C. UYEMURA & CO., LTD. Patent applications |
Patent application number | Title | Published |
20160042754 | METAL MEMBER FOR MAGNETIC STORAGE MEDIUM AND MAGNETIC STORAGE MEDIUM - A metal member for magnetic storage medium includes an aluminum alloy substrate, and a nonmagnetic layer formed on at least one surface of the aluminum alloy substrate, and the nonmagnetic layer comprises a Ni—Cu—P based alloy containing 5 mass % to 50 mass % Cu and 100 ppm to 1000 ppm Pb. | 02-11-2016 |
20150289382 | PRODUCTION METHOD FOR PRINTED WIRING BOARD AND PRINTED WIRING BOARD PRODUCED BY SAID METHOD - This method includes the steps of forming a second resin layer ( | 10-08-2015 |
20150042026 | CLAMPER AND HOLDING JIG INCLUDING SAME - A clamper includes: a first clamping member having a first base portion and a first contact portion that is to be in contact with one surface of the workpiece; a second clamping member having a second contact portion that is to be in contact with the other surface of the workpiece; and a clamping member biasing member configured to bias at least one of the first clamping member and the second clamping member in a direction of bringing the first contact portion and the second contact portion closer to each other. The first contact portion has a plurality of plate spring portions extending from the first base portion, the plurality of plate spring portions configured to elastically deform independently from each other to come into contact with the workpiece. | 02-12-2015 |
20140339463 | DESMEAR SOLUTION AND DESMEAR METHOD - The present invention provides a desmear solution and a desmear method using said desmear solution, the desmear solution being capable of certainly removing a smear inside a non-through hole formed in a resin substrate and also capable of forming a plating film excellent in adhesion without excessive roughening of a surface of the resin substrate. The present invention uses the desmear solution containing a permanganate having a concentration of 0.2 to 0.4 mol/L and an alkali metal hydroxide and having a molar concentration ratio of said permanganate to said alkali metal hydroxide of 1:5 to 1:20. | 11-20-2014 |
20140242288 | REDUCING ELECTROLESS SILVER PLATING SOLUTION AND REDUCING ELECTROLESS SILVER PLATING METHOD - Provided are a reducing electroless silver plating solution and a reducing electroless silver plating method using the silver plating solution, the reducing electroless silver plating solution being capable of preventing decomposition of silver in the plating solution thereby to maintain stability of the solution and also being capable of preventing excessive roughening of an underlying metal or the like thereby to form a plating film having good film characteristics and a good appearance. The reducing electroless silver plating solution according to the present invention comprises a water-soluble silver salt and a reducing agent, wherein cyanide ions in a concentration of 0.006×10 | 08-28-2014 |
20140230858 | Workpiece Surface Treatment System - A method for rinsing a treatment cell of a workpiece surface treatment system, which obtains a surface-treated workpiece by sequentially carrying the treatment cell containing the workpiece to a series of apparatuses for operations in the respective apparatuses is provided. A surface treatment apparatus performs a surface treatment on the workpiece by receiving the treatment cell from a carrying apparatus and supplying a surface treatment liquid to the inside of the treatment cell while rotating the treatment cell. A workpiece collection apparatus collects the workpiece by receiving the treatment cell from the carrying apparatus, inverts the treatment cell, and squirts the inside of the treatment cell with water from below to flow out the workpiece. The carrying apparatus carries the treatment cell to the surface treatment apparatus, and then to the workpiece collection apparatus. | 08-21-2014 |
20140120245 | PLATING METHOD - The invention eliminates defects generated in a metal filling a through hole of a printed board by changing an angle at which a plating solution is sprayed or by changing a posture of the printed board at a time point in a process of precipitating the metal from the plating solution and filling the through hole with the precipitated metal while the plating solution or air bubbles are being sprayed onto the printed board. | 05-01-2014 |
20140116334 | SURFACE TREATING APPARATUS - An tank such as an electroless copper plating tank | 05-01-2014 |
20140053774 | SURFACE TREATING APPARATUS - A tank body | 02-27-2014 |
20130341199 | ELECTRO COPPER PLATING ADDITIVE AND ELECTRO COPPER PLATING BATH - Provided are an additive for electro copper plating and an electro copper plating bath containing the additive, wherein the additive forms a plating film uniformly in a range of from a low current density portion to a high current density portion and thereby gives good glossiness, and is not consumed at the time of non-usage thereof. In the present invention, an additive for electro copper plating including a block polymer compound expressed by the following general formula (1) is added to an electro copper plating bath. (Here, in the formula, R represents an alkyl group or an alkenyl group having a linear-chain or branched-chain structure and having a carbon number of 1 to 15, m is an integer of from 1 to 30, and n is an integer of from 1 to 40.) | 12-26-2013 |
20130295294 | ELECTROLESS COPPER PLATING BATH AND ELECTROLESS COPPER PLATING METHOD - Provided are an electroless copper plating bath and an electroless copper plating method using the electroless copper plating bath, the electroless copper plating bath not containing formaldehyde; being usable under approximately neutral pH conditions; improving plating bath stability; and capable of forming a plating film with a good thickness while controlling deposition outside a pattern. The electroless copper plating bath according to the present invention contains a water-soluble copper salt, and amine borane or a substituted derivative thereof as a reducing agent; does not contain formaldehyde; and has a pH of 4 to 9, wherein polyaminopolyphosphonic acid as a complexing agent, an anionic surface-active agent, an antimony compound, and a nitrogen-containing aromatic compound are contained. | 11-07-2013 |
20130001087 | SURFACE TREATING APPARATUS AND PLATING TANK - To prevent a plate-like work in a plating tank from swinging to improve quality of plating and prevent dropout or damages of a printed circuit board during transportation. A plating tank | 01-03-2013 |
20120298505 | ELECTROLYTIC REGENERATION UNIT AND ELECTROLYTIC REGENERATION APPARATUS USING SAME - An anode pipe includes a main pipe portion and a secondary pipe portion. The anode pipe has an inner circumferential surface that functions as an anode. The main pipe portion has a first connection end portion and a second connection end portion. The main pipe portion forms a flow channel for a treatment liquid that continues from the first connection end portion to the second connection end portion. The secondary pipe portion extends in a tubular fashion from the intermediate section of the main pipe portion. The interior of the secondary pipe portion communicates with the flow channel inside the main pipe portion. The cathode is disposed at a distance from the inner circumferential surface of the anode pipe. The cathode extends from a cathode attachment end portion toward the main pipe portion inside the secondary pipe portion. | 11-29-2012 |
20120279869 | CHROMIUM PLATING METHOD - A chromium plating method wherein an article to be plated is immersed in an acidic chromium electroplating bath and electrolysis is carried out using a positive electrode that has an iridium oxide-containing film at least on the surface. The acidic chromium electroplating bath contains a trivalent chromium compound and a hexavalent chromium compound at a ratio such that the total chromium concentration of trivalent chromium and hexavalent chromium is 60-140 g/L, the hexavalent chromium concentration is 5-40 g/L, and the ratio of the hexavalent chromium concentration is 5-35% by mass of the total chromium concentration, while containing 50-400 g/L of organic carboxylate ions and having a lead ion concentration of not more than 2 mg/L. By the method, a chromium plating film that is good and stable over a long time period can be obtained. In addition, the plating bath can be controlled extremely easily in the chromium plating method. | 11-08-2012 |
20120171363 | CATALYST APPLICATION SOLUTION, ELECTROLESS PLATING METHOD USING SAME, AND DIRECT PLATING METHOD - Disclosed is a catalyst application solution for plating an insulating portion of an object to be plated that comprises the insulating portion. The catalyst application solution is characterized by containing a water-soluble palladium compound, a reducer, a dispersant, catechol, a copper antioxidant and a buffering agent, and by having a pH of not less than 4. When the catalyst application solution is compared with a Pd—Sn colloidal solution, the catalyst application solution has the following advantages: since the catalyst application solution is a colloidal solution of Pd only that does not contain Sn, a pre-dip process and an Sn removal process are unnecessary and thus the catalyst application process can be simplified; since the catalyst application solution has a pH of not less than 4, haloing does not occur; and since the catalyst application solution is in a reducing atmosphere due to the reducer contained therein, a copper surface is not oxidized and no copper dissolution occurs, thereby causing no palladium displacement reaction. | 07-05-2012 |
20120167916 | NEUTRALIZING/REDUCING AGENT, AND DESMEAR METHOD - Disclosed is a neutralizing/reducing agent for neutralizing/reducing an oxidizing agent component that is adsorbed and remains on an object to be coated after the object is subjected to a desmear treatment with the oxidizing agent, which comprises a thioamide compound and a non-aromatic thiol compound. The neutralizing/reducing agent does not generate any gas during a neutralization/reduction treatment, and therefore the occurrence of defects caused by the neutralization/reduction on the surface of a through hole or a blind via hole can be prevented. Further, the neutralizing/reducing agent hardly dissolves copper, and therefore the occurrence of haloing can be prevented, and the blistering caused by the etching between an inner layer copper and a resin with the neutralizing/reducing agent can also be prevented. | 07-05-2012 |
20120058276 | SOLUTION FOR PROCESSING OF METAL REPLACEMENT WITH METAL ALUMINUM OR ALUMINUM ALLOY AND METHOD FOR SURFACE PROCESSING USING SUCH SOLUTION - There is disclosed a processing solution for metal replacement for metal aluminum or an aluminum alloy. The processing solution is used for surface processing of an underlying aluminum material. The processing solution for metal replacement removes an oxide film on the underlying aluminum material and suppresses corrosive attack to it to allow a plating film having high smoothness and good plating appearance to be deposited on the underlying aluminum material. The processing solution for metal replacement at least includes a metal salt capable of being replaced with aluminum, and an alkaline compound. A quaternary ammonium hydroxide is contained in the processing solution for metal replacement as the alkaline compound. | 03-08-2012 |
20120058254 | ELECTROLESS PLATING SOLUTION, METHOD FOR ELECTROLESS PLATING USING THE SAME AND METHOD FOR MANUFACTURING CIRCUIT BOARD - Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of μm, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. | 03-08-2012 |
20120017458 | Surface Treatment Apparatus - The surface treatment apparatus includes: a supply device for supplying an introduced workpiece to the inside of a treatment cell of a subsequent surface treatment device; a surface treatment device for supplying a surface treatment liquid to the inside of the treatment cell while rotating the treatment cell, thereby performing a surface treatment on the workpiece; a workpiece collection device for inverting the treatment cell, and squirting the inside of the treatment cell with water from below to flow out the workpiece, thereby collecting the workpiece into a collection vessel; a drying device for receiving the collection vessel from the workpiece collection device, and exposing the workpiece within the collection vessel to air, thereby drying the workpiece; and a carrying device for carrying the treatment cell between the surface treatment devices, and between the surface treatment device and the workpiece device, wherein the surface treatment apparatus includes the one or more surface treatment devices. | 01-26-2012 |
20110315658 | ALUMINUM OXIDE FILM REMOVER AND METHOD FOR SURFACE TREATMENT OF ALUMINUM OR ALUMINUM ALLOY - Disclosed herein is an aluminum oxide film remover for removing an oxide film on the surface of aluminum or aluminum alloy, which comprises silver ions and/or copper ions, a solubilizing agent for silver ions and/or copper ions, and a quaternary ammonium hydroxide compound, and has a pH value of 10 to 13.5. A method for surface treatment of aluminum or aluminum alloy is also disclosed, which comprises immersing a workpiece having aluminum or aluminum alloy at least on the surface thereof in the aluminum oxide film remover, and depositing the silver and/or copper contained in the remover on the surface of aluminum or aluminum alloy while removing the aluminum oxide film. | 12-29-2011 |
20110284037 | Surface Treatment Apparatus - The surface treatment apparatus includes: a supply device for supplying an introduced workpiece to the inside of a treatment cell of a subsequent surface treatment device; a surface treatment device for supplying a surface treatment liquid to the inside of the treatment cell while rotating the treatment cell, thereby performing a surface treatment on the workpiece; a workpiece collection device for inverting the treatment cell, and squirting the inside of the treatment cell with water from below to flow out the workpiece, thereby collecting the workpiece into a collection vessel; a drying device for receiving the collection vessel from the workpiece collection device, and exposing the workpiece within the collection vessel to air, thereby drying the workpiece; and a carrying device for carrying the treatment cell between the surface treatment devices, and between the surface treatment device and the workpiece device, wherein the surface treatment apparatus includes the one or more surface treatment devices. | 11-24-2011 |
20110259373 | METHOD AND AGENT FOR SURFACE PROCESSING OF PRINTED CIRCUIT BOARD SUBSTRATE - A surface processing method and a surface processing agent for effectively removing smear produced in a via or the like are disclosed. The smear is to be removed without etching an inner metalized layer without using expensive permanganates that might impose a greater load on an environment and operators. By removing the smear, the tightness in adhesion between an inner metalized circuit layer and plating metal as well as reliability in electrical connection may be improved. To this end, a surface processing method for a resin-containing substrate of a printed circuit board is provided in which the smear left in an opening, such as a blind via, a through-hole or a trench, formed in the substrate, may be removed without etching a metalized inner layer. The surface processing method immerses the interconnect substrate in a weakly acidic to weakly alkaline first processing solution at least containing hydrogen peroxide and subsequently in a second processing solution at least containing an alkali compound and an organic solvent. | 10-27-2011 |
20110214994 | PRETREATING AGENT FOR ELECTROPLATING, PRETREATMENT METHOD FOR ELECTROPLATING, AND ELECTROPLATING METHOD - A pretreating agent for electroplating includes an aqueous solution containing, as essential ingredient, (A) at least one anti-adsorption agent selected from among a triazole compound, a pyrazole compound, an imidazole compound, a cationic surfactant, and an amphoteric surfactant, and (B) chloride ion. The pretreating agent does not impair adhesion between substrate copper and a photoresist, and does not damage adhesion between the substrate copper and an electrolytic copper plating film. | 09-08-2011 |
20110146732 | Workpiece Surface Treatment System - A workpiece surface treatment system, which obtains a surface-treated workpiece by sequentially carrying a treatment cell containing a workpiece to a series of apparatuses for operations in the respective apparatuses, is characterized by including: a carrying apparatus for sequentially carrying the treatment cell to a series of the apparatuses in the system; a carrying-in/out apparatus for carrying the treatment cell in and out of the carrying apparatus; a surface treatment apparatus for performing a surface treatment on the workpiece by receiving the treatment cell from the carrying apparatus and supplying a surface treatment liquid to the inside of the treatment cell while rotating the treatment cell; and a workpiece collection apparatus for collecting the workpiece by receiving the treatment cell from the carrying apparatus, inverting the treatment cell, and squirting the inside of the treatment cell with water from below to flow out the workpiece, wherein the carrying apparatus carries the treatment cell to the surface treatment apparatus, and then to the workpiece collection apparatus. | 06-23-2011 |
20110089044 | COPPER ELECTROLYTIC PLATING BATH AND COPPER ELECTROLYTIC PLATING METHOD - Disclosed herein is a copper electrolytic plating bath including copper sulfate used in an amount of 50 to 250 g/liter calculated as copper sulfate pentahydrate, 20 to 200 g/liter of sulfuric acid, and 20 to 150 mg/liter of a chloride ion, and a sulfur atom-containing organic compound and a nitrogen atom-containing organic compound serving as organic additives. The nitrogen atom-containing organic compound includes a nitrogen atom-containing polymer compound obtained by a two-stage reaction including reacting one mole of morpholine with two moles of epichlorohydrin in an acidic aqueous solution to obtain a reaction product and further reacting one to two moles, relative to one mole of the morpholine, of imidazole with the reaction product. | 04-21-2011 |
20110062029 | ELECTROLYTIC COPPER PLATING BATH AND METHOD FOR ELECTROPLATING USING THE ELECTROLYTIC COPPER PLATING BATH - For use for a circuit board where a through hole and a blind via hole co-exist, an electrolytic copper plating bath in which the covering power for the through hole and the plugging performance for the blind via hole are sufficient, and an electroplating method that uses the electrolytic copper plating bath, are disclosed. The electrolytic copper plating bath is mainly composed of a water-soluble copper salt, sulfuric acid and chloride ions. A polyamide polyamine, obtained on processing by heating of an epichlorohydrin modified product of a polycondensation product of diethylene triamine, adipic acid and ε-caprolactam, is contained in the bath as a leveler. | 03-17-2011 |
20110056840 | ELECTROLYTIC PLATING EQUIPMENT AND ELECTROLYTIC PLATING METHOD - An electrolytic plating equipment includes: a plating tank for holding plating solution; and a separate tank apart from the plating tank, for holding the plating solution circulating between the plating tank and the separate tank. The separate tank contains a first space and a second space located downstream from the first space. The plating solution in the first space in an amount exceeding a specific height flows from the first space into the second space, and the plating solution falls through air in the second space. | 03-10-2011 |
20110042816 | SEMICONDUCTOR APPARATUS AND FABRICATION METHOD THEREOF - A semiconductor apparatus includes an aluminum electrode film formed on a semiconductor chip; and a nickel plated layer formed on the aluminum electrode film, wherein a concentration of sodium and potassium present in the nickel plated layer and at an interface between the nickel plated layer and the aluminum electrode film is 3.20×10 | 02-24-2011 |
20100243149 | METHOD FOR FORMING A CIRCUIT PATTERN - A method for forming a circuit pattern is disclosed. A circuit pattern that forms an electrically conductive layer ( | 09-30-2010 |
20100219081 | COPPER ELECTROPLATING BATH - A copper electroplating bath useful in filling non-through holes formed on a substrate which contains a water-soluble copper salt, sulfuric acid, and chloride ions and further contains a brightener, a carrier, and a leveler as additives, wherein the leveler contains at least one water-soluble polymer containing quaternary nitrogen, tertiary nitrogen, or both which are cationizable in a solution. In the copper electroplating bath, the filling power for non-through holes formed on a substrate can be easily controlled so as to fit to the size of the holes only by changing the quaternary nitrogen to tertiary nitrogen ratio of the water-soluble polymer to be used as the leveler, which enables copper electroplating of non-through holes of various sizes with a good fit to the sizes. | 09-02-2010 |
20100181104 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD - The present invention is directed to a method for manufacturing a printed circuit board in which a plurality of conductive layers forming a wiring pattern are laminated in the state where they are put between insulating layers, and a printed circuit board formed thereby. The printed circuit board manufacturing method for the present invention includes a step of forming a via fill ( | 07-22-2010 |
20100136244 | ELECTROLESS NICKEL PLATING BATH AND METHOD FOR ELECTROLESS NICKEL PLATING - Disclosed is an electroless nickel plating bath not containing harmful metal species. In the electroless nickel plating bath, there are contained at least an iron ion source and an iodide ion source. With the use of the electroless nickel plating bath containing at least the iron ion source and the iodide ion source, it is possible to suppress decomposition of the plating bath without using harmful metal species to stabilize the plating bath. | 06-03-2010 |
20100044341 | METHOD OF SURFACE TREATMENT FOR ALUMINUM OR ALUMINUM ALLOY - A workpiece to be treated including aluminum or an aluminum alloy on at least a surface thereof is subjected to surface treatment by a method including the steps of immersing in an acidic or alkaline aluminum oxide film-removing solution containing a salt or oxide of a metal capable of substitution with aluminum and forming a substituted metal layer of the metal which is capable of substitution with aluminum and is contained in the removing solution on a surface of the aluminum or aluminum alloy while removing an aluminum oxide film on said aluminum or aluminum alloy surface, forming a substituted zinc film by zinc substitution treatment without removal of the substituted metal layer, removing the substituted metal layer along with the substituted zinc film by means of a liquid having an oxidizing behavior, and subjecting again to zinc substitution treatment to form a substituted zinc film. A plated layer is formed on the aluminum or aluminum alloy on which the substituted zinc film has been formed to obtain good adhesion between the aluminum or aluminum alloy surface and the plated layer. | 02-25-2010 |
20100003399 | ELECTROLESS PLATING SOLUTION, METHOD FOR ELECTROLESS PLATING USING THE SAME AND METHOD FOR MANUFACTURING CIRCUIT BOARD - Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of μm, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. | 01-07-2010 |
20090301888 | METHOD OF DETERMINING OPERATING CONDITION FOR ROTARY SURFACE TREATING APPARATUS - It is an object of the present invention to derive the optimum operating condition parameters for plating operation accurately and efficiently. At first, a preliminary test operation is carried out under the energized condition (S | 12-10-2009 |
20090229986 | CONTINUOUS COPPER ELECTROPLATING METHOD - Disclosed is a method for a repeated electroplating of a workpiece to be plated as a cathode by using an insoluble anode in a plating vessel accommodating a copper sulfate plating bath, wherein a copper dissolution vessel different from the plating vessel is provided, the plating bath is transferred to the copper dissolution vessel and is returned from the copper dissolution vessel to the plating vessel for circulating the plating bath between the plating vessel and the copper dissolution vessel, copper ion supplying salt is charged into the copper dissolution vessel and dissolved in the plating bath so that copper ions consumed by the plating can be replenished, and the workpiece to be plated is continuously electroplated, characterized in that the plating bath is permitted to transfer between the anode side and the cathode side, and the plating bath is returned to vicinity of the anode in the return of the plating bath from the copper dissolution vessel to the plating vessel. Plating performance impairing components, which are produced when the copper ion supplying salt is dissolved in the plating bath for replenishing the copper ions, are oxidized and decomposed, whereby defective plating due to the presence of the plating performance impairing components can be prevented. | 09-17-2009 |
20090194139 | Surface Treatment Apparatus - [Object] To provide a surface treatment apparatus capable of carrying out a surface treatment, a water washing process, a drying process, etc. automatically in an assembly line manner and in a space-saving installation area. | 08-06-2009 |
20090133603 | ELECTROLESS PALLADIUM PLATING BATH AND ELECTROLESS PALLADIUM PLATING METHOD - Disclosed is an electroless palladium plating bath containing a palladium compound, at least one complexing agent selected from ammonia and amine compounds, at least one reducing agent selected from phosphinic acid and phosphinates, and at least one unsaturated carboxylic acid compound selected from unsaturated carboxylic acids, unsaturated carboxylic acid anhydrides, unsaturated carboxylates and unsaturated carboxylic acid derivatives. Such an electroless palladium plating bath has high bath stability, and decomposition of the bath hardly occurs. Consequently, the electroless palladium plating bath of the present invention has a longer bath life than conventional electroless palladium plating baths. In addition, this electroless palladium plating bath enables to obtain excellent solder bonding characteristics and wire bonding characteristics since it does not affect plating film characteristics even when it is used for a long time. | 05-28-2009 |
20090098398 | TIN ELECTROPLATING BATH, TIN PLATING FILM, TIN ELECTROPLATING METHOD, AND ELECTRONIC DEVICE COMPONENT - Disclosed is a tin electroplating bath containing a water-soluble tin salt, one or more substances selected from inorganic acids, organic acids and their water-soluble salts, and one or more substances selected from water-soluble tungsten salts, water-soluble molybdenum salts and water-soluble manganese salts. This tin electroplating bath enables to form a tin-plated coating film on components for electronic devices such as a chip component, crystal oscillator, bump, connector, lead frame, hoop member, semiconductor package and printed board, as a substitute for a tin-lead alloy plating material, while having high whisker suppressing effects. | 04-16-2009 |
20090092749 | MANUFACTURE METHOD OF BUILDUP CIRCUIT BOARD - A manufacturing method of a buildup circuit board includes forming a wiring layer on an organic polymer insulating layer by copper electroplating and building up other organic polymer insulating layer on the wiring layer, wherein in a final step of the copper electroplating, a surface of the wiring layer is roughened by copper electroplating and the organic polymer insulating layer is formed directly on the roughened surface of the wiring layer. According to the invention, a specific etching step that is essential for enhancing adhesion between the organic polymer insulating layer and the wiring layer can be omitted and no expensive etching apparatus is necessary, thus being good in economy. In addition, if various types of copper sulfate plating baths containing different types of additives used for via fill plating are used as they are, irregularities on the surface can be made in various forms and roughnesses. Thus, it is unnecessary to select a specific type of etching solution depending on film characteristics ascribed to types of additives. Moreover, it is easy to form surface irregularities in conformity with the type of material and physical properties of the organic polymer insulating layer being built up. | 04-09-2009 |
20080302396 | Workpiece Surface Treatment System - A workpiece surface treatment system ( | 12-11-2008 |
20080277140 | ELECTROLESS GOLD PLATING METHOD AND ELECTRONIC PARTS - Part or whole of an electroless gold plating film of a plated film laminate including an electroless nickel plating film, an electroless palladium plating film and an electroless gold plating film is formed by an electroless gold plating using an electroless gold plating bath including a water-soluble gold compound, a completing agent, formaldehyde and/or a formaldehyde-bisulfite adduct, and an amine compound represented by the following general formula R | 11-13-2008 |