EPCOS AG Patent applications |
Patent application number | Title | Published |
20160056945 | Circuit Arrangement - A circuit arrangement includes an antenna port, a first receiving port, a second receiving port, a first transmission port, and a second transmission port. A number of 90 degree hybrids are configured to transfer an input signal into two output signals that are phase shifted relative to each other. Two quadplexers each include a first duplexer and a second duplexer. The quadplexers and the 90 degree hybrids are interconnected such that a leakage signal travelling from one of the transmission ports to one of the receiving ports destructively interferes at the receiving port. | 02-25-2016 |
20160049918 | Microelectromechanical Systems Device Package and Method for Producing the Microelectromechanical Systems Device Package - A microelectromechanical systems device package includes a MEMS device mounted in flip-chip technology on a substrate. A film of non-evaporable getter material is disposed between the substrate and the MEMS device. A cover structure encapsulates the MEMS device. This invention further provides a method for manufacturing the microelectromechanical systems device package. | 02-18-2016 |
20150371778 | Capacitor Arrangement - A capacitor arrangement includes at least one ceramic multilayer capacitor with a main body having ceramic layers and first and second electrode layers arranged therebetween. The capacitor also has a first external contact and a second external contact on mutually opposite side surfaces. The first external contact is electrically conductively connected to the first electrode layers and the second external contact is electrically conductively connected to the second electrode layers. A contact arrangement includes two metallic contact plates, between which the at least one ceramic multilayer capacitor is arranged. The first and second external contacts are electrically conductively connected in each case to one of the metallic contact plates. | 12-24-2015 |
20150351258 | Method for Producing a Multilayer Carrier Body - A method for producing a multilayer carrier body is disclosed. A method for producing a multilayer carrier body. The method includes producing films by printing a first area of each film with a first paste and printing a second area of the film with a second paste. The method also includes stacking the films and laminating the films. | 12-03-2015 |
20150318833 | MEMS Microphone And Method Of Operating The MEMS Microphone - The present invention concerns a MEMS Microphone ( | 11-05-2015 |
20150318464 | Method for Producing an Electronic Component - A method for producing an electronic component includes providing a piezoelectric main body, which is provided with electrodes. A first electric polarization field having a first polarity direction is applied to the piezoelectric main body between the two electrodes and then a second electric polarization field is applied in a second polarity direction, opposite to the first polarity direction, to the piezoelectric main body between the electrodes. The absolute value of the second electric polarization field differs from that of the first electric polarization field. | 11-05-2015 |
20150312681 | Electroacoustic Transducer - An electroacoustic transducer has a piezoelectric layer, which is structured in such a way that, in the case of an alternating electric field applied in one spatial direction, an oscillation mode with oscillations in three spatial directions is excited. | 10-29-2015 |
20150310987 | Circuit Arrangement - A circuit arrangement can be used for adapting the electroacoustic properties of an electroacoustic component. The circuit arrangement includes a first conductor loop and a further element. The first conductor loop includes a main loop and a negative feedback loop. The negative feedback loop has a sense of curvature that is opposite to a sense of curvature of the main loop. The negative feedback loop compensates for a coupling between the main loop and the further element. | 10-29-2015 |
20150294792 | Multi-Layer Capacitor and Method for Producing a Multi-Layer Capacitor - A multi-layer capacitor has dielectric layers and electrode layers arranged therebetween. The multi-layer capacitor has a number of segments that are connected to one another. At least one relief region is provided between the segments. The invention furthermore provides a method for producing such a multi-layer capacitor. | 10-15-2015 |
20150287703 | Light-Emitting Diode Arrangement, Module, and Method for Producing a Light-Emitting Diode Arrangement - A light-emitting diode arrangement includes a light-emitting diode and a coding resistor for coding the light-emitting diode. The coding resistor is embodied as a star connection of a number of resistors. Furthermore, a module includes a plurality of light-emitting diode arrangements. Furthermore, a method for producing a light-emitting diode arrangement is specified, wherein the coding of a coding resistor is carried out depending on a determined characteristic of the light-emitting diode. | 10-08-2015 |
20150245481 | Electric Component Assembly - A component assembly and a method for manufacturing a component assembly are disclosed. In some embodiments a component assembly includes a carrier, a metallic structure arranged on the carrier, wherein the metallic structure comprises at least one cavity and an electrical component arranged at least in part in the cavity. | 08-27-2015 |
20150244348 | SAW FILTER WITH IMPROVED STOP BAND SUPPRESSION - A filter working with surface acoustic waves comprises a piezoelectric substrate (SU), a first transducer (IDT | 08-27-2015 |
20150225231 | MEMS DEVICE AND METHOD FOR PRODUCING AN MEMS DEVICE OPERATING WITH ACOUSTIC WAVES - The present invention relates to a method for producing an MEMS device ( | 08-13-2015 |
20150222300 | DUPLEXER - A duplexer having good insulation, small geometric dimensions and good decoupling of the transmit signal path from an antenna which may have poor matching is specified. To that end, the duplexer comprises two transmit filters, a receive filter and two 90° hybrids. | 08-06-2015 |
20150194264 | Electrical Component Comprising a Connection Element Having a Plastic Body - An electrical component is disclosed. In an embodiment the component includes a component body and at least one connection element having a plastic body, wherein the at least one connection element is connected to the component body via a metal layer. | 07-09-2015 |
20150163594 | MICROPHONE WITH AUTOMATIC BIAS CONTROL - A microphone comprising an automatic bias control providing a better signal quality is proposed. The microphone comprises a bias control circuit that can provide two or more voltages to the microphone's capacitor. The bias control circuit increases the voltage if the collapse frequency is low and decreases the voltage if the collapse frequency is high. | 06-11-2015 |
20150162883 | AMPLIFIER CIRCUIT - The present disclosure relates to an amplifier circuit ( | 06-11-2015 |
20150158725 | METHOD OF HERMETICALLY SEALING A HOLE WITH A FUSE MATERIAL - Method of hermetically sealing a hole with a fuse material, comprising the following steps:
| 06-11-2015 |
20150145633 | CONTACTING DEVICE FOR CONNECTING AN ELECTRICAL CONDUCTOR - A contacting device ( | 05-28-2015 |
20150132589 | Method for Producing a Multi-Layered Structural Element, and a Multi-Layered Structural Element Produced According to Said Method - A multi-layered structural element and a method for producing a multi-layered structural element are disclosed. In an embodiment dielectric green sheets, at least one ply containing an auxiliary material which contains at least one copper oxide and layers containing electrode material are provided and arranged alternately one above another. These materials are debindered and sintered. The copper oxide is reduced to form the copper metal and the at least one ply is degraded during debindering and sintering. | 05-14-2015 |
20150130362 | SPARK GAP ARRANGEMENT - A spark gap arrangement comprises a triggerable spark gap (TF) and a trigger circuit (TRG), which comprises a first and a second charge store (C | 05-14-2015 |
20150130327 | MULTILAYER COMPONENT AND METHOD OF PRODUCING A MULTILAYER COMPONENT - A method of producing a fully active multilayer element including producing a fully active stack, and optionally sintering of the fully active stack or a green precursor thereof; applying outer electrodes onto sides A′ and C′ of the fully active stack and contacting of the uncoated inner electrodes so that the two outer electrodes electrically connect to the uncoated inner electrode layers. | 05-14-2015 |
20150103466 | Ceramic Multi-Layered Capacitor - A ceramic multi-layer capacitor includes a main body, which has ceramic layers arranged along a layer stacking direction to form a stack, and first and second electrode layers arranged between the ceramic layers. The multi-layer capacitor also includes a first external contact-connection arranged on a first side surface of the main body and electrically conductively connected to the first electrode layers, and a second external contact-connection arranged on a second side surface ( | 04-16-2015 |
20150077894 | SURGE ARRESTER - A surge arrester comprises an electrical insulator ( | 03-19-2015 |
20150054098 | MEMS MICROPHONE ASSEMBLY AND METHOD OF MANUFACTURING THE MEMS MICROPHONE ASSEMBLY - The present invention concerns a MEMS microphone assembly ( | 02-26-2015 |
20150043669 | MULTI ANTENNA COMMUNICATION DEVICE WITH IMPROVED TUNING ABILITY - A wireless communication device (WCD) having improved tuning abilities is provided. The device comprises an absorption element (AE) connected to an additional antenna (MIMOA). RF power coupled from a main antenna (MA) into the additional antenna (MIMOA) is absorbed instead of being re-emitted into the main antenna (MA) and disturbing measurement of the reflected power level. | 02-12-2015 |
20150043127 | MULTI-LAYER COMPONENT AND METHOD FOR PRODUCING SAME - The multi-layer component has a main body ( | 02-12-2015 |
20150027224 | Micromechanical Measuring Element and Method for Producing a Micromechanical Measuring Element - A micromechanical measuring element includes a carrier and a sensitive element connected to the carrier by a first solder connection and a second solder connection. The sensitive element is contacted electrically by the first solder connection. The sensitive element, the carrier and the second solder connection form a first chamber. The first chamber has a first opening. | 01-29-2015 |
20150016635 | Differential Microphone and Method for Driving a Differential Microphone - A differential microphone with improved biasing and a well defined common mode output voltage is connected to an amplifier that includes a differential amplifier stage and a common mode feedback circuit. The amplifier is in a feedback configuration. | 01-15-2015 |
20140376749 | DOUBLE BACKPLATE MEMS MICROPHONE WITH A SINGLE-ENDED AMPLIFIER INPUT PORT - A double backplate microphone having a good signal-to-noise ratio and being produceable at reduced manufacturing costs is provided. A microphone comprises a first backplate BP | 12-25-2014 |
20140346621 | MEMS BACKPLATE, MEMS MICROPHONE COMPRISING A MEMS BACKPLATE AND METHOD FOR MANUFACTURING A MEMS MICROPHONE - A MEMS backplate enables MEMS microphones with reduced parasitic capacitance. A MEMS backplate includes a central area and a perforation in the central area. A suspension area surrounds the central area at least partially. An aperture is disposed in the suspension area. | 11-27-2014 |
20140329475 | Front-end Circuit for Band Aggregation Modes - A front-end circuit for a wireless communication unit includes at least two antenna feeds. At least one of the antennas is coupled to an antenna switch. The circuit comprises filters and duplexers and is prepared to operate a number of FDD frequency bands. Each FDD band comprises an Rx band for receive signals and a Tx band for transmit signals. The circuit provides a single band operation mode for each frequency band and aggregated band operation modes. In an aggregated band operation mode Rx signals can be received in two different frequency bands at the same time as well as Tx signals can be transmitted in at least one of the two different frequency bands. In addition, TDD bands as well as GSM bands are covered. | 11-06-2014 |
20140327996 | MULTI-STEP TUBE OF A CERAMIC MATERIAL AND GAS DISCHARGE TUBE MADE OF THE SAME - A multi-step tube ( | 11-06-2014 |
20140305685 | Multilayer Glass Ceramic Substrate with Embedded Resistor - A multilayer glass ceramic substrate includes a number of insulating layers composed of glass ceramics. An embedded resistor is formed between the insulating layers. The resistor includes scattered microvoids and includes materials containing conductive powders and glass powders. First and second internal conductors are provided where a first end of the embedded resistor is connected to the first internal conductor and a second end of the embedded resistor is connected to the second internal conductor. | 10-16-2014 |
20140301016 | CAPACITOR COMPONENT - The invention relates to a capacitor component having a first integrated capacitor (C | 10-09-2014 |
20140292472 | Electric Device - An electric device includes an electric element having an element terminal and a conductive spring being deflected. The spring is electrically coupled to the element terminal by a fusible joint. A switch includes a first monitor terminal and a second monitor terminal. The state of the switch is changeable between a first connection state, where the first monitor terminal and the second monitor terminal are electrically coupled, and a second connection state, where the first monitor terminal and the second monitor terminal are electrically decoupled. When the joint fuses, the spring relaxes, thereby decoupling the spring and the element terminal and changing the state of the switch. | 10-02-2014 |
20140292161 | METHOD FOR PRODUCING A PIEZOELECTRIC MULTILAYER COMPONENT, PIEZOELECTRIC MULTILAYER COMPONENT CONTAINING AN AUXILIARY MATERIAL, AND USE OF AN AUXILIARY MATERIAL FOR SETTING THE BREAKING STRESS OF A PIEZOELECTRIC MULTILAYER COMPONENT - Provision is made of a method for producing a piezoelectric multilayer component ( | 10-02-2014 |
20140285070 | CERAMIC MATERIAL, METHOD FOR PRODUCING THE CERAMIC MATERIAL, AND ELECTROCERAMIC COMPONENT COMPRISING THE CERAMIC MATERIAL - The invention relates to a ceramic material, comprising lead zirconate titanate, which additionally contains K and optionally Cu. The ceramic material can be used in an electroceramic component, for example a piezoelectric actuator. The invention also relates to methods for producing the ceramic material and the electronic component. | 09-25-2014 |
20140266537 | ELECTRONIC COMPONENT FOR GUIDING A MAGNETIC FIELD - An electronic component for guiding a magnetic field comprises a core ( | 09-18-2014 |
20140252403 | ESD Protection Component and Component Comprising an ESD Protection Component and an LED - An ESD protection component includes a ceramic material and a BGA or LGA termination. In addition, an ESD protection component includes a basic body with a lower side. The basic body includes a ceramic material. At least one floating inner electrode is located at a distance from the lower side of two to 100 ceramic grains. Also a component includes a carrier, on which an LED and an ESD protection component are arranged. | 09-11-2014 |
20140232238 | Piezoelectric Component and Method for Producing a Piezoelectric Component - A piezoelectric component has at least one piezoelectric ceramic layer and at least one electrode adjacent the piezoelectric ceramic layer. The piezoelectric ceramic layer has a piezoelectric ceramic material of the general formula Pb | 08-21-2014 |
20140218836 | STACKED GAS FILLED SURGE ARRESTER - A surge arrester comprising stacked arrester units is provided that is that is easy to assemble. For that, a surge arrester comprises stacked arrester units, a capacitor, and a resilient element, where the resilient element electrically and mechanically connects the capacitor with a node of the arrester stack. | 08-07-2014 |
20140217523 | Housing for a Semiconductor Chip and Semiconductor Chip with a Housing - A housing for a semiconductor chip has an injection molded body, in which an accommodating area for accommodating the semiconductor chip is provided. The injection-molded body has at least one metallization for making electrical contact with the semiconductor chip. | 08-07-2014 |
20140216163 | PRESSURE SENSOR AND METHOD FOR PRODUCING A PRESSURE SENSOR - A pressure sensor ( | 08-07-2014 |
20140204503 | ELECTRICAL DEVICE - An electrical device having at least one functional element that includes a ceramic body, on which a first electrical contact layer and a second electrical contact layer are applied to two opposite-lying side faces, respectively, and the functional element is arranged between a first contact strip and a second contact strip, wherein the first contact strip and the second contact strip comprise several contact pins, respectively, and wherein the first contact layer electrically contacts at least one contact pin of the first contact strip and the second contact layer electrically contacts at least one contact pin of the second contact strip. | 07-24-2014 |
20140185832 | Assembly with an Analog Data Processing Unit and Method of Using Same - An assembly includes an analog signal processing unit. An analog signal path and an amplifier an automatic gain control unit are coupled to the signal path. Further to the output of the amplified analog signal, a gain information is provided as an analog or digital signal at a gain information output. This information can be used for further processing the signal, e.g., by automatic noise compression or to control further signal processing units. | 07-03-2014 |
20140184358 | BAW-FILTER OPERATING USING BULK ACOUSTIC WAVES - The present invention relates to a BAW filter operating with bulk acoustic waves, which has a multilayer construction, wherein functional layers of a BAW resonator operating with bulk acoustic waves are realized by the multilayer construction, and wherein an interconnection of passive components is furthermore formed by the multilayer construction, said interconnection forming a balun, wherein the balun has at least one inductance (L | 07-03-2014 |
20140145276 | MEMS MICROPHONE AND METHOD FOR MANUFACTURE - An improved method for manufacturing an MEMS microphone with a double fixed electrode is specified which results in a microphone which likewise has improved properties. | 05-29-2014 |
20140113574 | CIRCUIT ASSEMBLY - The present invention relates to a circuit assembly which comprises an antenna path (A | 04-24-2014 |
20140111062 | Wafer-Level Package and Method for Production Thereof - A hermetic wafer-level package composed of two piezoelectric wafers, preferably identical in terms of material, and a production method therefor are presented. The electrical and mechanical connection between the two wafers is accomplished with frame structures and pillars, the partial structures of which, distributed between two wafers, are wafer-bonded with the aid of connecting layers. | 04-24-2014 |
20140063675 | Surge Arrester with a Low Response Voltage and Method for Producing Same - A surge arrester includes a cavity formed by at least one insulating body, and at least two electrodes, which extend into the cavity. The electrodes are oriented toward one another with their free ends and have an electrode spacing between one another. The electrodes include several different metallic materials in regions of the free ends. | 03-06-2014 |
20140049337 | AMPLIFIER MODULE - The invention relates to an amplifier module, comprising at least one amplifier (PA), an antenna port (ANT), a transmission port (TX), a reception port (RX), and a circuit arrangement having at least three 90 DEG hybrids (HYB | 02-20-2014 |
20140043113 | DUPLEXER WITH PHASE SHIFTER CIRCUIT - A duplexer comprising an improved matching circuit for matching between transmitting path and receiving path is specified. In this case, the matching circuit comprises a hybrid and matching elements. | 02-13-2014 |
20140041931 | ELECTRIC CERAMIC COMPONENT WITH ELECTRIC SHIELDING - The electric ceramic component has a main part ( | 02-13-2014 |
20140037121 | Microphone and Method to Position a Membrane Between Two Backplates - A microphone includes two backplates. A membrane is located between the two backplates. A voltage source applies a first bias voltage to the membrane and the first backplate and applies a second bias voltage to the membrane and the second backplate. A control unit adjusts the first and the second bias voltage. A method to center the membrane in a final electro-mechanic equilibrium position between the two backplates in a microphone is also disclosed. | 02-06-2014 |
20140036466 | CASED ELECTRICAL COMPONENT - The invention relates to a cased electrical component comprising a carrier substrate ( | 02-06-2014 |
20140035436 | COMPONENT OPERATING WITH ACOUSTIC WAVES AND METHOD FOR PRODUCING SAME - The invention concerns a component (B) operating with acoustic waves, in which the reflection and excitation are largely decoupled. For this purpose, a component comprises a dielectric (DL) which is arranged between an electrode finger (EF) and a piezoelectric substrate (PSU) and at least partially overlaps the electrode finger. | 02-06-2014 |
20140035434 | MEMS Device Comprising An Under Bump Metallization - The present invention concerns a MEMS device comprising an under bump metallization ( | 02-06-2014 |
20140028414 | Surface Acoustic Wave Filter - A surface acoustic wave filter includes a θ-rotated Y-cut X-propagation lithium niobate substrate. The cut angle ranges from 20° to 40°. An interdigital transducer can be used for exciting a surface acoustic wave that is formed on the substrate. | 01-30-2014 |
20140022695 | Electrical Multilayer Component - An electrical multilayer component includes a stack composed of functional layers and also a first and a second external contact. The external contacts are arranged on side surfaces of the stack. Internal electrodes of a first type are directly electrically conductively connected to the first external contact and internal electrodes of a second type directly electrically conductively connected to the second external contact. An internal electrode of the first type and an internal electrode of the second type partly overlap. An internal electrode of the first type and an internal electrode of the second type are arranged in a manner spaced apart from one another in an identical plane. | 01-23-2014 |
20140022043 | Piezoelectric Multi-Layer Component - A piezoelectric multi-layer component includes a piezoelectric main body, which has an inlet area and an outlet area. In the outlet area or in the inlet area at least two adjacent layers are polarized antiparallel to each other and at least two adjacent layers are polarized parallel to each other. | 01-23-2014 |
20140015379 | Piezoelectric Multilayer Component and Method for Producing the Same - The piezoelectric multilayer component includes a piezo stack having an alternating sequence of piezoelectric ceramic layers and inner electrodes, and a passivation on an outer side. The passivation is produced from a piezoelectric ceramic material which is different from the material of the ceramic layers. In the production method, the passivation is polarized together with the ceramic layers. | 01-16-2014 |
20140013853 | PRESSURE SENSOR HAVING A COMPRESSIBLE ELEMENT - The invention relates to a pressure sensor ( | 01-16-2014 |
20140003609 | MICROPHONE ARRANGEMENT | 01-02-2014 |
20140001920 | ACTUATOR, ACTUATOR SYSTEM AND ACTUATION OF AN ACTUATOR | 01-02-2014 |
20130344820 | FRONT-END CIRCUIT - The present invention concerns a front-end circuit (FEC) that is connectable to at least two radiators (RAD | 12-26-2013 |
20130343028 | ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE ELECTRONIC COMPONENT - The invention specifies an electronic component which has a first electrode ( | 12-26-2013 |
20130343006 | ELECTRICAL MODULE FOR BEING RECEIVED BY AUTOMATIC PLACEMENT MACHINES BY MEANS OF GENERATING A VACUUM - The invention relates to an electrical module ( | 12-26-2013 |
20130342083 | ACTUATOR, ACTUATOR SYSTEM, AND CONTROL OF AN ACTUATOR - The invention relates to an actuator ( | 12-26-2013 |
20130342079 | ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE ELECTRONIC COMPONENT - The invention relates to an electronic component having a layer sequence, which comprises at least a first electrode ( | 12-26-2013 |
20130341773 | ENCAPSULATION OF AN MEMS COMPONENT AND A METHOD FOR PRODUCING SAID COMPONENT - The invention relates to a component and a method for producing said component. The component comprises a substrate (S), a chip (CH), a frame (MF), which is connected to the substrate (S) and on which the chip (CH) bears. A metallic closure layer (ML) encompasses the frame (MF), the substrate (S) and the chip (CH) such that a volume enclosed by the substrate (S), the chip (CH) and the frame (MF) is hermetically sealed. | 12-26-2013 |
20130340532 | PRESSURE SENSOR HAVING A COMPRESSIBLE ELEMENT - The invention relates to a pressure sensor ( | 12-26-2013 |
20130335168 | RF Device and Method for Tuning an RF Device - An RF device includes a substrate and a series circuit of a tunable RF component and a DC blocking capacitor. The series circuit is arranged on the substrate and couples an RF signal terminal to a fixed voltage terminal that is electrically isolated from the RF signal terminal. The tunable RF component is coupled to the RF signal terminal, the DC blocking capacitor is coupled to the fixed voltage terminal and a driver terminal is coupled to the tunable RF component. | 12-19-2013 |
20130335164 | FILTER ARRANGEMENT AND METHOD FOR PRODUCING A FILTER ARRANGEMENT - The invention relates to a filter arrangement ( | 12-19-2013 |
20130329574 | Circuit Arrangement for RF Loopback - A circuit arrangement includes a transceiver unit, a switching device coupled to the transceiver unit with a terminal and a control device coupled to the switching device. The control device is configured to operate in a first and in a second mode of operation. In the first mode of operation, the switching device is configured by the control device such that a first signal is routed from the transceiver unit via the switching device back to the transceiver unit in a feedback loop. In the second mode of operation, the switching device is configured by the control device such that a second signal is routed from the transceiver unit via the switching device to the terminal or the second signal is routed from the terminal via the switching device to the transceiver. | 12-12-2013 |
20130328448 | PIEZO ACTUATOR WITH PROTECTION AGAINST ENVIRONMENTAL INFLUENCES - A piezo actuator with protection against environmental influences comprises a layer stack ( | 12-12-2013 |
20130321103 | Broadband SAW Filter - A new type of very broad bandwidth filters with small insertion loss and high return loss are given. The new filter uses a substrate that can propagate a PSAW and fan shaped transducers of low metallisation height, high metallisation ratio, low reflectivity and high coupling coefficient. | 12-05-2013 |
20130320805 | ELECTROACOUSTIC TRANSDUCER WITH REDUCED LOSSES DUE TO TRANSVERSE EMISSION AND IMPROVED PERFORMANCE DUE TO SUPPRESSION OF TRANSVERSE MODES - The present invention relates to an electroacoustic transducer which is arranged in an acoustic track (AS) and on a piezoelectric substrate ( | 12-05-2013 |
20130300533 | Ceramic Multilayered Component and Method for Producing a Ceramic Multilayered Component - A ceramic multilayered component which includes a layer stack having a plurality of ceramic layers. The multilayered component includes a first and a second connecting contact as well as a first and a second inner electrode, which are each arranged between two layers of the layer stack. The multilayered component includes a first and a second via electrode for electrically coupling the first connecting contact to the first inner electrode and for electrically coupling the second connecting contact to the second inner electrode. | 11-14-2013 |
20130293317 | DIRECTIONAL COUPLER - The invention relates to a directional coupler ( | 11-07-2013 |
20130285511 | ACTUATOR UNIT, METHOD FOR PRODUCING AN ACTUATOR UNIT, AND SLEEVE FOR ACCOMMODATING A PIEZOACTUATOR - The invention relates to an actuator unit, which comprises a piezoactuator ( | 10-31-2013 |
20130285509 | METHOD FOR PRODUCING AN ACTUATOR UNIT AND SLEEVE FOR RECEIVING A PIEZOACTUATOR - The invention relates to a method for producing an actuator unit comprising a piezoactuator ( | 10-31-2013 |
20130271242 | BAND REJECTION FILTER COMPRISING A SERIAL CONNECTION OF AT LEAST TWO PI-ELEMENTS - The invention relates to a band rejection filter comprising a piezoelectric substrate (S) and a serial connection of at least two pi-elements (Pi | 10-17-2013 |
20130270968 | STACKABLE PIEZOELECTRIC ACTUATOR COMPONENT - A stackable piezoelectric actuator component ( | 10-17-2013 |
20130266297 | HEATING MODULE AND VAPORIZATION APPARATUS HAVING A HEATING MODULE - A heating module includes a housing with an opening, and a PTC ceramic heating element arranged in the housing having an inner face facing toward the opening, an outer face facing away from the opening and two end faces connecting the inner and outer faces, wherein the inner face is at least partially matched to the opening. | 10-10-2013 |
20130265912 | Antenna and RF Front-end Arrangement - An antenna and RF front-end arrangement include at least one LTE or WCDMA Tx&Rx antenna, one MIMO Rx or diversity antenna adapted for low band LTE or WCDMA and one MIMO Rx or diversity antenna adapted for high band LTE or WCDMA. At least one of the MIMO Rx or diversity antennas is adapted for transmitting and receiving WLAN and/or BlueTooth signals. Therefore, a dedicated WLAN antenna is not required and the number of antennas can be reduced. | 10-10-2013 |
20130257562 | ACOUSTIC WAVE FILTER HAVING REDUCED NON-LINEARITIES, AND METHOD FOR PRODUCTION - An acoustic wave filter having reduced non-linearities as well as a production method are disclosed. A filter comprises a first electroacoustic transducer having a first metallization ratio and a second electroacoustic transducer having a second metallization ratio. The metallization ratios range from 0.2 to 0.8, and the metallization ratio of the first transducer is no more than 0.8 times the metallization ratio of the second transducer. | 10-03-2013 |
20130257227 | Piezoelectric Component - A piezoelectric component comprises a parallelepipedal basic body made of piezoelectric material which has an input region and an output region at opposite longitudinal ends of the basic body. Furthermore, the piezoelectric component comprises first and second primary electrodes which are arranged inside the input region and first and second secondary electrodes which are arranged inside the output region. The primary electrodes are at a greater interval from longitudinal lateral faces of the basic body in a subregion which faces the output region than in the subregion which is remote from the output region. Likewise, the secondary electrodes are at a greater interval from the longitudinal lateral faces of the basic body in a subregion which faces the input region than in a subregion which is remote from the input region. | 10-03-2013 |
20130234806 | Circuit Arrangement - A circuit arrangement includes an antenna port, a transmission port, and a reception port, each of which is connected to one respective 20° hybrid that splits an input signal into two output signals that are in quadrature. The circuit arrangement also includes two duplexers which are connected in such a way that the two output signals emitted by the 20° hybrid that is connected to the transmission port constructively interfere on the antenna port, while spurious signals caused by the two output signals destructively interfere on the reception port. | 09-12-2013 |
20130228715 | CERAMIC MATERIAL BASED ON THE PEROVSKITE CERAMIC Bi0, 5Na0, 5TiO3, PIEZOELECTRIC ACTUATOR CONTAINING THE CERAMIC MATERIAL AND PROCESS FOR PRODUCING THE CERAMIC MATERIAL - A ceramic material having the general formula (BiXNayM<1>zLuM<2>Vw) (Ti1-sZs)03, where: M<1> comprises at least one element of main group 1, M<2> comprises at least one element of main group 2, L comprises at least one element of the lanthanides, V is a vacancy and Z is selected from among Zr, Hf and combinations thereof, is provided. Furthermore, a piezoelectric actuator comprising the ceramic material and a process for producing the ceramic material are provided. | 09-05-2013 |
20130214405 | Component and Method for Producing a Component - A component includes a substrate, a chip and a frame. The frame is bonded to the substrate and the chip rests on the frame. A sealing layer on parts of the frame and the chip is designed to hermetically seal a volume enclosed by the substrate, the chip and the metal frame. | 08-22-2013 |
20130212848 | Method for Monitoring Flexural Vibrations of a Piezoactuator - In the method for monitoring flexural vibrations of a piezoactuator, a small-signal spectrum of a piezoactuator, which is provided and mounted for the purpose of exciting longitudinal vibrations, is measured and an excitation of a transverse vibration in the piezoactuator is detected from resonances occurring in the small-signal spectrum. | 08-22-2013 |
20130207770 | Resistance Component and Method for Producing a Resistance Component - A resistance component includes a stack of ceramic layers and inner electrodes. Inner electrodes of a first type are electrically conductively connected to a first external contact and inner electrodes of a second type are electrically conductively connected to a second external contact. The inner electrodes of the first type are arranged such that there is no overlap with the inner electrodes of the second type. An inner electrode of a third type, which is electrically conductively connected neither to the first external contact nor to the second external contact, at least partially overlaps the inner electrodes of the first type and the inner electrodes of the second type. | 08-15-2013 |
20130207743 | DUPLEXER WITH BALUN - A duplexer is proposed with a substrate which has at least one patterned metallization plane and on which, at least to some extent, a transmission path (TX) and a reception path (RX) are arranged, both of which are connected to an antenna connection (ANT). The duplexer comprises a transmision filter (TXF) which is arranged in the transmission path (TX) and which has a first acoustic wase filter (BAW | 08-15-2013 |
20130200960 | Component Working with Acoustic Waves having Reduced Temperature Coefficient of Frequencies and Method for Producing Same - A component is designed to work with acoustic waves. Embodiments have an improved temperature gradient of the frequency range and have increased performance strength. To this end, the component includes a stack of layers having a lower bonding layer, an electrode layer, an upper bonding layer, a compensation layer, and a trimming layer. | 08-08-2013 |
20130200545 | Method for the Production of a Ceramic Green Sheet - In order to produce ceramic green sheets with embedded structures of a functional material, structures of a functional material are first created on a carrier. The same structures are then embedded in a slip layer of a ceramic base material. Nearly plane-parallel green sheets obtained in this manner can easily be further processed to produce ceramic multilayer components. | 08-08-2013 |
20130190040 | Front End Module and Method of Operation in Different Circuit Environments - A front end module has two signal paths for operation in two different frequency ranges which can be operated both with one antenna in the multiplex operating mode and with two antennas in a second operating mode. The respective operating mode is actuated via corresponding contact being made with the module substrate, and therefore by the user. | 07-25-2013 |
20130181581 | Piezoelectric Multilayer Actuator - A piezoelectric multilayer actuator includes a stack of piezoelectric layers arranged one above another and first electrode layers and second electrode layers arranged alternately one above another between said piezoelectric layers. The electrode layers extend into the stack from a first and a second lateral face of the stack and overlapping in the stack. The first lateral face holds a first contact element in electrical contact with the first electrode layers and the second lateral face ( | 07-18-2013 |
20130176686 | MODULE AND PRODUCTION METHOD - The invention specifies a module comprising a carrier substrate ( | 07-11-2013 |
20130170172 | METHOD FOR PRODUCING A PLURALITY OF ELECTRONIC DEVICES HAVING ELECTROMAGNETIC SHIELDING AND IN PARTICULAR HAVING HEAT DISSIPATION AND ELECTRONIC DEVICE HAVING ELECTROMAGNETIC SHIELDING AND IN PARTICULAR HAVING HEAT DISSIPATION - An electronic device comprises a substrate ( | 07-04-2013 |
20130169250 | Voltage Regulator and a Method for Reducing an Influence of a Threshold Voltage Variation - A voltage regulator can provide a regulated output voltage. The voltage regulator includes a regulating module that includes a resistor and a field effect transistor that has a threshold voltage. The resistor is coupled to a gate terminal and a source terminal of the field effect transistor. The regulating module provides the output voltage. A reference module is suitable for detecting a variation of the output voltage. The reference module is coupled with the regulating module. A current sink is suitable for subtracting a compensation current from the current flowing from the regulating module to the reference module. The compensation current is dependent on a variation of the threshold voltage. | 07-04-2013 |
20130168876 | MODULE PACKAGE AND PRODUCTION METHOD - The invention relates to a module package which comprises a module substrate | 07-04-2013 |
20130161574 | Cobalt-Free NTC Ceramic and Method for Producing a Cobalt-Free NTC Ceramic - The invention relates to a cobalt-free NTC ceramic having the composition Ni | 06-27-2013 |
20130141208 | Component - A component includes a component body and a contact-connection element composed of sheet metal having a contact region, which has an outer contour line and at least one hole. The contact region is arranged on a side of the component body having a side edge and the outer contour line has straight regions running along straight regions of the side edge. The straight regions of the outer contour line are connected by rounded corners. | 06-06-2013 |
20130141188 | DMS FILTER HAVING IMPROVED SIGNAL SUPPRESSION IN THE STOP BAND - A DMS filter has improved signal suppression in fly-back. At least two transformers of a first type are connected in parallel between a common node of the signal path and a ground connection/reference potential. A concentrated element is connected in the signal path of said transformers of the first type, so that the voltages present at the first transformers are different from each other. | 06-06-2013 |
20130140960 | Piezoelectric Multilayer Component and Method for Forming an External Electrode in a Piezoelectric Multilayer Component - A piezoelectric multilayer component is specified. At least one external electrode is fixed to a stack of piezoelectric layers and electrode layers arranged therebetween. At wherein at least one region of the external electrode projects beyond the stack and the external electrode is at least partly pressure-deformed in said region. Furthermore, a method for forming an external electrode in a piezoelectric multilayer component is specified. | 06-06-2013 |
20130140656 | MEMS Microphone And Method For Producing The MEMS Microphone - The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (SO | 06-06-2013 |
20130126466 | Method for Producing a Dielectric Layer on a Component - A method for producing a dielectric layer on the surface of a component is described. In particular embodiments, a dielectric layer having a planar surface can be generated over a substrate topography having raised structures. In a trimming process, a component property, which depends on the thickness or the third topography of the dielectric layer, is adjusted. | 05-23-2013 |
20130126222 | METHOD FOR PRODUCING AN ELECTRICAL MULTI-LAYER COMPONENT AND ELECTRICAL MULTI-LAYER COMPONENT - A method for producing an electrical multi-layer component is described, wherein a first ceramic layer ( | 05-23-2013 |
20130121523 | ELECTRIC COMPONENT HAVING A SHALLOW PHYSICAL SHAPE, AND METHOD OF MANUFACTURE - Electric components and methods of manufacture are specified. An electric component comprises a carrier having a recess which penetrates the carrier and also a first chip and external contact area. The first chip is arranged in the recess in the carrier. The external contact area is provided for connecting up the first chip to an external circuit environment. | 05-16-2013 |
20130120219 | Mobile Communication Device with Improved Antenna Performance - Mobile communication devices with improved antenna performance are provided. A mobile communication device includes a first antenna, a ground plane, and a diversity antenna. In a mode of operation which is not a multi-antenna transmission mode, the diversity antenna is electrically coupled to the ground plane. The diversity antenna increases the electrical length of the ground plane and enhances the antenna performance of the radiating assembly of the first antenna in combination with the ground antenna and the diversity antenna. | 05-16-2013 |
20130120084 | SAW Filter Operating in a Balanced/Unbalanced Manner - A SAW filter has two DMS tracks. Each DMS track includes six converters, with two converters each acting as input or output converters. The two DMS tracks are electrically connected in series by way of four pairs of coupling converters and the associated coupling lines. A common inner ground line is provided between the two DMS tracks, which extends over the entire length of the DMS tracks and crosses the coupling lines. The input converters of the first DMS track are connected to an asymmetrical port, while the output converters of the second DMS track are connected to a symmetrical port. | 05-16-2013 |
20130119492 | Miniaturized Electrical Component Comprising an MEMS and an ASIC and Production Method - The invention relates to a miniaturized electrical component comprising an MEMS chip and an ASIC chip. The MEMS chip and the ASIC chip are disposed on top of each other; an internal mounting of MEMS chip and ASIC chip is connected to external electrical terminals of the electrical component by means of vias through the MEMS chip or the ASIC chip. | 05-16-2013 |
20130113677 | Adaptive Antenna Module - A cheaper to produce, smaller and easy to drive adaptive antenna module is presented. The module comprises a signal path, an antenna, and a tuning circuit with two variable impedance elements. The tuning circuit operates over a restricted range of impedances and maintains the series resonance characteristic of the antenna. | 05-09-2013 |
20130082796 | COMPONENT - The present invention relates to a component (BE) which has a first duplexer operating with acoustic waves and a second duplexer operating with acoustic waves, wherein the first and second duplexers are arranged in a single SMD housing. In addition, the invention relates to a module (MO), which interconnects such a component (BE) and at least three 90° hybrids (HYB | 04-04-2013 |
20130070806 | Measuring Probe Having a Housing - A measuring probe has a housing for receiving a sensor element. The measuring probe can be inserted in an opening of a device for carrying a medium. The housing has a curved outer circumference line perpendicular to the insertion direction of the housing in the device. | 03-21-2013 |
20130057359 | ADJUSTABLE CAPACITATIVE ELEMENT - The invention relates to an adjustable capacitative element which can assume discrete capacity values the impedance values Z, of which that it can assume are distributed as evenly as possible in the Smith Chart. An adjustable capacitative element comprises a capacitor which can assume discrete capacity values. The phase of the reflection factor or the impedance values of the capacity values are interspaced equidistantly. | 03-07-2013 |
20130057114 | Piezoelectric Multilayer Component and Method for Producing a Piezoelectric Multilayer Component - The invention relates to a piezoelectric multilayer component as an intermediate, which comprises a stack of piezoelectric layers arranged on top of one another. The stack comprises an active region having electrode layers arranged between the piezoelectric layers and at least one inactive region, wherein the active region on the end product of the piezoelectric multilayer component is provided for the purpose of deforming when a voltage is applied to the electrode layers. The inactive region contains at least one sacrificial layer which comprises an electrically insulating material and a metal, wherein the metal can diffuse at least partially from the sacrificial layer into the piezoelectric layers of the inactive region by heating the multilayer component. | 03-07-2013 |
20130051588 | Electroacoustic Transducer having Reduced Losses due to Transverse Emission and Improved Performance due to Suppression of Transverse Modes - An electroacoustic transducer has reduced loss due to acoustic waves emitted in the transverse direction. For this purpose, a transducer comprises a central excitation area, inner edge areas flanking the central excitation area, outer edge areas flanking the inner edge areas, and areas of the busbar flanking the outer edge areas. The longitudinal speed of the areas can be set so that the excitation profile of a piston mode is obtained. | 02-28-2013 |
20130038387 | Detector Circuit - A detector circuit can be used for determining the reflection coefficients of HF signals in a signal path. The detector circuit includes a bidirectional hybrid coupler, logarithmic amplifiers connected to the hybrid couple, and a subtractor having an offset connection. | 02-14-2013 |
20130038177 | Piezoelectric Component - A piezo electrical component has a stack of piezo electrical layers arranged over each other and electrode layers arranged therebetween. The stack has at least one first piezo electrical layer having a first piezo electrical charge constant and, directly adjacent thereto, at least one second piezo electrical layer having a second piezo electrical charge constant. The piezo electrical charge constant describes an expansion of the piezo electrical layer perpendicular to an electrical field at a voltage 6 applied to the electrode layers. The first piezo electrical charge constant is different from the second piezo electrical charge constant. | 02-14-2013 |
20130033155 | Piezoelectric Component - A piezoelectric component includes at least one planned fracture layer for generating and guiding cracks in the component in a controlled manner. The planned fracture layer is disposed between two electrode layers adjacent to each other in the direction of the stack. The distance d | 02-07-2013 |
20130032588 | HEATING ARRANGEMENT - The invention relates to a heating arrangement in the shape of a frame. | 02-07-2013 |
20130027138 | AMPLIFIER CIRCUIT AND METHOD FOR SIGNAL SENSING - An amplifier circuit ( | 01-31-2013 |
20130026852 | Ceramic Multilayer Capacitor - A ceramic multilayer capacitor includes a first capacitor unit, which comprises a first material, and a second capacitor units, which comprises a second material. The first and the second capacitor unit are electrically connected in parallel. At low applied voltages, the first material has a high dielectric value and, at high applied voltages the second material has a high dielectric value. | 01-31-2013 |
20130015537 | PIEZORESISTIVE PRESSURE SENSOR AND PROCESS FOR PRODUCING A PIEZORESISTIVE PRESSURE SENSORAANM Nowak; BirgitAACI TeltowAACO DEAAGP Nowak; Birgit Teltow DEAANM Ostrick; BernhardAACI TeltowAACO DEAAGP Ostrick; Bernhard Teltow DEAANM Peschka; AndreasAACI MichendorfAACO DEAAGP Peschka; Andreas Michendorf DE - A pressure sensor ( | 01-17-2013 |
20130009841 | Impedance Matching Circuit Capable of Broadband Operation - A broadband-operable impedance filter has capacitive elements of variable capacitance in the signal path, an inductive element in a parallel path connected in parallel to the signal path, and inductive elements in the ground path. The impedance filter allows communication in a first frequency band and the reception of HF signals in a second frequency band. | 01-10-2013 |
20130005288 | Circuit for Impedance Matching - A circuit provided for impedance matching includes an input, an output and four impedance elements arranged between them. In this case, two of the impedance elements are connected in series in a main path and form a T configuration with a third component. In addition, a fourth component is connected in parallel with the main path of the circuit. By way of example, the components arranged in the main path are variable capacitances and the further components are inductances. | 01-03-2013 |
20130003253 | Varactor and Method for Producing a Varactor - A varactor includes a first PTC region, which comprises a ceramic material with a positive temperature coefficient with respect to the resistance. The varactor also includes a capacitor region that includes a first electrode, a second electrode, and a first dielectric layer arranged between the first electrode and the second electrode. The first PTC region and the capacitor region are connected thermally conductively to one another. The capacitance of the capacitor region can be changed by applying a bias to the first PTC region, the capacitor region or to the first PTC region and the capacitor region. | 01-03-2013 |
20130001218 | MOLDED BODY, HEATING DEVICE AND METHOD FOR PRODUCING A MOLDED BODY - A molded body is provided, having a first region ( | 01-03-2013 |
20120326808 | MICRO-ACOUSTIC FILTER HAVING COMPENSATED CROSS-TALK AND METHOD FOR COMPENSATION - The invention relates to a micro-acoustic filter having a first and a second converter, in which the electromagnetic and capacitive cross-talk between the first and second converters is compensated for by providing additional coupling capacitors and additional current loops. Additional coupling capacitors and current loops are arranged in such a manner that they can counteract the sign of the natural coupling specified by the design and thus completely compensate for said coupling. | 12-27-2012 |
20120326780 | COUPLER AND AMPLIFIER ARRANGEMENT - A coupler comprises a first line ( | 12-27-2012 |
20120326249 | MEMS MICROPHONE AND METHOD FOR MANUFACTURE - An improved method for manufacturing an MEMS microphone with a double fixed electrode is specified which results in a microphone which likewise has improved properties. | 12-27-2012 |
20120306326 | Piezoelectric Ceramic Material, Method for the Production Thereof, and Multilayer Component - A piezoelectric ceramic material has the general formula: P | 12-06-2012 |
20120306323 | Method for Producing a Piezoelectric Multilayer Component and a Piezoelectric Multilayer Component - A method for producing a piezoelectric multilayer component is disclosed. Piezoelectric green films and electrode material are provided, arranged alternately on top of one another and sintered. The electrode material is provided with a PbO-containing coating and/or PbO is mixed into the electrode material. | 12-06-2012 |
20120299131 | ARRANGEMENT WITH A MEMS DEVICE AND METHOD OF MANUFACTURING - An arrangement and a production method for the arrangement with at least one MEMS device, which comprises a package that closely encloses the MEMS device and seals it from ambient influences. The package comprises as sealing a PFPE layer of a perfluoropolyether polymerized with the aid of functional groups. | 11-29-2012 |
20120286586 | Impedance Circuit and Method for Signal Transformation - An impedance circuit includes an input terminal, a first and a second capacitive arrangement and an output terminal coupled to the input terminal by a network. The network includes the first and the second capacitive arrangement. The first capacitive arrangement includes a varactor circuit having a varactor and at least one series circuit. The at least one series circuit includes a capacitor and a switch in series connection and is coupled parallel to the varactor circuit. The second capacitive arrangement comprises an additional capacitor. | 11-15-2012 |
20120281335 | Temperature-Independent Capacitor and Capacitor Module - A capacitor includes a first heating element and a first capacitor region. The first capacitor region includes dielectric layers and internal electrodes. The internal electrodes are arranged between the dielectric layers. The first heating element and the first capacitor region are connected to each other in a thermally conductive manner. | 11-08-2012 |
20120280595 | Metallization having High Power Compatibility and High Electrical Conductivity - A metallization can be used for components working with acoustic waves. The metallization includes a base having a bottom layer comprising titanium, and an upper layer comprising copper. A top layer of the metallization disposed on the base comprises aluminum. | 11-08-2012 |
20120280593 | Solder Material for Fastening an Outer Electrode on a Piezoelectric Component and Piezoelectric Component Comprising a Solder Material - A solder material can be used for fastening an outer electrode on a piezoelectric component. The solder material contains tin as the main constituent and at least one addition from the group of cobalt, tungsten, osmium, titanium, vanadium, iron and rare earth metals. A piezoelectric component includes such a solder material. The solder material is applied by means of a base metallization. | 11-08-2012 |
20120275634 | MEMS MICROPHONE - A microphone comprising a substrate, a transducer element that is mounted on a top side of the substrate, a covering layer that covers the transducer element and forms a seal with the top side of the substrate, a shaped covering material that covers the substrate, the transducer element and the covering layer, and a sound opening that extends through the covering material and the covering layer. Methods for manufacturing a microphone and for manufacturing a plurality of microphones are also disclosed. | 11-01-2012 |
20120274439 | Device for Electrical Isolation and Toroidal Core Choke - A metallization can be used for components working with acoustic waves. The metallization includes a base having a bottom layer comprising titanium, and an upper layer comprising copper. A top layer of the metallization disposed on the base comprises aluminum. | 11-01-2012 |
20120273760 | Bipolar Transistor with Lateral Emitter and Collector and Method of Production - A bipolar transistor includes a substrate of semiconductor material, a high-mobility layer in the substrate, and a donor layer adjacent to the high-mobility layer. An emitter terminal forms an emitter contact on the donor layer, and a collector terminal forms a collector contact on the donor layer. A base terminal is electrically conductively connected with the high-mobility layer. The transistor can be produced in a HEMT technology or BiFET technology in GaAs. | 11-01-2012 |
20120268166 | Low-Current Logic Plus Driver Circuit - A circuit includes a logic stage, an inverter stage, and a driver stage. The logic stage and the inverter stage are provided with current limiters, which include a D-mode feedback transistor and a component that generates a voltage drop. A feedback loop connects the source and the gate of the D-mode feedback transistor via this component. The driver stage includes E-mode transistors connected in a totem pole that drive a D-mode transistor and an E-mode transistor to connect and disconnect the load circuit. | 10-25-2012 |
20120241990 | Ceramic Material, Method for Producing the Ceramic Material, and Resistor Component Comprising the Ceramic Material - A ceramic material has the following composition: (Ba | 09-27-2012 |
20120235766 | Surface Acoustic Wave Filter and Duplexer Component - A surface acoustic wave filter includes an arrangement of transducers having at least one first transducer one second transducer and one third transducer. The at least one first transducer is connected to the input terminal and a terminal for applying a reference potential. The second transducer is connected to the first output terminal and the terminal for applying the reference potential. The third transducer is connected to the second output terminal and the terminal for applying the reference potential. A capacitor is connected to at least one of a first and second output terminal in such a way that the capacitor is connected between the first and second output terminals or between one of the first and second output terminals and the terminal for applying the reference potential. | 09-20-2012 |
20120225259 | FLAT BACK PLATE - The present invention refers to a flat back plate, e.g. for MEMS capacitors e.g. for MEMS microphones. For that the back plate comprises a tensile element that exerts a horizontal tensile stress on its environment. | 09-06-2012 |
20120224726 | MEMS-MICROPHONE - A MEMS microphone having an improved noise performance due to reduced DC leakage current is provided. For that, a minimum distance between a signal line of the MEMS microphone and other conducting structures is maintained. Further, a DC guard structure fencing at least a section of the signal line is provided. | 09-06-2012 |
20120218728 | Carrier Device, Arrangement Comprising such a Carrier Device, and Method for Patterning a Layer Stack Comprising at Least One Ceramic Layer - A method for patterning a layer stack with at least one ceramic layer includes providing the ceramic layer, which has at least one plated-through hole. An electrically conductive layer is applied above the ceramic layer, such that the electrically conductive layer is electrically coupled to the at least one plated-through hole. A further layer is deposited onto the electrically conductive layer in the region of the at least one plated-through hole, wherein the further layer includes nickel. The electrically conductive layer is removed outside the region of the at least one plated-through hole. A carrier device patterned in this way can be electrically and mechanically coupled to an electronic component. | 08-30-2012 |
20120202382 | Piezoactuator Having Electrical Contact - A piezoactuator has multilayer construction. Piezoelectric layers and electrode layers are alternatingly disposed one over the other in a stack. A number of the electrode layers are electrically conductively connected to a contact pin. A continuation is electrically conductively disposed on the contact pin. The continuation has a contact point with the contact pin and a free end for producing an electrical connection of the piezoactuator. A straight line extending through the contact point and the free end of the continuation encloses an angle with the longitudinal axis of the contact pin that is greater than 0° and less than 180°. | 08-09-2012 |
20120200382 | Inductive Device with Improved Core Properties - An inductive component is proposed, having a winding and a core which comprises a plurality of core areas (1, 2) which contain different magnetic materials. | 08-09-2012 |
20120194298 | Filter Circuit Having Improved Filter Characteristic - A ladder-type-like filter circuit is specified with improved filter behavior. Inductive elements that interconnect parallel resonators with ground are electromagnetically coupled to one another. | 08-02-2012 |
20120188685 | Electrical Multilayer Component and Circuit Arrangement - An electrical multilayer component having has a monolithic main body that includes a number of alternating ceramic layers disposed one above the other and at least one electrode layer. The main body has two end faces opposite each other and two lateral faces opposite each other. The component also includes a number of outer electrodes and at least three inner electrodes. Each of the inner electrodes is associated with one outer electrode. A first inner electrode protruding from an end face and a second inner electrode protruding from an opposite end face have a first distance to each other. A third inner electrode protrudes from a side face. | 07-26-2012 |
20120181474 | CERAMIC MATERIAL AND PROCESS FOR PRODUCING THE CERAMIC MATERIAL - A material includes a ceramic material having a general formula of | 07-19-2012 |
20120175149 | Functional Module and Method for Producing the Functional Module - The invention relates to a functional module and a method for producing a functional module. The functional module includes an outer tube having a first and second end face and an inner surface. The functional module also includes an inner tube having a first and second end face and a lateral surface disposed within the outer tube. At least one molded part is disposed in a form-fitting manner between the inner surface of the outer tube and the shell surface of the inner tube. The functional module has a material with a positive temperature coefficient of electrical resistance. The first end face of the inner tube and the outer tube is disposed on an electrically isolative substrate and the molded part is thereby fixed between the outer tube and the inner tube by clamping force. | 07-12-2012 |
20120161903 | SAW Filter Circuit Having Improved ESD Resistance - A SAW filter circuit having improved ESD resistance is specified, in which a series interconnection composed of SAW resonators is interconnected between a first signal port and a DMS port. The static capacitance of the series interconnection is at most four times the static capacitance of the DMS transducers interconnected therewith. | 06-28-2012 |
20120159778 | Method for Connecting a Plurality of Unpackaged Substrates - A plurality of unpackaged substrates connected to one another is disclosed. The stepped structures on and/or in a first main area of a first substrate include a plurality of integrated circuits. The stepped structures run between the integrated circuits. The first conductor tracks extend from at least some contact connections of the respective integrated circuits as far as the stepped structures. The first substrate is connected on the side of the first main area to a further substrate. The first substrate is severed from a second main area opposite to the first main area such that the first substrate is divided into a plurality of substrate pieces. Each substrate piece has one of the integrated circuits. The first conductor tracks are accessible in interspaces between the substrate pieces. The second conductor tracks are formed from the second main area. At least some of the second conductor tracks lead from the second main area over side walls of the substrate pieces as far as the first conductor tracks. | 06-28-2012 |
20120146756 | Current Compensated Inductor and Method for Producing a Current Compensated Inductor - The invention relates to a current compensated inductor comprising a single piece annularly closed ferrite core. The ferrite core comprises at least two wire coils each comprising a flat wire wound on edge and disposed, for example, without a coil bobbin and at a distance from each other on the ferrite core. | 06-14-2012 |
20120127767 | Low-Current Inverter Circuit - The circuit includes an E-mode transistor with gate-source junction, a D-mode transistor with gate-source junction, a component generating a voltage drop between the source of the D-mode transistor and the drain of the E-mode transistor, and a connection between the drain of the E-mode transistor and the gate of the D-mode transistor. The gate of the E-mode transistor is provided for an input signal, and the drain of the E-mode transistor is provided for an output signal. | 05-24-2012 |
20120119616 | Piezoelectric Multilayer Component - A piezoelectric multilayer component includes a stack of sintered piezoelectric layers and inner electrodes that are arranged there between. A piezoelectric layer includes at least one piezoelectric film. At least one of the piezoelectric films is designed as a weakening film, wherein the thickness of the weakening film is substantially smaller than the thickness of at least one of the other piezoelectric films. | 05-17-2012 |
20120115355 | APPLIANCE INSTALLATION DEVICE AND METHOD FOR PRODUCING THE SAME - An appliance installation device for connection of an electrical appliance to a power supply system comprising a connecting unit for electrical connection of the appliance installation device to the power supply system, a housing, a mounting frame which has at least one aperture opening open on two sides, wherein the connecting unit, the mounting frame and the housing each form an individual module and the individual modules are connected to one another. | 05-10-2012 |
20120114145 | Microphone Arrangement - A microphone arrangement has an SMD housing with a sound inlet opening. A transducer receives sound waves through the sound inlet opening and converts the received sound waves into electrical signals. An analog-to-digital converter provides digital signals. An interface control unit with a digital interface is used by the chip to transmit data serially to an external device. At least one further interface is connected to a peripheral device such that the at least one further interface can be used to transmit data between the peripheral devices and the interface control unit. The transducer, the analog-to-digital converter, the interface control unit and the at least one further interface are integrated in the SMD housing. | 05-10-2012 |
20120113408 | Radiation Sensor for Detecting the Position and Intensity of a Radiation Source - A radiation sensor is provided for detecting the position and intensity of a radiation source. The radiation sensor includes at least one photodetector having a radiation-sensitive surface. Furthermore, the radiation sensor includes a reflector that reflects the radiation emitted by a radiation source from specific directions at least partly in the direction of the radiation-sensitive surface of the photodetector. The reflector is arranged on that side of the radiation sensor that is remote from the radiation source. | 05-10-2012 |
20120112834 | Device Comprising a Controlled Matching Stage - A device includes a matching stage coupled between a first signal terminal and a second signal terminal. A signal path extends between the first signal terminal and the second terminal. An adjustable impedance element is connected to the signal path. A detection circuit is coupled to the signal path and configured to derive matching information. A control circuit is coupled between the detection circuit and the adjustable impedance element. The control circuit is configured to control the adjustable impedance element. | 05-10-2012 |
20120112801 | Low-Current Input Buffer - A current-limited differential entry stage compares an input signal to a reference voltage generated by a current-limited transistor or diode configuration. Current limiters comprise a D-mode feedback transistor having a gate-source junction. The D-mode transistor is not conducting between the source and the drain if a gate-source voltage is more negative than a negative threshold voltage, and conducting between the source and the drain, otherwise a feedback connection connects the source of the D-mode feedback transistor to its gate via a component that generates a voltage drop. | 05-10-2012 |
20120112793 | Low-Current Logic-Gate Circuit - A circuit includes E-mode transistors with gate-source junction, a D-mode transistor with gate-source junction. A component generates a voltage drop between the source of the D-mode transistor and the drain of an E-mode transistor provided as a signal output. A connection is made between this drain of the E-mode transistor and the gate of the D-mode transistor, and a signal input at the gates of the E-mode transistors. | 05-10-2012 |
20120098386 | Ceramic Material, Method for Producing said Ceramic Material and Component Comprising said Ceramic Material - The invention relates to a ceramic material of the formula [(Bi | 04-26-2012 |
20120093346 | MEMS MICROPHONE - A microphone package wherein an MEMS microphone chip (MIC) is mounted on a substrate (SUB) and is sealed with a cover (ABD) with respect to the substrate. The membrane (MMB) of the microphone chip is connected to a sound entry opening (SEO) in the substrate via an acoustic channel. As a result of defined dimensioning of, in particular, the cross section and length of sound entry opening and channel, an acoustic low-pass filter is formed, the −3 dB attenuation point of which is significantly below the natural resonance of microphone membrane and package. | 04-19-2012 |
20120093046 | Antenna Arrangement - An antenna arrangement has a first signal path connected to a first antenna. A second signal path is connected to a second antenna. A third signal path includes a device that measures the signal strength. Directional couplers couple the first and second signal paths to the third signal path. Filters filter out signal components that are coupled by one antenna into the other antenna. | 04-19-2012 |
20120091862 | Electrode, Microacoustic Component and Production Method for an Electrode - A microacoustic component includes an active layer and an electrode. The electrode includes a first metal layer facing the active layer, a second metal layer facing away from the active layer, and a third layer arranged between the first metal layer and the second metal layer. The third layer serves as a diffusion barrier. | 04-19-2012 |
20120063368 | Communication System and Method for Transmitting and Receiving Signals - A communication system transmits signals having frequencies that lie within a transmission band and receives signals having frequencies that lie within a reception band. The system includes a duplexer and an antenna. The duplexer includes a transmission branch and a reception branch. The transmission branch includes a transmission filter, a transmission phase shifting network and a transmission matching network. The reception branch includes a reception filter, a reception phase shifting network and a reception matching network. The transmission matching network and the reception matching network have predominately constant phase shifts over frequencies within the reception band and within the transmission band, respectively. The antenna is coupled to the transmission matching network and to the reception matching network, and shows a predominantly reactance-only impedance variation over frequencies in the transmission band and over frequencies in the reception band. | 03-15-2012 |
20120062431 | Front End Module Comprising an Antenna Tuner - A front end module for a wireless transmission/reception device has two antennas and two signal paths connected thereto. A mismatch in the antenna is identified by monitoring the transmitted power and the reflected power in the active and passive signal paths and using the powers in a controller to generate a control signal for the antenna tuner. In this case, decreasing isolation between the first and second antennas and the first and second signal paths is identified, and is compensated for using different devices, in order to ensure faster and safer antenna matching. | 03-15-2012 |
20120062075 | Piezoelectric Component - A piezoelectric component includes a stack of piezoelectric layers arranged one on top of the other and first and second electrode layers arranged therebetween. The stack includes at least one first piezoelectric layer having a first electrical coercive force and directly adjacent thereto at least one second piezoelectric layer having a second electrical coercive force different from the first coercive force. | 03-15-2012 |
20120061778 | Method and Apparatus for Producing Chip Devices, and Chip Device Produced by Means of the Method - A chip device is produced providing at least one wafer having a plurality of chip components. The wafer or wafers are separated into the individual chip components and/or into groups of chip components. The individual chip components and/or the groups of chip components are applied to a carrier element, in such a way that interspaces having a predetermined width are formed between the individual chip components and/or the groups of chip components. A polymer is introduced into the interspaces in order to form a composite element composed of the chip components and a polymer matrix. The composite element is separated in such a way that chip devices composed of in each case one of the chip components and at least one section of the polymer matrix are formed. The invention furthermore relates to a chip device produced by means of the method. | 03-15-2012 |
20120057617 | SENSOR ARRANGEMENT AND METHOD FOR PRODUCTION - A sensor arrangement has at least one sensor element with electrical connections. At least one sensor element is arranged in a solid plastic-material body, at least a first insulating layer, which encloses the sensor element, being arranged between the sensor element and the plastic-material body. The sensor element senses at least one physical property of a medium to be measured. | 03-08-2012 |
20120056507 | Microacoustic Component and Production Method - The microacoustic component has a substrate that has at least one layer (composed of a dielectric or piezoelectric material, and a metallic strip structure. The layer is composed of a dielectric or piezoelectric material and/or the metallic strip structure have/has been produced or can be produced by the atomic layer deposition method. | 03-08-2012 |
20120044039 | Electrical Multilayer Component - The electrical multilayer component includes a base body with external electrodes and internal electrodes. A ceramic varistor layer is provided with the first internal electrode, and a dielectric layer adjoins the varistor layer. The dielectric layer has at least one opening filled with a semiconducting material or a metal. | 02-23-2012 |
20120032757 | Multilayer Component and Production Method - A multilayer component includes a dielectric ceramic material that can be co-sintered with a varistor ceramic to form a monolithic multilayer component according to the invention. The multilayer component therefore includes a layer of a varistor ceramic and another layer of a dielectric. Both layers can be arranged directly adjacent to one another in the multilayer component. In the multilayer component, metallizations are arranged on or between the ceramic layers. The metallizations are structured to form conductor sections and metallized areas. The metallizations form together with the ceramic layers alongside a varistor at least one further component selected from at least one of the component functions. | 02-09-2012 |
20120019972 | Surge Arrester and Arrangement of a Plurality of Surge Arresters to Form an Array - A surge arrester includes a gas-filled closed arrester body that is formed by a first annular ceramic body and two electrodes at a distance from one another. A second annular ceramic body is arranged in the interior of the arrester body and is at a distance from the first ceramic body and has a physical height that is less than the physical height of the first ceramic body. | 01-26-2012 |
20120019107 | Piezo Actuator in Multi-Layered Construction - A multilayer piezo actuator is specified, in which piezoelectric layers and electrode layers are arranged to form a stack. Electrical contact is made with the electrode layers via two external electrodes which consist of wires which are woven with one another. The external electrodes are in this case connected over their entire area to the side surfaces of the stack. A method is also specified for fitting an external electrode. | 01-26-2012 |
20120014029 | Surge Arrester - A surge arrester includes a housing with a tubular insulating body and at least two electrodes. A layer sequence includes at least one electrically conductive or semiconductive layer, at least one electrically conductive layer and at least one insulating layer and is arranged at least in sub-areas on the inside of the insulating body. | 01-19-2012 |
20120007695 | High-Frequency Swinging Choke - A high-frequency swinging choke has at least two rod cores arranged next to one another in the longitudinal direction. The rod cores each have at least one winding. The windings are connected in series. | 01-12-2012 |
20120007690 | Adaptive Impedance Matching Network - An adjustable impedance matching network for providing an adjustable matching impedance (Rm) is presented. The matching network includes first and second impedance adjusting circuits. The first impedance adjusting circuit is adapted to adjust the value of an imaginary part of the matching impedance whilst substantially maintaining the value of a real part of the matching impedance based on frequency information frequency and a target reference value. The second impedance adjusting circuit is adapted to adjust the value of an imaginary part of the matching impedance to be substantially equal to zero based on the frequency information, so as to adjust the real part of the matching impedance to be substantially equal to the target reference value. | 01-12-2012 |
20120007475 | CONSTRUCTION ELEMENT THAT OPERATES WITH ACOUSTIC WAVES, AND METHOD FOR THE MANUFACTURE THEREOF - A component that operates with acoustic waves includes a substrate including a piezoelectric material, a first electrode plane in which bottom electrode structures including an acoustically active bottom electrode are arranged directly on the substrate, and a top electrode arranged above the bottom electrode plane and which is electrically conductively connected to the bottom electrode structures, wherein excitation of the acoustic waves during operation of the component is effected exclusively or predominantly through the bottom electrode structures. | 01-12-2012 |
20120001727 | SAW FILTER - A SAW filter includes at least four electrically interconnected DMS tracks. First and second tracks of the at least four DMS tracks are connected in parallel in opposite directions to form a first filter element. The first and second tracks have two resonant frequencies that are offset from one another from track to track within the first filter element such that they define a common passband by virtue of a lower-frequency resonance of the first track being in phase at the same frequency as a higher-frequency resonance of the second track. Third and fourth tracks of the at least four DMS tracks can be connected in a similar fashion to form a second filter element. The passbands of the first and second filter elements are offset from one another and each comprise one of two channels of a two-channel filter. | 01-05-2012 |
20110319255 | VARISTOR CERAMIC, MULTILAYER COMPONENT COMPRISING THE VARISTOR CERAMIC, AND PRODUCTION METHOD FOR THE VARISTOR CERAMIC - A varistor ceramic includes the following materials: Zn as the main component, Pr in a proportion of 0.1 to 3 atom %, and a metal M selected from Y, Ho, Er, Yb and Lu in a proportion of 0.1 to 5 atom %. | 12-29-2011 |
20110316649 | Reactance Filter Having a Steep Edge - A reactance filter includes a series branch that connects a signal input to a signal output. At least one parallel branch branches off from the series branch with respect to ground. A parallel resonator is arranged in each parallel branch. Two or more series resonators are connected in series in the series branch. A capacitor is connected in parallel with one of the series resonators in the series branch. | 12-29-2011 |
20110299220 | Electrical Multi-Layered Component and Circuit Arrangement Comprising the Same - An electrical multi-layered component includes a monolithic base member that has a plurality of ceramic layers and electrode layers disposed one on top of the other in alternating fashion. The base member includes two end surfaces opposite to one another and two side surfaces opposite to one another. The multi-layered component includes a plurality of external electrodes and a plurality of internal electrodes (designed into the electrode layers. The internal electrodes at least partially overlap and form overlap areas. Each internal electrode is associated with a respective external electrode. At least one first internal electrode extending from an end surface overlaps with at least one second internal electrode ( | 12-08-2011 |
20110299213 | VARISTOR CERAMIC, MULTILAYER COMPONENT COMPRISING THE VARISTOR CERAMIC, AND PRODUCTION METHOD FOR THE VARISTOR CERAMIC | 12-08-2011 |
20110299211 | Surge Arrester Having a Short-Circuit Device - A surge arrester includes a short-circuit device. The short-circuit device includes at least one first base element. The first base element is rigidly connected in an electrically conducting and mechanical manner to a first electrode of the surge arrester. The short-circuit device also includes at least one spring arm arranged on the base element. The free end of the spring arm has a distance to the base element, and the spring arm extends over at least two adjoining electrodes of the surge arrester. | 12-08-2011 |
20110298685 | Impedance Adjustment Circuit for Adjusting Planar Antennas - An impedance matching circuit for matching planar antennas includes a signal path with a signal path input and a signal path output. A first capacitive element with variable capacitance is connected between the signal path input and signal path output. A second capacitive element with variable capacitance is connected between the signal path and ground. A first inductive element is connected between the signal path input and ground. A second inductive element is connected between the signal path output and ground. An antenna line with an impedance between 30 and 60 ohm is connected to the signal path output. | 12-08-2011 |
20110298337 | Piezoelectric Multilayer Component having a Disturbance Material and Method of Forming Same - A piezoelectric multilayer component includes a stack of piezoceramic layers, which are arranged one on top of the other, and electrode layers. The stack has a first area and a second area. The second area contains a disturbance material, which is used to make the second area less mechanically robust than the first area. | 12-08-2011 |
20110298064 | SENSOR MODULE AND METHOD FOR PRODUCING SENSOR MODULES - Sensor module, comprising a carrier, at least one sensor chip and at least one evaluation chip which is electrically coupled to the sensor chip. The carrier has a cutout, in which the sensor chip is at least partly situated. The evaluation chip is arranged on the carrier and at least partly covers the cutout. | 12-08-2011 |
20110297666 | Heating Apparatus and Method for Producing the Heating Apparatus - A heating apparatus and a method for producing a heating apparatus are specified. The heating apparatus comprises a pipe ( | 12-08-2011 |
20110291522 | Ceramic Material, Method for the Production of the Ceramic Material and Component Comprising the Ceramic Material - The invention relates to a ceramic binary material and to a method for the production thereof. The material has piezoelectric properties and has a composition of the formula (1−x)(Bi | 12-01-2011 |
20110280147 | Front-End Module and Method for Testing a Front-End Module - For simpler and more rapid testing of a front-end module, additional linked operating states are provided in the switch and/or its decoder and allow a plurality of paths to be enabled in parallel, in order in this way to test these paths with a smaller number of test routines in a test set, in particular a network analyzer. | 11-17-2011 |
20110277913 | Method for Producing a Multilayer Element - A ceramic multilayer element can be produced by pressing together a plurality of ceramic multilayer segments. Each multilayer segment includes a stack of a plurality of ceramic layers that are pressed together. | 11-17-2011 |
20110261536 | Electronic Component Assembly Comprising a Varistor and a Semiconductor Component - An electric component assembly comprising a semiconductor component ( | 10-27-2011 |
20110259502 | Ceramic Material, Method for Producing the Same, and Electro-Ceramic Component Comprising the Ceramic Material - A method for producing a ceramic material is disclosed. A ceramic raw material mixture is produced by comminuting and mixing starting materials containing Pb, Zr, Ti, Nd and oxygen. Nickel or an nickel compound is introduced. The raw material mixture is calcined and a ceramic is sintered. | 10-27-2011 |
20110254652 | PTC-RESISTOR - A PTC-resistor includes a base body made of a ceramic material with a positive temperature coefficient of resistance. The base body extends along a median plane, and is confined by surfaces. At least one surface is configured to electrically connect the base body. An area of the at least one surface is larger than an area of a parallel projection of the base body in a direction perpendicular to the median plane. | 10-20-2011 |