DALSA SEMICONDUCTOR INC.
|DALSA SEMICONDUCTOR INC. Patent applications|
|Patent application number||Title||Published|
|20100173436||METHOD OF MAKING BIOMEMS DEVICES - A MEMS device is manufactured by first forming a self-aligned monolayer (SAM) on a carrier wafer. Next, a first polymer layer is formed on the self-aligned monolayer. The first polymer layer is patterned form a microchannel cover, which is then bonded to a patterned second polymer layer on a device wafer to form microchannels. The carrier wafer is then released from the first polymer layer.||07-08-2010|
|20090242512||DEEP REACTIVE ION ETCHING - In a method of performing an anisotropic etch on a substrate in an inductively coupled plasma etch chamber, at least three cycles of a procedure consisting essentially of the four following steps are performed:||10-01-2009|
|20090029533||METHOD OF CONTROLLING FILM STRESS IN MEMS DEVICES - A structural film, typically of silicon, in MEMS or NEMS devices is fabricated by depositing the film in the presence of a gas other than nitrogen, and preferably argon as the carrier gas.||01-29-2009|
|20080299695||MICROCHANNELS FOR BioMEMS DEVICES - A method is disclosed for making a MEMS device wherein anhydrous HF exposed silicon nitride is used as a temporary adhesion layer allowing the transfer of a layer from a Carrier Wafer to a Device Wafer.||12-04-2008|
Patent applications by DALSA SEMICONDUCTOR INC.