20140268546 | HEAT AND AIRFLOW MANAGEMENT IN A DATA STORAGE DEVICE - A chassis sub-assembly for computing devices includes a first heat sink plate and a second heat sink plate. The first heat sink plate includes a first plurality of perforations and the second heat sink plate includes a second plurality of perforations. The chassis sub-assembly also includes a first computing device and a second computing device. Each of the first and second computing devices is positioned between the first heat sink plate and the second heat sink plate. The first and second computing devices are in contact with both the first and second heat sink plates, and define a channel gap between the first and second computing devices. At least some of the first and second plurality of perforations are aligned with the channel gap. The first plurality of perforations, the channel gap, and the second plurality of perforations define an airflow channel. | 09-18-2014 |