SYSTEM - Embodiments of a multi-stage spring system are provided herein. In some embodiments, a multi-stage spring system includes a spring assembly having at least one resilient element, wherein the spring assembly has a first spring constant when deflected up to a first distance, a greater, second spring constant when deflected beyond the first distance and up to a second distance, and a greater, third spring constant when deflected beyond the second distance and up to a third distance, and wherein the spring assembly stores mechanical energy when deflected towards a contact surface that biases the spring assembly away from the contact surface when released. | 10-22-2009 |
20090260962 | SELF-MONITORING SWITCH - Methods and apparatus for switching electrical signals are provided herein. In some embodiments a smart switch is provided, the smart switch may include a switch having a wipe capability; a monitor coupled to the switch for monitoring a performance characteristic thereof; and a controller configured to provide a stepped change in wipe applied by the switch between closing cycles thereof in response to the monitored performance characteristic. In some embodiments, an electronic device may be provided having a smart switch disposed therein. | 10-22-2009 |
20090260960 | SWITCH FOR USE IN MICROELECTROMECHANICAL SYSTEMS (MEMS) AND MEMS DEVICES INCORPORATING SAME - Embodiments of the present invention provide microelectromechanical systems (MEMS) switching methods and apparatus having improved performance and lifetime as compared to conventional MEMS switches. In some embodiments, a MEMS switch may include a resilient contact element comprising a beam and a tip configured to wipe a contact surface; and a MEMS actuator having an open position that maintains the tip and the contact surface in a spaced apart relation and a closed position that brings the tip into contact with the contact surface, wherein the resilient contact element and the MEMS actuator are disposed on a substrate and are movable in a plane substantially parallel to the substrate. In some embodiments, various contact elements are provided for the MEMS switch. In some embodiments, various actuators are provided for control of the operation of the MEMS switch. | 10-22-2009 |
20090251123 | Self-Referencing Voltage Regulator - A voltage regulator includes an input terminal for receiving a power input having a first voltage level, and an output terminal for generating a power output. A reference signal having a second voltage level is derived from the first voltage level adjusted with a predetermined offset value for controlling the power output to be at a third voltage level proportional to the second voltage level. | 10-08-2009 |
20090235131 | METHOD AND APPARATUS FOR PROCESSING FAILURES DURING SEMICONDUCTOR DEVICE TESTING - Methods and apparatus for processing failures during semiconductor device testing are described. Examples of the invention can relate to testing a device under test (DUT). Fail capture logic can be provided, coupled to test probes and memory, to indicate only first failures of failures detected on output pins of the DUT during a test for storage in the memory. | 09-17-2009 |
20090206860 | APPARATUS AND METHOD FOR ADJUSTING THERMALLY INDUCED MOVEMENT OF ELECTRO-MECHANICAL ASSEMBLIES - A thermal adjustment apparatus for adjusting one or more thermally induced movements of an electro-mechanical assembly includes: a compensating element expanding at a first rate different from a second rate at which the electro-mechanical assembly expands for generating a counteracting force in response to changes in temperature; and a coupling mechanism coupling the compensating element to the electro-mechanical assembly, and being adjustable to control an amount of the counteracting force applied to the electro-mechanical assembly as temperature changes. | 08-20-2009 |
20090164931 | Method and Apparatus for Managing Test Result Data Generated by a Semiconductor Test System - Methods, apparatus, and computer readable media for managing test result data generated by a semiconductor test system are described. Examples of the invention can relate to managing test result data generated by a semiconductor test system. In some examples, test result data is obtained from the semiconductor test system responsive to testing of a device under test (DUT). The test result data is processed for storage in a relational database using an interface generated in part based on design information of the DUT. | 06-25-2009 |
20090108861 | STIFFENER ASSEMBLY FOR USE WITH TESTING DEVICES - A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener for use with testing devices includes an inner member; an outer member disposed in a predominantly spaced apart relation to the inner member; and a plurality of alignment mechanisms for orienting the inner and outer members with respect to each other, wherein the alignment mechanisms transfer forces applied to a lower surface of the inner member to the outer member and provide the predominant conductive heat transfer passageway between the inner and outer members. | 04-30-2009 |
20090085590 | Method And Apparatus For Testing Devices Using Serially Controlled Intelligent Switches - Methods and apparatus for testing devices using serially controlled intelligent switches have been described. In some embodiments, a probe card assembly can be provided that includes a plurality of integrated circuits (ICs) serially coupled to form a chain, the chain coupled to at least one serial control line, the plurality of ICs including switches coupled to test probes, each of the switches being programmable responsive to a control signal on the at least one serial control line. | 04-02-2009 |
20090079455 | REDUCED SCRUB CONTACT ELEMENT - Embodiments of resilient contact elements and methods for fabricating and using same are provided herein. In one embodiment, a resilient contact element includes a lithographically formed resilient beam having a plurality of openings disposed laterally therethrough; and a tip disposed proximate a first end of the beam, the tip and the beam together configured to electrically probe a device to be tested. | 03-26-2009 |
20090079448 | Method And Apparatus For Testing Devices Using Serially Controlled Resources - Methods and apparatus for testing devices using serially controlled resources have been described. Examples of the invention can relate to an apparatus for testing a device under test (DUT). In some examples, an apparatus can include an integrated circuit (IC) having a serialized input coupled to test circuits, the test circuits selectively communicating test signals with the DUT responsive to a test control signal on the serialized input. | 03-26-2009 |
20090066352 | Making And Using Carbon Nanotube Probes - Columns comprising a plurality of vertically aligned carbon nanotubes can be configured as electromechanical contact structures or probes. The columns can be grown on a sacrificial substrate and transferred to a product substrate, or the columns can be grown on the product substrate. The columns can be treated to enhance mechanical properties such as stiffness, electrical properties such as electrical conductivity, and/or physical contact characteristics. The columns can be mechanically tuned to have predetermined spring properties. The columns can be used as electromechanical probes, for example, to contact and test electronic devices such as semiconductor dies, and the columns can make unique marks on terminals of the electronic devices. | 03-12-2009 |
20080238467 | REINFORCED CONTACT ELEMENTS - Embodiments of reinforced resilient elements and methods for fabricating same are provided herein. In one embodiment, a reinforced resilient element includes a resilient element configured to electrically probe an unpackaged semiconductor device to be tested, the resilient element having a first end and an opposing second end; and a reinforcement member having a first end affixed to the resilient element at the first end thereof or at a point disposed between the first and the second ends of the resilient element, an opposing second end disposed in a direction towards the second end of the resilient element, and a resilient portion disposed between the first and second ends, wherein the resilient portion is not affixed to the resilient element. | 10-02-2008 |
20080231258 | STIFFENING CONNECTOR AND PROBE CARD ASSEMBLY INCORPORATING SAME - A stiffening connector assembly and methods of use are provided herein. In some embodiments a stiffening connector assembly includes a connector configured to be coupled to a substrate; and a mechanism coupled to the connector and configured to restrict rotational movement of the connector with respect to the substrate when coupled thereto. The mechanism may further provide a lateral degree of freedom of movement in a direction substantially parallel to the substrate. | 09-25-2008 |