DYNEA AS
DYNEA AS Patent applications | ||
Patent application number | Title | Published |
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20140014267 | LOW FORMALDEHYDE EMISSION ADHESIVE SYSTEM - The invention relates to an improved two component adhesive system, a kit comprising said two adhesive components, its use and a method for production of interior wood products, in particular form-pressed products, parquet floor elements and solid wood panels with very low formaldehyde emission and to the interior wood products obtainable having improved properties. | 01-16-2014 |