Avago Technologies General IP (Singapore) Pte. Ltd. Patent applications |
Patent application number | Title | Published |
20150351229 | PRINTED CIRCUIT BOARD COMPRISING CO-PLANAR SURFACE PADS AND INSULATING DIELECTRIC - A printed circuit board (PCB) comprises a non-conductive base layer, a conductive interconnect disposed on the non-conductive base layer and comprising at least two surface pads separated by a trench, and a insulating dam disposed in the trench, wherein the insulating dam electrically isolates the at least two surface pads and has an upper surface that is substantially co-planar with respective upper surfaces of the at least two surface pads. | 12-03-2015 |
20150349764 | Flip-Flop Having Integrated Selectable Hold Delay - A circuit includes a flip-flop and a delay circuit integrated with the flip-flop, the delay circuit including at least one delay element, the flip-flop and delay circuit having a predefined architecture such that a delay provided by the delay circuit may have a selectable value while the flip-flop remains within the predefined architecture. | 12-03-2015 |
20150349747 | CAPACITIVE COUPLED RESONATOR DEVICE WITH AIR-GAP SEPARATING ELECTRODE AND PIEZOELECTRIC LAYER - A bulk acoustic wave (BAW) resonator includes a bottom electrode disposed on a substrate, a piezoelectric layer disposed over the bottom electrode, and a top electrode disposed over the piezoelectric layer. The BAW resonator further includes at least one air-gap and corresponding support structure, where the at least one air-gap separates at least one of the bottom electrode and the top electrode from the piezoelectric layer, respectively. | 12-03-2015 |
20150349745 | ACOUSTIC RESONATOR WITH ELECTRICAL INTERCONNECT DISPOSED IN UNDERLYING DIELECTRIC - An apparatus comprises a substrate, a dielectric disposed on the semiconductor substrate, an acoustic resonator disposed on the dielectric, and an electrical interconnect disposed in the dielectric and configured to transmit an electrical signal to or from at least one electrode of the acoustic resonator through a signal path disposed at least partially below a level of the acoustic resonator. | 12-03-2015 |
20150349743 | ACOUSTIC RESONATOR COMPRISING VERTICALLY EXTENDED ACOUSTIC CAVITY - A bulk acoustic wave (BAW) resonator having a vertically extended acoustic cavity is provided. The BAW resonator includes a bottom electrode disposed on a substrate over a cavity formed in the substrate; a piezoelectric layer disposed on the bottom electrode, and a top electrode disposed on the piezoelectric layer. The piezoelectric layer has a thickness of approximately λ/2, wherein λ is a wavelength corresponding to a thickness extensional resonance frequency of the BAW resonator. At least one of the bottom electrode and the top electrode comprises a composite electrode having a thickness of approximately λ/2. | 12-03-2015 |
20150349731 | HYBRID POWER AMPLIFIER COMPRISING HETEROJUNCTION BIPOLAR TRANSISTORS (HBTs) AND COMPLEMENTARY METAL OXIDE SEMICONDUCTOR (CMOS) DEVICES - A heterojunction bipolar transistor (HBT) hybrid type RF (radio frequency) power amplifier includes a first device including an input terminal for receiving an RF signal, a pre-driver stage for amplifying the received RF signal, and an output terminal, the input terminal, the pre-driver stage and the output terminal being disposed in or over a first substrate; and a second device having a main stage having an HBT amplifier circuit disposed in or over a second substrate to further amplify the RF signal amplified by the pre-driver stage. The RF signal further amplified by the main stage is output through the output terminal of the first device. | 12-03-2015 |
20150349721 | NEUTRALIZATION OF PARASITIC CAPACITANCE USING MOS DEVICE - An apparatus comprises an amplifier comprising at least one metal oxide semiconductor (MOS) transistor having a parasitic gate-to-drain capacitance, and at least one MOS neutralization device having a neutralization capacitance configured to compensate for the parasitic gate-to-drain capacitance of the at least one MOS transistor. | 12-03-2015 |
20150340355 | CURRENT SENSING OF EMITTER SENSE INSULATED-GATE BIPOLAR TRANSISTOR (IGBT) - A control circuit and method are disclosed for controlling a current sense Insulated-Gate Bipolar Transistor (IGBT). In particular, the current sense IGBT creates voltage spikes in a sense voltage as a result of normal switching operations. The control circuit creates a blank period so that the voltage spikes are ignored and false detections of short-circuit events are avoided. | 11-26-2015 |
20150340128 | FLAME-RETARDANT ZIPPER SLEEVE FOR WRAPPING AN OPTICAL FIBER CABLE BUNDLE OR AN ELECTRICAL CABLE BUNDLE AND A METHOD OF MAKING THE ZIPPER SLEEVE - A zipper sleeve is provided that is made entirely or almost entirely of highly flame-retardant meta-aramid material to provide the zipper sleeve with highly flame-retardant characteristics. The zipper teeth rows of the zipper mechanism are attached directly to respective side edges of opposite sides of a sheet of highly flame-retardant material that will be used to make the sleeve. By attaching the zipper teeth rows directly to the meta-aramid material, the process of attaching the teeth can be fully automated, which ensures that the teeth will be precisely aligned. This feature allows a highly flame-retardant zipper sleeve made entirely or almost entirely out of meta-aramid material to be manufactured at relatively low costs and with very high yield. | 11-26-2015 |
20150331210 | OPTICAL FIBER CABLE ASSEMBLY WITH LOW RADIATED EMISSION COUPLING - An AOC system includes an AOC optical module, a substantially cylindrical cable jacket, a bundle of optical fibers in the cable jacket, a metallic fiber holder, and a spring clip. A portion of the metallic fiber holder is seated within a recess in a metallic AOC module housing. The spring clip resiliently biases the portion of the metal fiber holder seated within the housing recess into contact with the metallic housing, promoting EMI shielding. | 11-19-2015 |
20150326200 | Bulk Acoustic Wave Devices with Temperature-Compensating Niobium Alloy Electrodes - A bulk acoustic wave (BAW) resonator having a first electrode, a second electrode, and a piezoelectric layer between the first electrode and the second electrode. The first electrode is of a first electrode material. The second electrode is of a second electrode material. The piezoelectric layer is of a piezoelectric material doped with at least one rare earth element. The BAW resonator has a resonant frequency dependent at least in part on respective thicknesses and materials of the first electrode, the second electrode and the piezoelectric layer. The resonant frequency has a temperature coefficient. At least one of the first electrode and the second electrode includes a niobium alloy electrode material that, relative to molybdenum as the electrode material, reduces the temperature coefficient of the resonant frequency of the BAW resonator. | 11-12-2015 |
20150323749 | SURFACE MOUNT DEVICE (SMD) OPTICAL PORT - An SMD optical port is provided that has a leadframe that performs the typical functions of a leadframe and that also performs the mechanical stabilizing functions normally performed by a separate metal backing plate. Therefore, the need for a separate metal backing plate is eliminated, which enables the costs of the SMD optical port to be reduced. The leadframe is configured into two or more leadframe portions that are interconnected. One of the leadframe portions is used as a mounting surface for mounting an optoelectronic package on the leadframe and for making electrical connections. Another of the leadframe portions is configured, or adapted, to attach to a bottom surface of the port housing and to act as a backing plate that mechanically couples the SMD optical port to a mounting surface and mechanically stabilizes the SMD optical port. | 11-12-2015 |
20150323588 | Isolation Device And System - An isolation device having first and second semiconductor is disclosed. The first semiconductor die may be adapted to transmit a first signal to the second semiconductor die that is electrically isolated. The first semiconductor die may have a transmitter coupled to a modulator that modulates the first signal. The second semiconductor die may have a receiver having a counter and a control circuit. The control circuit may be adapted to determine an indication of the first signal by using the counter. In addition, an isolation system and a DC-DC feedback regulation control system having such control circuit are disclosed. Likewise, a method for conveying a first signal across an isolation barrier is disclosed. The method may comprise counting a received signal based on internal clock and determining an indication of the first signal from the counter's count value. | 11-12-2015 |
20150323345 | Encoder System With Error Detection And Signal Conditioning Circuits - An encoder system for detecting a movement of a part of a motor system is disclosed. The encoder system may comprise a sensor array, a detection controller, and an error detector circuit. The sensor array may be configured to generate first and second periodic signals in accordance to the movement of the part of the motor system. The detection controller may be coupled to the sensor array and may be configured to generate a periodic control signal derived from at least one of the first and second periodic signals. The error detector circuit may be coupled to the sensor array and the detection controller and configured to generate an error signal when at least one of the first and second periodic signals is outside a predetermined range when the periodic control signal is triggered. | 11-12-2015 |
20150311104 | METHOD AND SYSTEM FOR ALIGNING AND ORIENTING DIES - A precision die-attach system and method are provided for precisely aligning and orienting multiple dies relative to one another and relative to a mounting surface and for attaching the dies to the mounting surface while maintaining the relative alignment and orientation. The system includes an alignment tool that is a precisely manufactured part having receptacles formed therein that are precisely aligned with one another. The receptacles hold the respective dies in positions and with orientations that are precisely aligned and oriented with the respective receptacles. Because the receptacles are precisely aligned and oriented relative to one another, the respective dies held therein are precisely aligned and oriented relative to one another. The die-attach system includes a mechanism for maintaining the precise alignment and orientation of the dies within the respective receptacles as the system places the dies on the mounting surface. | 10-29-2015 |
20150311046 | FABRICATING LOW-DEFECT RARE-EARTH DOPED PIEZOELECTRIC LAYER - A plasma vapor deposition (PVD) system and method for depositing a piezoelectric layer over a substrate are disclosed. A plasma is created in a reaction chamber creates from the sputtering gas supplied to the reaction chamber. The plasma sputters atoms from the sputtering target, which are deposited on the substrate for forming the thin film of the material. | 10-29-2015 |
20150301293 | OPTICAL COMMUNICATIONS MODULE HAVING A FLOATING FERRULE THAT REDUCES WIGGLE LOSS - A ferrule of an optical communications module is allowed to float to a limited degree within the module housing. Consequently, if a force is exerted on the connector that mates with the optical communications module, the mated ferrules of the module and of the connector moves, or floats, within defined limits so that the ferrules move together rather than relative to one another. In this way, the end faces of the ferrules remain in precise alignment to prevent wiggle losses from occurring due to movement of the connector relative to the module housing. | 10-22-2015 |
20150301286 | ADAPTER FOR INTERFACING OPTICAL FIBER CONNECTORS WITH ONE ANOTHER, AND A METHOD - An adapter is provided for interfacing MOF connectors with one another where the MOF connectors have optical pathways that bend by a non-zero-degree angle (e.g., 90°±15°) in between the ends of the optical fibers held in the connectors and the output facets of the connectors. The adapter is configured to mate with two such connectors and to bring their optical pathways into precise optical alignment with one another. | 10-22-2015 |
20150295559 | MULTIPLEXER USING MULTIPLE TUNED OUTPUT IMPEDANCES FOR REDUCED HARMONIC GENERATION - A multiplexer comprises a plurality of filters connected to a common node and each comprising a plurality of acoustic resonators, and a plurality of harmonic traps each integrated into a corresponding one of the plurality of filters and configured to suppress harmonic generation of another one of the filters. | 10-15-2015 |
20150293312 | OPTICAL PORT ADAPTED TO MATE WITH PLUGS OF DIFFERENT TYPES - An optical port is provided that is adapted to mate with optical plugs of at least first and second types. For example, the first type of optical plug may be a VLF-type optical plug and the second type of optical plug may be a non-VLF-type optical plug. The optical port has at least one first latching feature for engaging at least one first latching feature of a VLF-type optical plug with which the optical port may be mated. The optical port has at least one second latching feature for engaging at least one second latching feature of a non-VLF-type optical plug with which the optical port may be mated. | 10-15-2015 |
20150280688 | ACOUSTIC RESONATOR DEVICE INCLUDING TRENCH FOR PROVIDING STRESS RELIEF - An microelectronic device includes a substrate, a piezoelectric component formed over the substrate, at least one trench formed in the substrate. The piezoelectric component has a corresponding resonance frequency. The at least one trench is configured to reduce mechanical stress on the piezoelectric component, in response to force applied to the substrate, for stabilizing the resonance frequency. | 10-01-2015 |
20150280645 | Inductive-Capacitive (LC) Voltage Controlled Oscillator (VCO) Having Tuning Range Controlled By A Digital-To-Analog Converter (DAC) With Programmable Tail Current - A device includes an inductive-capacitive voltage controlled oscillator (LC-VCO) having a tank circuit and programmable tail current, and a control circuit configured to adjust the tail current based on an amount of capacitance provided to the tank circuit. | 10-01-2015 |
20150280100 | ACOUSTIC RESONATOR COMPRISING ACOUSTIC REDISTRIBUTION LAYERS - An acoustic resonator structure comprises a piezoelectric layer having a first surface and a second surface, a first electrode disposed adjacent to the first surface, and a second electrode disposed adjacent to the second surface. The first electrode comprises a first conductive layer disposed adjacent to the piezoelectric layer and having a first acoustic impedance, and a second conductive layer disposed on a side of the first conductive layer opposite the piezoelectric layer and having a second acoustic impedance greater than the first acoustic impedance. The second electrode may be disposed between a substrate and the piezoelectric layer, and it may comprise a third conductive layer disposed adjacent to the piezoelectric layer and having a third acoustic impedance, and a fourth conductive layer disposed on a side of the third conductive layer opposite the piezoelectric layer and having a fourth acoustic impedance greater than the third acoustic impedance. | 10-01-2015 |
20150270826 | LATERALLY COUPLED RESONATOR FILTER HAVING APODIZED SHAPE - A laterally coupled resonator filter device includes a bottom electrode, a piezoelectric layer disposed on the bottom electrode, and a top contour electrode disposed on the piezoelectric layer. The top contour electrode includes first and second top comb electrodes. The first top comb electrode include a first top bus bar and multiple first top fingers extending in a first direction from the first top bus bar. The second top comb electrode includes a second top bus bar and multiple second top fingers extending in a second direction from the second top bus bar, the second direction being substantially opposite to the first direction such that the first and second top fingers form a top interleaving pattern providing an acoustic filter having an apodized shape. | 09-24-2015 |
20150270184 | Location-Shifted Probe Pads For Pre-Bond Testing - An arrangement for performing pre-bond testing of a wafer of semiconductor devices utilizes probe pads that are location-shifted into wafer regions adjacent to the devices such that when the pre-bond testing is completed and the wafer is separated into individual elements, the electrical connection between the pre-bond probe pad and tested device is broken. The adjacent wafer regions may be “vacant” areas or another device region. When separated into individual components, a given pre-bond probe pad and its associated device will be physically separated and electrically isolated from one another. Thus, a large probe pad is electrically connected to an associated device only while the wafer is intact, facilitating probe placement during pre-bond testing. Once the devices are separated, the probe pad is disconnected from its associated active element portion, eliminating the capacitance associated with maintaining an electrical connection between a co-located probe and active region. | 09-24-2015 |
20150262983 | METHODS FOR PERFORMING EXTENDED WAFER-LEVEL PACKAGING (eWLP) AND eWLP DEVICES MADE BY THE METHODS - Methods are provided for making embedded Wafer-Level Packaging (eWLP) devices, packages and assemblies. The eWLP methods allow back side electrical and/or thermal connections to be easily and economically made at the eWLP wafer level without having to use thru-mold vias (TMVs) or thru-silicon vias (TSVs) to make such connections. In order to create TMVs, processes such as reactive ion etching or laser drilling followed metallization are needed, which present difficulties and increase costs. In addition, the eWLP methods allow electrical and optical interfaces to be easily and economically formed on the front side and/or on the back side of the eWLP wafer, which allows the eWLP methods to be used to form optoelectronic devices having a variety of useful configurations. | 09-17-2015 |
20150253522 | LENS DEVICE ATTACHMENT TO PRINTED CIRCUIT BOARD - An optical assembly can be formed by providing a frame made of a plastic material on a surface of a printed circuit board (PCB), mounting at least one opto-electronic element on the surface of the PCB within the frame, and laser-welding a lens device onto the frame. | 09-10-2015 |
20150247232 | Tuning the Piezoelectric Coefficient of a Doped Piezoelectric Material Using Multiple Noble Gases - A process chamber is provided. A target comprising an alloy comprising a base metal atomic species and an alloy atomic species is placed in the process chamber. The concentration of the alloy atomic species is subject to a manufacturing variation. A substrate is placed in the process chamber. While supplying gases comprising a noble gas of a first atomic species and a noble gas of a second atomic species, different from the first atomic species, to the process chamber, a sputtering operation is performed to transfer target material from the target to the substrate to form a piezoelectric film. A relative flow rate is set between the noble gas of the first atomic species and the noble gas of the second atomic species to form the film with a predetermined piezoelectric coefficient notwithstanding the manufacturing variation. | 09-03-2015 |
20150245501 | MOLDED LEADFRAME FOR PCB-TO-PCB CONNECTION - A method for making a leadframe includes removing a group of parallel, strip-shaped electrical conductors from a metal sheet, embedding end portions of the conductors in molding compound defining a leadframe body, and separating the conductors from each other, such that portions of the conductors remain encapsulated in the molding compound while other portions remain exterior to the molding compound and define leads of the resulting leadframe. | 08-27-2015 |
20150244347 | BULK ACOUSTIC WAVE RESONATOR HAVING DOPED PIEZOELECTRIC LAYER - In accordance with a representative embodiment, a bulk acoustic wave (BAW) resonator comprises: a first electrode having a first electrode thickness; a second electrode having a second electrode thickness; and a piezoelectric layer having a piezoelectric layer thickness and being disposed between the first and second electrodes, the piezoelectric layer comprising a piezoelectric material doped with at least one rare earth element. For a particular acoustic coupling coefficient (kt | 08-27-2015 |
20150244346 | BULK ACOUSTIC WAVE RESONATORS HAVING DOPED PIEZOELECTRIC MATERIAL AND FRAME ELEMENTS - A bulk acoustic wave (BAW) resonator includes a first electrode; a second electrode; and a piezoelectric layer disposed between the first and second electrodes. The piezoelectric layer includes a piezoelectric material doped with at least one rare earth element. In an embodiment, the BAW resonator includes a recessed frame element disposed over a surface of at least one of the first and second electrodes. In another embodiment, the BAW resonator includes a raised frame element disposed over a surface of at least one of the first and second electrodes. In yet another embodiment, the BAW resonator includes both the raised and recessed frame elements. | 08-27-2015 |
20150241989 | OFF-AXIS DETECTION FOR PROXIMITY OR GESTURE SENSOR - An optical sensor for detecting at least one of proximity and gesture is disclosed. The optical sensor is configured to detect or sense an object that is located out of the sensor's primary axis. This off-axis detection is facilitated by projecting light emitted by a light source away from the sensor's primary axis and away from the direction in which the light was originally emitted by the light source. The light detector is also configured to detect the light that is being projected off-axis. | 08-27-2015 |
20150240349 | MAGNETRON SPUTTERING DEVICE AND METHOD OF FABRICATING THIN FILM USING MAGNETRON SPUTTERING DEVICE - A method is provided for depositing a thin film of material on a substrate. The method includes providing the substrate on a cathode and a target on an anode in a reaction chamber of a magnetron sputtering device, generating a magnetic field using an enhanced magnetron including an upper base plate to generate an upper magnetic field having a field strength of about 205 gauss and a lower base plate to generate a lower magnetic field having a field strength of about −215 gauss to about −370 gauss, injecting sputtering gas at low pressure into the reaction chamber, and applying power across the anode and cathode to create plasma. Ions from the plasma sputter atoms of at least one element from the target, which are deposited on the substrate to form the thin film. Power density of the power is in a range of about 20 W/cm | 08-27-2015 |
20150228611 | SEMICONDUCTOR DEVICE WITH AN INTERLOCKING STRUCTURE - In one embodiment, a semiconductor device having a die attach pad, a semiconductor die and an adhesive material is disclosed. The adhesive material may be configured to adjoin the semiconductor die and the die attach pad. The die attach pad may be sandwiched between the semiconductor die and the die attach pad. In another embodiment, a device having a semiconductor die, a die attach glue and a die attach pad is disclosed. The device may comprise an interlock structure formed integrally with the die attach pad. In yet another embodiment, a light-emitting device comprising an interlock structure is disclosed. | 08-13-2015 |
20150226924 | METHODS, APPARATUSES AND SYSTEMS FOR BLIND MATING ARRAYS OF MULTI-OPTICAL FIBER CONNECTOR MODULES - Apparatuses, systems and methods are provided that enable a first array of multi-optical fiber connector modules disposed on a first structure to be blindly mated with a second array of multi-optical fiber connector modules disposed on a second structure. The arrays of modules are mounted on respective holders. One of the holders is mounted on the first structure and the other holder is mounted on the second structure. Engagement of the first and second structures with one another results in mating features of the holders being brought within a predetermined allowable misalignment tolerance of one another to ensure that the holders fully mate with one another. Mating of the holders with one another brings mating features of the connector modules of the arrays into a predetermined allowable misalignment tolerance of one another to ensure that full mating of the respective connector modules of the arrays occurs. | 08-13-2015 |
20150222366 | EFFICIENT PULSE AMPLITUDE MODULATION INTEGRATED CIRCUIT ARCHITECTURE AND PARTITION - A transmitter is disclosed as being configured to encode optical signals in accordance with a multi-level coding scheme. The transmitter includes an Integrated Circuit architecture and partition that relaxes the bandwidth and linearity constraints of a gearbox-to-laser driver interface. In the proposed architecture, the gearbox Integrated Circuit aligns two or more digital data streams and transmits the aligned two or more data streams to the laser driver via separate signals. | 08-06-2015 |
20150214908 | POWER AMPLIFIER - A linearized power amplifier includes a first amplification stage having a first transistor for amplifying an input signal and outputting a pre-amplified signal, and a second amplification stage having a second transistor for amplifying the pre-amplified signal. A phase injection circuit, connected to the gate of the first transistor and the gate of the second transistor, adjusts the phase of the input signal based on the pre-amplified signal so as to compensate for AM-AM distortion and AM-PM distortion. | 07-30-2015 |
20150212281 | METHODS, APPARATUSES AND SYSTEMS FOR BLIND MATING MULTI-OPTICAL FIBER CONNECTOR MODULES - Apparatuses, systems and methods are provided that enable N female multi-optical fiber connector modules disposed on a first structure to be simultaneously blind mated with N male multi-optical fiber connector modules disposed on a second structure, where N is a positive integer that is equal to or greater than one. Enabling the male and female multi-optical fiber connector modules to blind mate with one another obviates the need to individually interconnect the modules with optical cables. Each module is mounted on either a male or female socket, which, in turn, is mounted on the first or second structure. The first structure may be, for example, a rack having at least one slot configured to receive a server box, in which case the second structure is the server box itself. | 07-30-2015 |
20150211899 | OPTICAL FIBER STRAIN SENSOR SYSTEM AND METHOD - An optical fiber strain sensor system and method are provided that use pixels of a three-dimension (3-D) pixel sensor to sense the respective light beams passing out of the ends of a reference fiber and a measurement fiber and for converting the respective light beams into respective electrical signals. Because 3-D camera pixels have photodiodes that are directly connected by switches to integrators within the same die, the need to use separate TIAs and phase detection circuitry in each receive channel is eliminated, which reduces system complexity and overall cost. In addition, omitting the separate TIAs and phase detection circuitry for each channel eliminates the phase uncertainty that can occur when using those components, and thus improves measurement precision. | 07-30-2015 |
20150211897 | Alignment Structure For An Encoder - In one embodiment, an encoder system comprising an encoder assembly and an encoder alignment structure is disclosed. The encoder assembly may include at least a detector, a hub, a housing, an index sensor of the detector, and a coding member having an index mark. The encoder alignment structure may have a projecting structure. The detector may be coupled with the housing, and the projecting structure may slideably engage the hub so as to align the index mark of the coding member with the index sensor of the detector in a first alignment arrangement. In another embodiment, an encoder assembly configured for receiving an alignment structure having a projecting structure is disclosed. | 07-30-2015 |
20150211714 | Light-Emitting Device With Partial Roughened Illumination Surface - In one embodiment, a light-emitting device having a reflector, an emitter and an encapsulant is disclosed. The encapsulant may have a plurality of optical structures. Each of the plurality of optical structures may be configured to attenuate light transmitting towards a first direction by re-directing towards a second direction. In another embodiment, a flashlight having a roughened area with micro-optics is disclosed. Each of the micro-optics is configured to redirect light transmitting towards a direction forming an angle relative to a longitudinal axis to a point along the longitudinal axis. In yet another embodiment, a lighting-emitting device having roughened area to reduce light along a longitudinal axis is disclosed. | 07-30-2015 |
20150207575 | APPARATUS AND METHOD FOR TESTING ELECTRONIC DEVICE, AND NOISE BLOCKING MODULE THEREFOR - An apparatus for testing an electronic device in response to a radio frequency (RF) input signal includes an RF input signal generation source, a noise blocking unit, an RF signal transmission medium, a passband measurement unit, and a control unit. The RF input signal generation source generates the RF input signal. The noise blocking unit has a passband for passing the RF input signal and blocking noise to provide a noise blocked RF input signal. The RF signal transmission medium transmits the noise blocked RF input signal to the electronic device. The passband measurement unit measures the passband of the noise blocking unit based on the noise blocked RF input signal and outputs a passband value. The control unit performs feedback control of the passband by varying a control signal output to the noise blocking unit based on the passband value, so that the passband falls within a target range. | 07-23-2015 |
20150207489 | FILM BULK ACOUSTIC WAVE RESONATOR (FBAR) HAVING STRESS-RELIEF - An acoustic resonator structure comprises: a substrate having a cavity, which has a plurality of sides; a first electrode disposed over the cavity; a piezoelectric layer disposed over a portion of the first electrode and extending over at least one of the sides; and a second electrode disposed over the piezoelectric layer, an overlap of the first electrode, the piezoelectric layer and the second electrode forming an active area of the FBAR. The active area of the FBAR is completely suspended over the cavity. | 07-23-2015 |
20150192746 | OPTICAL COMMUNICATIONS MODULE HAVING AN OPTICAL PORT THAT PREVENTS RELATIVE MOVEMENT FROM OCCURRING BETWEEN THE OPTICAL PORT AND A FERRULE THAT IS MATED WITH THE OPTICAL PORT - A plastic optical port of an optical communications module is equipped with an adapter having an inner diameter that adjusts to the outer diameter of a ferrule when the ferrule is mated with the optical port. In the mated configuration, the adapter creates an interference fit between the optical port and the ferrule that prevents or at least reduces relative movement between the optical port and the ferrule. Preventing or at least reducing relative movement between the ferrule and the optical port ensures that the distal end of the ferrule and the distal end of the fiber stub held within the port are maintained in precise optical alignment with one another. This, in turn, ensures high optical coupling efficiency for light being coupled between the distal end of the fiber stub and the distal end of the ferrule. | 07-09-2015 |
20150156832 | PASSIVE PEAKING CIRCUIT COMPRISING A STEP-DOWN IMPEDANCE TRANSFORMER - A passive peaking circuit is formed in part from a passive step-down impedance transformer that interconnects the light source driver to the light source. The step-down impedance transformer has impedance that decreases in a continuous or discrete manner in the direction from the light source driver circuit to the light source. The passive peaking circuit peaks the electrical drive signal being delivered from the light source driver circuit to the light source, thereby widening the eye opening. | 06-04-2015 |
20150147035 | OPTICAL CONNECTOR HAVING IMPROVED GUIDE PIN RETENTION - An optical connector includes a connector housing, a retaining plate, and two pins. The connector housing has two bores extending between rearward and forward ends of the connector housing. The retaining plate has a central opening with notches in two of its sides. Each pin extends through one of the notches, which engages the respective groove. The pins extend through the respective bores in the connector housing. | 05-28-2015 |
20150129906 | LIGHT-EMITTING DIODES ON A WAFER-LEVEL PACKAGE - A light emitter and methods of constructing the same is disclosed. The light emitter is disclosed as including a jumper chip and one or more light sources, such as Light Emitting Diodes (LEDs). The light sources are connected to the jumper chip via conductive traces manufactured with semiconductor processing techniques. The jumper chip is disclosed as having a plurality of isolated conductive vias, thereby allowing the jumper chip to present multiple different bonding areas that are electrically isolated from one another. | 05-14-2015 |
20150118770 | WAFER-LEVEL PACKAGES HAVING VOIDS FOR OPTO-ELECTRONIC DEVICES - A semiconductor device package is formed by mounting a semiconductor die on an adhesive tape substrate, mounting a sacrificial structure on the adhesive tape substrate, applying molding material on the adhesive tape substrate to embed the die and at least a portion of the at least one sacrificial structure; removing the adhesive tape substrate to define a package assembly, forming a redistribution layer on a surface of the package assembly, and removing sacrificial material to form a void in the molding material having a shape corresponding to a shape of the sacrificial material that was removed. | 04-30-2015 |
20150117868 | PARALLEL OPTICAL TRANSMITTER - An N-channel parallel optical transmitter includes a dual-facet continuous-wave laser, two or more optical splitters, and four or more optical modulators. One of the optical splitters has an input coupled to the first facet of the laser, and another has an input coupled to the second facet of the laser. The outputs of the splitters are coupled to the inputs of the optical modulators. | 04-30-2015 |
20150117510 | RATE-ADAPTIVE EQUALIZER THAT AUTOMATICALLY INITIALIZES ITSELF BASED ON DETECTED CHANNEL CONDITIONS, AND A METHOD - A rate-adaptive equalizer automatically initializes its tap coefficients to values. During an initialization process, a linear search algorithm is performed that sweeps the tap coefficients through different combinations of tap coefficients while assessing information about an eye associated with an input signal received over a communications channel. When the eye information indicates that the eye is open, the current tap coefficients are selected as the initial tap coefficients to be used at the beginning of the main adaptation algorithm. | 04-30-2015 |
20150116999 | MONO-AXIAL LENS FOR MULTIPLE LIGHT SOURCES - A package for multiple light sources is described. The package includes a plurality of light sources aligned along a first axis and a lens substantially encapsulating the plurality of light source. The lens is designed as a mono-optical lens meaning that a radius of curvature is only created along the first axis of the lens. The lens includes substantially no radius of curvature along a second axis that is perpendicular to the first axis. | 04-30-2015 |
20150116838 | OPTICAL MULTIPLEXER AND DEMULTIPLEXER AND A METHOD FOR FABRICATING AND ASSEMBLING THE MULTIPLEXER/DEMULTIPLEXER - Known semiconductor wafer process technologies are used to manufacture an optical MUX/DeMUX with very precise dimensional control. The manufacturing process eliminates the need to polish optical surfaces of the MUX/DeMUX, which reduces the overall manufacturing costs and the amount of time that is required to manufacture the MUX/DeMUX. | 04-30-2015 |
20150116011 | HIGH-SPEED DIVIDE-BY-1.5 CIRCUIT WITH 50 PERCENT DUTY CYCLE - A divide-by-1.5 circuit includes a divide-by-3 circuit that and a frequency doubler circuit. The divide-by-3 circuit has few logic elements and provides glitch-free operation with a 50 percent duty cycle output. The frequency doubler circuit is based on phase-locked loop circuitry. | 04-30-2015 |
20150116005 | METHOD AND APPARATUS FOR INTERFACING INTEGRATED CIRCUITS (ICs) THAT OPERATE AT DIFFERENT SUPPLY VOLTAGES - A Tx IC and an Rx IC that use different supply voltages are mounted on a circuit board and interfaced via traces of the board. The configuration of the Tx IC is such that DC decoupling is provided between the ICs while also preventing inadvertent turn-on of the ESD diodes of the Rx IC. These features make it possible to provide DC decoupling between high-performance Tx ICs that use relatively high supply voltages and Rx ICs that use relatively low supply voltages without the need for AC coupling capacitors and while also preventing ESD protection of the Rx IC from being degraded. | 04-30-2015 |
20150115407 | Isolation Device - In one embodiment, an isolation device has a substrate, a metal plate, a conductive layer, first and second isolation layers are disclosed. The conductive layer may be formed within the substrate. The conductive layer may be arranged coupled to the metal plate, so as to receive a capacitively coupled signal from the metal plate. The first and second isolation layers may be sandwiched between the metal plate and the conductive layer. In another embodiment, an isolation device comprising a semiconductor substrate, a topmost metal layer and a plurality of additional metal layers is disclosed. The isolation device further comprises an isolation capacitor formed using the topmost metal layer and a conductive layer coupled to at least one of the plurality of additional metal layers. | 04-30-2015 |
20150115138 | Sensing Device With A Shield - In one embodiment, a sensing device comprising a substrate, an emitter, a receiver and a shield is disclosed. The shield may be arranged to shield at least partially the emitter and the receiver. The shield may have a stopper and a reflector cup. The stopper may be a retention mean for engaging the substrate adjacent to the receiver such that a shield surface of the shield may be arranged distanced away from the receiver. The reflector cup may also engage the substrate adjacent to the emitter, so that the shield surface may be arranged distanced away from the emitter. In other embodiments, a sensing apparatus and a sensor having a stopper or a retention member are disclosed. | 04-30-2015 |
20150114554 | OPTICAL MULTIPLEXER AND DEMULTIPLEXER AND A METHOD FOR FABRICATING AND ASSEMBLING THE MULTIPLEXER/DEMULTIPLEXER - Known semiconductor wafer process technologies are used to manufacture an optical MUX/DeMUX with very precise dimensional control. The manufacturing process eliminates the need to polish optical surfaces of the MUX/DeMUX, which reduces the overall manufacturing costs and the amount of time that is required to manufacture the MUX/DeMUX. | 04-30-2015 |
20150108326 | IMPROVED FILL FACTOR OPTO-SENSITIVE DEVICE - An opto-sensitive device, a pixel configured for use in an opto-sensitive device, and a method of operating an opto-sensitive device are disclosed. The opto-sensitive device illustratively includes a capacitor stacked on top of a photodetector, thereby improving the fill factor of the opto-sensitive device. Transparent properties of the capacitor for a wavelength of interest ensure that the incident light is completely or mostly absorbed only within the photodetector and not within the capacitor. | 04-23-2015 |
20150103850 | Communication Device Utilizing An Interrupting Alignment Pattern - A communication device utilizing an interrupting alignment pattern is disclosed. The communication device may comprise a plurality of inputs, a pattern generator, a multiplexer, a control circuit, an interrupt circuit, and an output. The pattern generator may be configured to generate an alignment pattern. The control circuit may be configured to control the multiplexer to multiplex a plurality of incoming data streams into a serialized output data stream. The interrupt circuit may be configured to interrupt the serialized output data stream with the alignment pattern. The output may be configured to output the alignment pattern in place of the serialized output data stream, when the serialized output data stream is interrupted by the alignment pattern. | 04-16-2015 |
20150103332 | FRAME TRANSFER DEVICE FOR AN OPTICAL STRAIN GAUGE STRUCTURE - An optical strain gauge, a transfer device for an optical strain gauge, and a test system are described. One instance of the disclosed transfer device includes a first and second gauge coupler that facilitate attachment to an optical strain gauge. The disclosed transfer device enables an optical strain gauge to be easily moved from one location to another; for example from a location of manufacture, testing, or calibration, to an object to be tested with the strain gauge or from one object to another object. | 04-16-2015 |
20150091649 | PULSED DYNAMIC LOAD MODULATION POWER AMPLIFIER CIRCUIT - A power amplifier circuit for amplifying an envelope modulated Radio Frequency (RF) signal with improved linearity and efficiency includes a power amplifier, and a variable load matching circuit coupled to an output port of the power amplifier. The input impedance of the variable load matching circuit is changed such that an output power of the power amplifier is at a first output power level, or a second output power level which is higher than the first output power level. | 04-02-2015 |
20150085914 | Modal PAM2/4 Pipelined Programmable Receiver Having Feed Forward Equalizer (FFE) And Decision Feedback Equalizer (DFE) Optimized For Forward Error Correction (FEC) Bit Error Rate (BER) Performance - A pipelined receiver comprises a programmable feed forward equalizer (FFE), a programmable decision feedback equalizer (DFE), and logic for controlling a ratio of FFE and DFE to apply to a received signal based on at least one channel parameter. | 03-26-2015 |
20150082616 | METHOD FOR SELECTING OPTIMAL MANUFACTURING PROCESS FOR PRODUCING PRINTED CIRCUIT BOARDS - A method is provided for selecting an optimal manufacturing process for producing printed circuit boards. The method includes measuring electrical characteristics of a reference printed circuit board having circuitry; producing two or more printed circuit boards using two or more candidate manufacturing processes, respectively, each produced printed circuit board having circuitry that is the same as the circuitry of the reference printed circuit board; measuring electrical characteristics of each of the produced printed circuit boards; and selecting a candidate manufacturing process of the two or more candidate manufacturing processes based on the measured electrical characteristics of the reference printed circuit board. | 03-26-2015 |
20150077313 | RETRO-REFLECTIVITY ARRAY FOR ENABLING PUPIL TRACKING - An optical array system for performing pupil tracking using retro-reflectivity includes: an LED array including at least one on-axis LED and at least one off-axis LED, for illuminating pupils of a user within an active region; a high-speed camera with a gaming motion sensor, for capturing images of the pupils illuminated by the LED array; and a processor, coupled to the high-speed camera, for receiving the captured images and performing processing algorithms on them to isolate pupil information and thereby determine pupil presence and location within the active region. | 03-19-2015 |
20150071651 | MULTI-LEVEL CODING AND DISTORTION COMPENSATION - An optical communication system, a transmitter, a receiver, and methods of operating the same are provided. In particular, a transmitter is disclosed as being configured to encode optical signals in accordance with a multi-level coding scheme. The receiver is configured to provide receive and decode to the optical signals received from the transmitter. One or both of the receiver and transmitter are configured to compensate for non-idealities or non-linearities introduced into the communication system by optical components of the system. | 03-12-2015 |
20150063829 | FAST THIN-FILM LIGHT EMITTING DIODE - A thin-film Light Emitting Diode (LED) and methods of manufacturing the same are disclosed. Specifically, the thin-film LED is provided with an epitaxial layer having a proton implantation that controls the size of the active volume. Controlling the size of the active volume enables the thin-film LED to enjoy decreased rise and fall times, thereby achieving a thin-film LED that is useable for transmission in high transmission rate communication systems. | 03-05-2015 |
20150062907 | Lighting Apparatus With Transmission Control - A lighting apparatus having a light source, a wavelength converter, a transmission adjustor and a circuit is disclosed. The transmission adjustor is optically coupled between the light source and the wavelength converter to control an amount of light from the first light source entering the wavelength converter. In another embodiment, a lighting apparatus with a light source, first and second wavelength converters, first and second transmission attenuators, and a circuit is disclosed. The color point of the lighting apparatus is controlled through the first and second transmission attenuators. In yet another embodiment, a lighting fixture having a body with an aperture, a light source, a first transmission adjustor, and a wavelength converter is disclosed. The lighting fixture may have an additional aperture with additional wavelength converter and additional transmission adjustor. | 03-05-2015 |
20150055694 | Adaptive Modal PAM2/PAM4 In-Phase (I) Quadrature (Q) Phase Detector For A Receiver - A phase detector includes data detection logic for detecting data in a communication signal, amplitude detection logic for processing modulation chosen from any of a PAM2 and a PAM4 communication modality, in-phase edge detection logic for detecting in-phase edge information in the communication signal, quadrature edge detection logic for detecting quadrature edge information in the communication signal, and mixing logic for determining an amount of in-phase edge information and quadrature edge information to be applied based on at least one channel parameter in the communication channel. | 02-26-2015 |
20150049797 | ADAPTIVE EQUALIZER - An equalizer that includes equalizer circuitry, a mean squared error (MSE) system, and adaptive control logic includes features that inhibit undesirable convergence to local minima. | 02-19-2015 |
20150048484 | Passivation for Group III-V Semiconductor Devices Having a Plated Metal Layer over an Interlayer Dielectric Layer - A semiconductor device that includes a Group III-V semiconductor substrate, circuit elements in and on the substrate, a first metal layer over the substrate, and an interlayer dielectric (ILD) layer. The ILD layer defines a via that extends through it to the first metal layer. Over the ILD layer is thick second metal layer and a passivation layer. The second metal layer includes an interconnect that extends through the via into contact with the first metal layer. The second metal layer is patterned to define at least one conductor. The passivation layer covers the second metal layer and the interlayer dielectric layer, and includes stacked regions of dielectric material. Ones of the regions under tensile stress alternate with ones of the regions under compressive stress, such that the passivation layer is subject to net compressive stress. | 02-19-2015 |
20150041630 | Optical Device With Reduced Crosstalk - In one embodiment, an optical device comprising an emitter, first and second emitter optical elements and a receiver is disclosed. The emitter and the receiver may be arranged substantially along a longitudinal axis. The first and second emitter optical elements may be interposing the longitudinal axis. One other embodiment discloses an optical device comprising an emitter and a receiver arranged on a longitudinal axis. The optical device may further comprise first and second emitter optical elements arranged along an axis orthogonal to the longitudinal axis but interposing the longitudinal axis. In another embodiment, a proximity sensor having first and second emitters interposing a longitudinal axis is disclosed. | 02-12-2015 |
20150036984 | OPTICS SYSTEM MODULE FOR USE IN AN OPTICAL COMMUNICATIONS MODULE, AN OPTICAL COMMUNICATIONS SYSTEM, AND A METHOD - An optics system module for use in an optical communications module is provided that can be more easily aligned with the module during the mounting process, that reduces the possibility of the fiber ends being damaged when they are connected to the respective optical ports of the optics system, and that eliminates or reduces the occurrence of Fresnel losses at the interfaces between the fiber end faces and the optical ports. The optical ports have non-round shapes that are symmetrical to the shapes of the fibers in the transverse direction, i.e., in the direction that is transverse to the optical axes of the fibers. The non-round, symmetrical shape of the optical ports reduces the amount of force that the optical ports exert on the respective optical fibers. | 02-05-2015 |
20150035599 | POWER AMPLIFIER AND DISTRIBUTED FILTER - A system comprises a power amplifier configured to amplify an input signal, a splitter configured to split the amplified input signal into a plurality of output signals, a plurality of filters configured to filter the plurality of output signals, respectively, to produce a plurality of filtered output signals, and a combiner configured to combine the filtered output signals to produce a combined output signal. | 02-05-2015 |
20150031118 | Acoustic Mass Sensor - A mass sensor has a common RF input, a set of mass sensor cells, and a common hold input. Each of the mass sensor cells has a local input node coupled to the common RF input, a local output node, a mass-dependent RF filter that includes an electroacoustic resonator having receptors immobilized on a surface thereof, an RF detector, and a hold circuit having a local hold input. The RF filter, the RF detector and the hold circuit are connected in series between the local input node and the local output node. The common hold input is coupled to the local hold inputs of the hold circuits of at least a subset of the mass sensor cells. | 01-29-2015 |
20150030299 | OPTICAL MODULE CONNECTOR SYSTEM AND METHOD - A connector cover includes a body having a lower recessed portion configured to receive a portion of a reflecting connector of a type that retains the ends of optical fibers therein and has a reflector that redirects or turns the optical signals. The body has an upper housing portion that covers the reflector when the reflecting connector is received in the lower recessed portion of the body. The body also has a pair of arms extending from a forward end of the body. Each arm has a distal end with an arm distal end engagement. The arms are configured to engage a portion of an optical transceiver module. | 01-29-2015 |
20150030281 | METHODS AND APPARATUSES FOR PREVENTING AN OPTICS SYSTEM OF AN OPTICAL COMMUNICATIONS MODULE FROM BEING DAMAGED OR MOVED OUT OF ALIGNMENT BY EXTERNAL FORCES - Protection features are incorporated into an optical communications module to ensure that the optics system of the module will not be damaged or moved out of alignment by external forces exerted on a mating surface of the module when a connector module is mated with the optical communications module. One protection feature is a strike plate that is disposed on the mating surface of the module that redistributes forces exerted on the mating surface. Another protection feature is an optically-transmissive window formed in the mating surface and comprising an optically-transmissive element having anti-reflection (AR) coatings disposed on its upper and lower surfaces. The optics system is positioned beneath the mating surface so that forces that are exerted on the mating surface are not transferred to the optics system. Another protection feature is a design of the module that mechanically decouples the optics system from the mating surface. | 01-29-2015 |
20150028929 | System And Method For Pre-Skewing Timing Of Differential Signals - A circuit for skewing differential signals includes a coarse adjustment stage configured to receive a differential input signal having a true component and a complement component, the coarse adjustment stage configured to impart a first controllable delay to at least one of the true component and the complement component of the differential signal, and a fine adjustment stage configured to impart a second controllable delay to at least one of the true component and the complement component of the differential signal, the second controllable delay having a resolution different than a resolution of the first controllable delay, the first controllable delay and the second controllable delay providing a timing skew between the true component and the complement component of the differential signal. | 01-29-2015 |
20150028370 | LIGHT SOURCE HAVING LIQUID ENCAPSULANT - In one embodiment, a light source comprising a substrate, a die, a liquid encapsulant, an attachment member and a resilient cover configured to hold the liquid encapsulant is disclosed. At least a portion of the resilient cover is easily stretchable so as to absorb size increment of the liquid encapsulant due to thermal expansion. One other embodiment discloses a light-emitting device comprising a die, a liquid encapsulant and the resilient cover. The resilient cover may comprise a dome shaped portion, a vertical portion and a thermal joint portion. In another embodiment, a lighting apparatus having similar resilient cover is disclosed. The resilient cover may further comprise a thermal joint portion having first and second indentations for absorbing thermal expansion. | 01-29-2015 |
20150027240 | PCB LOADING APPARATUS FOR MEASURING THICKNESS OF PRINTED CIRCUIT BOARD STACK - A loading apparatus for loading a printed circuit board (PCB) stack including one or more PCB layers and transferring the PCB stack to an inspection probe includes a movable support unit, a guide unit and a cover. The guide unit is provided on the support unit and defines a depression portion in which the PCB stack is mounted. The cover is configured to cover the depression portion of the guide unit when closed, where the cover has multiple protrusions extending from a lower surface, which press the PCB stack into the depression portion when the cover is closed. | 01-29-2015 |
20150016828 | BURST-MODE RECEIVER HAVING A WIDE DYNAMIC RANGE AND LOW PULSE-WIDTH DISTORTION AND A METHOD - A burst-mode Rx is provided that has a wide dynamic range, low pulse-width distortion and low technological overhead. The Rx is capable of processing signals having levels that range from low noise levels up to high noise levels. In addition, the Rx is capable of quickly and simultaneously adapting the TIA gain and the bit decision threshold level, thereby eliminating the need to transmit and receive a training bit sequence prior to transmitting and receiving actual data. By simultaneously adapting the TIA gain and the bit decision threshold level on the first bit of actual data received in the Rx, the Rx is capable of being used with short packets and with packets of varying lengths transmitted from different types of transmitters located in the same network. | 01-15-2015 |
20140348512 | METHOD AND APPARATUS FOR PERFORMING DATA RATE CONVERSION AND PHASE ALIGNMENT - A gearbox IC is incorporated into an optical communications system to enable an optical link that incorporates the system to achieve data rates that are at least double that which are currently achievable in optical links. The gearbox IC is compatible with ASIC designs currently used in optical fiber links. The gearbox IC enables the data rate of the optical fiber link to be dramatically increased without requiring a redesign of the ASIC that is currently used in the optical fiber link. The gearbox IC performs data rate conversion and phase alignment for bit streams being transferred via the gearbox IC between the ASIC and an optical transceiver module of the optical communications system. | 11-27-2014 |
20140347082 | SEMICONDUCTOR DEVICE TEST SOCKET - A test socket for connecting a device under test (DUT) electrically to a high-frequency power source comprises a plurality of pogo pins each having an electrode, an electron-to-heat conversion plate supporting bottoms of the pogo pins, the electron-to-heat conversion plate configured to convert kinetic energy of free electrons emitted from the pogo pins to thermal energy, and a heat sink wall formed on the electron-to-heat conversion plate, the heat sink wall having a predetermined height and isolating the plurality of pogo pins from one another. | 11-27-2014 |
20140340172 | BULK ACOUSTIC WAVE RESONATOR COMPRISING A BORON NITRIDE PIEZOELECTRIC LAYER - A bulk acoustic wave (BAW) resonator structure comprises: a first electrode disposed over a substrate; a piezoelectric layer disposed over the first electrode, the piezoelectric layer comprising boron nitride (BN); and a second electrode disposed over the first piezoelectric layer. | 11-20-2014 |
20140334243 | WRITE LEVEL TRAINING USING DUAL FREQUENCIES IN A DOUBLE DATA-RATE MEMORY DEVICE INTERFACE - A write leveling calibration system and method for double data-rate dynamic random access memory includes performing write leveling at two different frequencies to determine to which of two successive rising clock cycle edges each data strobe signal would be aligned as a result of applying the write leveling delay determined by the write-leveling procedure. The determination can then be used to ensure that the data strobe signals of all source synchronous groups are aligned with the same edge of the clock signal. | 11-13-2014 |
20140327462 | TEST SOCKET PROVIDING MECHANICAL STABILIZATION FOR POGO PIN CONNECTIONS - A test socket for electrically connecting a device under test (DUT) to an electrical signal source comprises a plurality of pogo pins spaced apart from each other, a stabilizing plate supporting the plurality of pogo pins, a plurality of conductive lines passing through the stabilizing plate and configured to electrically connect the electrical signal source to the pogo pins, and at least one inner stabilizer disposed in the stabilizing plate between the conductive lines and configured to apply an elastic force toward the DUT where the DUT is brought into contact with the pogo pins. | 11-06-2014 |
20140321820 | OPTICAL DATA COMMUNICATION MODULE WITH SLIDING FIBER CLAMP SLEEVE - An optical data communication module assembly includes a mountable module body, a fiber guide tube having one end attached to the module body, and a fiber clamp sleeve having a barrel retained within the other end of the fiber guide tube. The interior of the fiber guide tube and exterior of the fiber clamp sleeve have correspondingly tapered diameters and mating engagements. Sliding the fiber clamp sleeve within the fiber guide tube can engage and disengage these mating engagements and also clamp and unclamp an optical fiber within the fiber guide tube. | 10-30-2014 |
20140314423 | Optoelectronic Module With Flexible Substrate - An optoelectronic module for data communication through an optical fiber. The optoelectronic module may comprise a base, an outer cap, an inner cap, a flexible substrate, an attachment member, a moisture barrier and an optoelectronic module. The outer cap may have a first cavity and coupled with the base. A slit may be formed on the outer cap. The flexible substrate may be extended through the slit of the outer cap. The inner cap may be disposed within the first cavity. The inner cap may comprise a second cavity. The attachment member may be disposed within the first cavity and configured to attach the inner cap to the base. The moisture barrier may be disposed within the first cavity and encapsulates the attachment member. The optoelectronic component may be disposed within the second cavity and proximate to the flexible substrate. | 10-23-2014 |
20140312234 | Optical Sensor With Special Discrimination - In one embodiment, an ambient light sensor with first and second photo-detectors is disclosed. The first and second photo-detectors may have different depths and respond differently to light having a specific wavelength. The ambient lights sensor may further comprise a circuit configured to detect light of a specific wavelength. In another embodiment, the first and second photo-detectors may be configured such that each of the first and second photo-detectors detects coupling current from each other. In yet another embodiment, in addition to the first and second photo-detectors, a third photo-detector may be formed proximate to at least one of the first and second photo-detectors such that coupling photo-current is detected therein by the at least one of the first and second photo-detectors. | 10-23-2014 |
20140292150 | TEMPERATURE COMPENSATED ACOUSTIC RESONATOR DEVICE HAVING AN INTERLAYER - An acoustic resonator comprises: an acoustic resonator device comprises: a composite first electrode disposed over a substrate, the composite first electrode comprising: a first electrically conductive layer provided over the substrate; a first interlayer disposed on the first electrical conductive layer; a buried temperature compensation layer disposed over the first interlayer; a second interlayer disposed over the temperature compensation layer; a second electrically conductive layer disposed over the second interlayer, a piezoelectric layer disposed over the composite first electrode; and a second electrode disposed over the piezoelectric layer. | 10-02-2014 |
20140270778 | BIDIRECTIONAL OPTICAL DATA COMMUNICATIONS MODULE - An optical transceiver module includes N light sources, N light detectors, a bidirectional fiber port, and an optical network having 2N−1 wavelength-selective elements. The number 2N represents the total number of transmit and receive channels in a bidirectional system in which transmit and receive signals corresponding to the transmit and receive channels. Each light source corresponds to one transmit channel and emits an optical transmit signal having a unique transmit wavelength. Each light detector corresponds to one receive channel and detects an optical receive signal having a unique receive wavelength. The optical network couples each light source to the bidirectional fiber port via a corresponding transmit path through the optical network. The optical network further couples each light detector to the bidirectional fiber port via a corresponding receive path through the optical network. Each transmit and receive path includes some of the wavelength-selective elements. | 09-18-2014 |
20140270659 | OPTICAL DATA COMMUNICATION MODULE HAVING EMI CAGE - An optical data communication module, such as a transceiver, transmitter or receiver, has two parallel substrates with metal layers. An opto-electronic device between the substrates is shielded against electromagnetic interference by the metal layers and conductors, such as vias, which are distributed around a periphery of the opto-electronic device and connect the metal layers. | 09-18-2014 |
20140270657 | METHOD AND SYSTEM FOR PROVIDING ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING IN AN OPTICAL COMMUNICATIONS MODULE - An optical communications module is provided with an EMI shielding system that comprises a resistive coating disposed on one or more inner surfaces of the module housing. The resistive coating has a thickness that is greater than or equal to one skin depth and has a resistivity that is low enough to support electrical current flow, but high enough to absorb EMI radiation of a particular wavelength or wavelength range. The combination of these features causes EMI radiation to propagate in the resistive coating due to skin effect. The resistive coating absorbs at least a portion of the EMI radiation propagating therein. | 09-18-2014 |
20140266453 | TRANSIMPEDANCE AMPLIFIER (TIA) CIRCUIT AND METHOD - A TIA circuit and method are provided that merge the automatic gain control function with the bandwidth adjustment function to allow the TIA circuit to operate over a wide dynamic range at multiple data rates. The TIA circuit has an effective resistance that is adjustable for adjusting the gain and the bandwidth of the TIA circuit. The mechanism of the TIA circuit that is used to adjust the effective resistance, and hence the gain and bandwidth of the TIA circuit, is temperature independent, and as such, the performance of the TIA circuit is not affected by temperature variations. | 09-18-2014 |
20140264399 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURE - A light-emitting diode (“LED”) device has an LED chip attached to a substrate. The terminals of the LED chip are electrically coupled to leads of the LED device. Elastomeric encapsulant within a receptacle of the LED device surrounds the LED chip. A second encapsulant is disposed within an aperture of the receptacle on the elastomeric encapsulant. | 09-18-2014 |
20140252399 | ELECTRONIC PACKAGING SUBSTRATE WITH ETCHING INDENTATION AS DIE ATTACHMENT ANCHOR AND METHOD OF MANUFACTURING THE SAME - An electronics package is disclosed. The electronics package is disclosed as including a substrate core, a metal layer established on top of the substrate core, the metal layer being etched so as to include a die attachment anchor and at least one gap that separates a die bonding pad from at least one of a trace and wire bonding pad, for example. The die attachment anchor is established on top of the die bonding pad and has a depth that does not extend all the way through the die bonding pad. | 09-11-2014 |
20140252385 | LIGHT EMITTING DEVICE WITH ENHANCED PRE-DIP AND METHOD OF MANUFACTURING THE SAME - An illumination device is disclosed. The illumination device includes a light source a pre-dip material that at least partially encapsulates the light source. The pre-dip material may include one or both of thermally-conductive particles and a cyclo-aliphatic composition. The pre-dip material may further include a resin and a hardener for the resin. Methods of manufacturing an illumination device are also disclosed. | 09-11-2014 |
20140246305 | METHOD OF FABRICATING RARE-EARTH ELEMENT DOPED PIEZOELECTRIC MATERIAL WITH VARIOUS AMOUNTS OF DOPANTS AND A SELECTED C-AXIS ORIENTATION - A method of fabricating a rare-earth element doped piezoelectric material having a first component, a second component and the rare-earth element. The method includes: providing a substrate; initially flowing hydrogen over the substrate; after the initially flowing of the hydrogen over the substrate, flowing the first component to form the rare-earth element doped piezoelectric material over a surface of a single target, the target comprising the rare-earth metal in a certain atomic percentage; and sputtering the rare-earth element doped piezoelectric material from the target on the substrate. | 09-04-2014 |
20140241673 | HEAT DISSIPATION DEVICE AND METHOD FOR USE IN AN OPTICAL COMMUNICATIONS MODULE - A heat dissipation system and method are embodied in an optical subassembly (OSA) that mechanically couples with an electrical subassembly (ESA) of an optical communications module. When the OSA is coupled with the ESA, a heat dissipation block that is embedded in the OSA is spaced apart from components of the ESA by a small air gap. At least a portion of the heat that is generated by one or more of these components passes into the heat dissipation block, which extends through top and bottom surfaces of the OSA. Because the heat dissipation block never makes physical contact with the ESA or with components of the ESA, there is no risk of the block damaging the ESA or detrimentally affecting the electrical performance of the module. | 08-28-2014 |
20140239250 | ETCHED-FACET LASERS HAVING WINDOWS WITH SINGLE-LAYER OPTICAL COATINGS - An edge-emitting etched-facet optical semiconductor structure has a substrate, an active multiple quantum well (MQW) region formed on the substrate, and a ridge waveguide formed over the MQW region extending in substantially a longitudinal direction between a waveguide first etched end facet and a waveguide second etched end facet. A mask layer used to form windows in which the etched end facets are disposed consists of a single dielectric material disposed directly on the ridge waveguide. An optical coating consisting of no more than one layer of the same dielectric material of which the second mask is made is disposed directly on the second mask and disposed directly on the windows to coat the etched end facets. | 08-28-2014 |
20140233894 | USER-CONFIGURABLE OPTICAL FIBER LINK - An optical fiber connector includes a connector body and a submodule having a user-selectable configuration, such as a splitter or coupler. The connector body has a submodule mounting region. A first end of the connector body has a pluggable optical fiber port. A second end of the connector body has at least one body fiber guide. The submodule is releasably mounted in the submodule mounting region. The submodule has at least one submodule fiber guide aligned with at least one body fiber guide and at least one submodule fiber guide aligned with the pluggable optical fiber port. One or more optical fibers are routed through the connector body in accordance with the submodule configuration. | 08-21-2014 |
20140233596 | SEMICONDUCTOR LASERS AND ETCHED-FACET INTEGRATED DEVICES HAVING NON-UNIFORM TRENCHES - An edge-emitting etched-facet optical semiconductor structure includes a substrate, an active multiple quantum well (MQW) region formed on the substrate, a ridge waveguide formed over the MQW region extending in substantially a longitudinal direction between a waveguide first etched end facet disposed in a first window and a waveguide second etched end facet disposed in a second window, and first and second trenches having non-uniform widths extending in substantially the longitudinal direction between the first and second windows. | 08-21-2014 |
20140233595 | Vertical Cavity Surface Emitting Laser With An Integrated Protection Diode - A semiconductor device includes a vertical cavity surface emitting laser (VCSEL) with an integrated protection diode arranged between the VCSEL and an emitting surface. By locating the protection diode above the VCSEL, a minimal increase in substrate area is consumed to protect the VCSEL from electrostatic discharge events. A relatively small capacitance introduced by the protection diode, is controllably adjusted by one of the radial size of the protection diode and the thickness of the intrinsic layer therein. The relatively small capacitance introduced by the protection diode enables the VCSEL to operate at data rates above 10 Gb/s. | 08-21-2014 |
20140232486 | ACOUSTIC RESONATOR COMPRISING ACOUSTIC REFLECTOR, FRAME AND COLLAR - A solidly mounted resonator (SMR) device includes an acoustic reflector having stacked acoustic reflector layer pairs, each of which includes a low acoustic impedance layer formed of low acoustic impedance material stacked on a high acoustic impedance layer formed of high acoustic impedance material. The SMR device further includes a bottom electrode disposed on the acoustic reflector, a piezoelectric layer disposed on the bottom electrode, and a top electrode disposed on the piezoelectric layer. A collar is formed outside a main active region defined by an overlap between the top electrode, the piezoelectric layer and the bottom electrode, and at least one frame is disposed within the main active region. The collar has an inner edge substantially aligned with a boundary of or overlapping the main active region, and the at least one frame has an outer edge substantially aligned with the boundary of the main active region. | 08-21-2014 |
20140232244 | TEMPERATURE CONTROLLED ACOUSTIC RESONATOR COMPRISING HEATER AND SENSE RESISTORS - A bulk acoustic wave (BAW) resonator device comprises a heating cod disposed over a first side of the piezoelectric layer and substantially around a perimeter adjacent to the active area of the acoustic resonator, the heating coil comprising a resistor configured to receive a heater current; and a heat sensor disposed over a second side of the piezoelectric layer and opposing the first side, the heat sensor configured to adjust the heater current in response to a temperature of the heating coil. | 08-21-2014 |
20140219305 | SEMICONDUCTOR LASERS AND ETCHED-FACET INTEGRATED DEVICES HAVING H-SHAPED WINDOWS - An edge-emitting optical semiconductor structure has a substrate, an active multiple quantum well (MQW) region formed on the substrate, and a ridge waveguide extending between first and second etched end facets. The first etched end facet is disposed in a first window, while the second etched end facet is disposed in a second window. The first etched end facet extends between a pair of alcoves in the first window, and the second etched end facet extends between a pair of alcoves in the second window. An integrated device in which two such structures are provided has an H-shaped window where the two structures adjoin each other. The structure can be fabricated using a process that involves a first mask to form the ridge waveguide and then a second mask and an etching process to form the windows. | 08-07-2014 |
20140217556 | METHODS FOR DICING A COMPOUND SEMICONDUCTOR WAFER, AND DICED WAFERS AND DIE OBTAINED THEREBY - Methods are provided for using masking techniques and plasma etching techniques to dice a compound semiconductor wafer into dies. Using these methods allows compound semiconductor die to be obtained that have smooth side walls, a variety of shapes and dimensions, and a variety of side wall profiles. In addition, by using these techniques to perform the dicing operations, the locations of features of the die relative to the side walls are ascertainable with certainty such that one or more of the side walls can be used as a passive alignment feature to precisely align one or more of the die with an external device. | 08-07-2014 |
20140191119 | SINGLE TRACK THREE-CHANNEL ENCODER WITH DIFFERENTIAL INDEX - An optical encoder is disclosed. Specifically, a three-channel encoder is disclosed which utilizes a single track for all three channels. An index channel is provided on the same optical track as the first and second channels which are used to determine incremental angular position. Thus, a more compact and simple three-channel encoder is provided. | 07-10-2014 |
20140184096 | MINIMIZED COLOR SHIFT LIGHTING ARRANGEMENT DURING DIMMING - An illumination device, system, and method are disclosed. The illumination system includes a first set of light sources and a second set of light sources, driven by a first driver and second driver, respectively. The system further includes a dimming control system that implemented dimming control logic. The dimming control logic coordinates the operation of the first and second drivers such that the first and second sets of light sources are activated and deactivated so as to achieve substantially constant color temperature during dimming operations. | 07-03-2014 |
20140179129 | METHODS, APPARATUSES AND SYSTEMS FOR MID-PLANE MOUNTING PARALLEL OPTICAL COMMUNICATIONS MODULES ON CIRCUIT BOARDS - A socket is provided that is configured to be secured to a surface of a host circuit board by solder using a solder reflow process. The solder reflow process that is used for this purpose may be the same solder reflow process that is used to make electrical connections between the array of electrical contacts disposed on the lower surface of the socket and the array of electrical contacts disposed on the upper surface of the host CB. Because the solder reflow process is an automated process, the process of securing the socket to the surface of the host CB does not have to be performed manually, but can be performed automatically as part of a typical automated surface mount technology (SMT) process of the type that is typically used to mount components on a PCB. | 06-26-2014 |
20140175950 | ACOUSTIC RESONATOR COMPRISING ALUMINUM SCANDIUM NITRIDE AND TEMPERATURE COMPENSATION FEATURE - An acoustic resonator structure comprises a first electrode disposed on a substrate, a piezoelectric layer disposed on the first electrode and comprising aluminum scandium nitride, a second electrode disposed on the piezoelectric layer, and a temperature compensation feature having a temperature coefficient offsetting at least a portion of a temperature coefficient of the piezoelectric layer, the first electrode, and the second electrode. | 06-26-2014 |
20140174908 | SCANDIUM-ALUMINUM ALLOY SPUTTERING TARGETS - A sputtering target comprises an alloy of scandium and aluminum, wherein the alloy has a concentration of 3-10 at % scandium and 90-97 at % aluminum. The sputtering target can be used to produce a piezoelectric layer for an apparatus such as an acoustic resonator. | 06-26-2014 |
20140169749 | PLUGGABLE DATA COMMUNICATION MODULE WITH SLIDER-CRANK DELATCH MECHANISM - A delatch mechanism for disengaging a data communication module from a cage includes an actuator handle and a T-shaped crank connected at a wrist pivot to the handle and connected at a crank pivot to the module housing. The crank pivots to lift a pin out of engagement with the cage when a user pulls on the actuator handle, causing it to slide relative to the housing. | 06-19-2014 |
20140168975 | LIGHTING FIXTURE WITH FLEXIBLE LENS SHEET - A lighting system and lighting fixture cover are disclosed. Specifically, the lighting system can provide an optimum light beam shape for a number of different lighting applications. The lighting system includes a PCB and cover with one or more lenses and one or more snap-fit locking mechanisms to secure the cover to the PCB. The cover enables a narrow beam output without sacrificing beam intensity or brightness. The cover simplifies the assembly process of a lighting fixture. | 06-19-2014 |
20140168906 | PLUGGABLE DATA COMMUNICATION MODULE WITH COMPLIANT PUSH-PULL TAB - A data communication module tab is sufficiently compliant in off-axis directions that it resists damage from forces in such off-axis directions, yet is sufficiently rigid in the direction of its longitudinal axis that a person can insert the data communication module into a cage and withdraw it from a cage by pushing and pulling the tab, respectively. | 06-19-2014 |
20140167083 | LED PACKAGE WITH INTEGRATED REFLECTIVE SHIELD ON ZENER DIODE - A lighting package is disclosed. The lighting package is disclosed as including a primary light source, such as a Light Emitting Diode, and an additional electrical component that protects the primary light source from electrostatic discharge, for example. The additional electrical component may correspond to a Zener diode and may be treated with at least one material that helps reduce the light absorption of the Zener diode. | 06-19-2014 |
20140165369 | THREADED INSERT WITH THERMAL INSULATION CAPABILITY - A thermally-insulative insert device and method of use of same is disclosed. Specifically, the thermally-insulative insert device, comprising internal and external threads, allows attachment of an assembled part to a heat source while reducing heat transfer between the assembled part and the heat source. It is also an aspect of the present disclosure to provide easy-to-implement and cost-effective methods of using and assembling the thermally-insulative insert device. | 06-19-2014 |
20140161398 | OPTICAL COMMUNICATION MODULE WITH FIBER SUBMOUNT AND LATCHING OPTICS ASSEMBLY - In an optical communication module, a fiber submount is mated with an optics assembly to optically align an optical fiber retained in a groove in the fiber submount with an optics element of the optics assembly. The fiber submount has a resiliently biased latch portion that engages the optics assembly to provide a resilient retaining force between the optics assembly and the fiber submount. The force retains the optics element in optical alignment with the fiber optical axis. | 06-12-2014 |
20140160746 | SYSTEM, DEVICE, AND METHOD FOR ADJUSTING COLOR OUTPUT THROUGH ACTIVE COOLING MECHANISM - An illumination device, system, and method are disclosed. The illumination device includes an active cooling mechanism and a controller for the same. When the controller activates or deactivates the active cooling mechanism, one or more optical elements on the illumination device are automatically moved, thereby adjusting at least one characteristic of the light emitted by the illumination device. | 06-12-2014 |
20140160740 | LIGHT TUBE WITH LOW UP-LIGHT - An illumination device, system, and method are disclosed. The illumination device includes a heat sink having a depression or channel established therein. One or more light sources can be mounted in the depression or channel and when light is emitted by the one or more light sources, the light can be directed or shaped by the depression or channel. | 06-12-2014 |
20140160736 | DOWNLIGHT AUXILIARY RING - A downlight auxiliary ring device and method of control and use of same is disclosed. Specifically, the downlight auxiliary ring device, comprising light-emitting diodes, allows a dimmable and reduced-glare reflected downlight. It is also an aspect of the present disclosure to provide easy-to-implement and cost-effective methods of control and use of the downlight auxiliary ring device system. | 06-12-2014 |
20140159548 | ACOUSTIC RESONATOR COMPRISING COLLAR AND ACOUSTIC REFLECTOR WITH TEMPERATURE COMPENSATING LAYER - An acoustic resonator structure includes an acoustic reflector over a cavity formed in a substrate, the acoustic reflector including a layer of low acoustic impedance material stacked on a layer of high acoustic impedance material. The acoustic resonator further includes a bottom electrode on the layer of low acoustic impedance material, a piezoelectric layer on the bottom electrode, a top electrode on the piezoelectric layer, and a collar formed outside a main membrane region defined by an overlap between the top electrode, the piezoelectric layer and the bottom electrode. The collar has an inner edge substantially aligned with a boundary of or overlapping the main membrane region. The layer of the low acoustic impedance material includes a temperature compensating material having a positive temperature coefficient for offsetting at least a portion of a negative temperature coefficient of the piezoelectric layer, the bottom electrode and the top electrode. | 06-12-2014 |
20140153219 | Cooling System Utilizing Potential Energy - A cooling system utilizing a potential energy that provides cooling with low power consumption is disclosed. The cooling system may comprise a heat dissipating member, a support structure, a movable assembly, and a coil. In one embodiment, the movable assembly may be configured to oscillate above the heat dissipating member by utilizing induction from the coil and the potential energy to generate air flow that provide cooling on the heat dissipating member. In other embodiments, the movable assembly may be configured to oscillate substantially within the recess of the heat dissipating member. | 06-05-2014 |
20140152152 | ACOUSTIC RESONATOR COMPRISING TEMPERATURE COMPENSATING LAYER AND PERIMETER DISTRIBUTED BRAGG REFLECTOR - An acoustic resonator structure includes a bottom electrode disposed on a substrate, a piezoelectric layer disposed on the bottom electrode, a top electrode disposed on the piezoelectric layer, a cavity disposed beneath the bottom electrode, and a temperature compensating feature. The temperature compensating feature has a positive temperature coefficient for offsetting at least a portion of a negative temperature coefficient of the piezoelectric and electrode layers. The acoustic resonator structure further includes an acoustic reflector disposed over the substrate around a perimeter of the cavity. The acoustic reflector includes a layer of low acoustic impedance material stacked on a layer of high acoustic impedance material. | 06-05-2014 |
20140147127 | METHODS AND SYSTEMS FOR DISSIPATING HEAT IN OPTICAL COMMUNICATIONS MODULES - A heat dissipation solution is provided that is suitable for use in, but not limited to use in, CXP modules. The heat dissipation solution allows the performance of a CXP module to be significantly improved without having to increase the size of the heat dissipation device that is currently used with known CXP modules. The heat dissipation solution thermally decouples the heat dissipation path associated with the laser diodes from the heat dissipation path associated with other heat-generating components of the module, such as the laser diode driver IC and the receiver IC. Decoupling these heat dissipation paths allows the temperature of the laser diodes to be kept cooler as they are operated at higher speeds while allowing the temperatures of the other components to run hotter, if desired or necessary. | 05-29-2014 |
20140146531 | ILLUMINATION DEVICE WITH COMBINATION OF DISCRETE LIGHT EMITTING DIODE AND ORGANIC LIGHT EMITTING DIODE COMPONENTS - An illumination device, system, and method are disclosed. The illumination device includes one or more first light sources and one or more second light sources. The one or more first light sources may correspond to discrete light sources whereas the one or more second light sources may correspond to sheet or film-type light sources, such as Organic Light Emitting Diode (OLED) sheets. | 05-29-2014 |
20140146517 | LIGHT EMISSION AND CONVERSION THROUGH A SPINNING SHAFT - An illumination device, system, and method are disclosed. The illumination device includes one or more light sources mounted on a core and a shaft that is configured to at least partially surround the core. The shaft may include one or more phosphor elements that are movable relative to the core and the one or more light sources. Movement of the shaft and the one or more phosphor elements may facilitate the production of white light and other non-white-lighting effects. | 05-29-2014 |
20140145584 | HEMISPHERICAL REMOTER PHOSPHOR AND METHODS OF FORMING THE SAME - An illumination device is disclosed. The illumination device includes a light source and a remoter phosphor configured to alter the color of light emitted by the light source. The remoter phosphor is provided with a substantially hemispherical shape that substantially corresponds to a radiation pattern of the light source, which helps to reduce or eliminate the occurrence of the yellow ring phenomenon, among other things. Methods of manufacturing an illumination device are also disclosed. | 05-29-2014 |
20140139233 | APPARATUS FOR INSPECTING PASSIVE COMPONENT HAVING SIGNAL TRANSMISSION LINE - An apparatus for inspecting a passive component having a signal transmission line on a printed circuit board (PCB), includes a reflectometry unit for inputting an incident signal to an input port connected to the signal transmission line, receiving a reflected signal in response to the incident signal, and computing a plurality of frequency-based reflection coefficient values in a preset frequency range and a plurality of time-based reflection coefficient values in a preset time range based on the incident signal and the reflected signal; and a defect detection unit for determining whether the signal transmission line has a defect based on the plurality of frequency-based reflection coefficient values, and determining a location of the defect on the signal transmission line based on the plurality of time-based reflection coefficient values. | 05-22-2014 |
20140139077 | ACOUSTIC RESONATOR STRUCTURE HAVING AN ELECTRODE WITH A CANTILEVERED PORTION - An acoustic resonator comprises a first electrode and second electrode comprising a plurality of sides. At least one of the sides of the second electrode comprises a cantilevered portion. A piezoelectric layer is disposed between the first and second electrodes. A bridge disposed adjacent to one of the sides of the second electrode. | 05-22-2014 |
20140132355 | Providing An Integrated Directional Coupler In A Power Amplifier - A power amplifier includes a power amplifier core including a plurality of gain stages to receive a radio frequency (RF) signal and to output an amplified RF signal, an output network coupled to the power amplifier core to receive the amplified RF signal and output a transmit output power signal, and a directional coupler coupled to the output network to obtain a coupled signal proportional to the transmit output power signal. Each of these components can be configured on a single semiconductor die, in an embodiment. | 05-15-2014 |
20140132117 | METHOD OF FABRICATING RARE-EARTH DOPED PIEZOELECTRIC MATERIAL WITH VARIOUS AMOUNTS OF DOPANTS AND A SELECTED C-AXIS ORIENTATION - A method of fabricating a rare-earth element doped piezoelectric material having a first component, a second component and the rare-earth element. The method includes: providing a substrate; initially flowing hydrogen over the substrate; after the initially flowing of the hydrogen over the substrate, flowing the first component to form the rare-earth element doped piezoelectric material over a surface of a target, the target comprising the rare-earth metal in a certain atomic percentage; and sputtering the rare-earth element doped piezoelectric material from the target on the substrate. | 05-15-2014 |
20140125394 | PHASE INTERPOLATOR HAVING ADAPTIVELY BIASED PHASE MIXER - A phase interpolator includes an adaptively biased phase mixer, phase control circuitry and an adaptive bias generator. The adaptively biased phase mixer has mixing transistor circuitry configured to provide an output phase signal in response to a plurality of phase control signals, a bias current, and a number of phase input signals offset in phase from one another. The adaptively biased phase mixer further has adjustable bias transistor circuitry configured to adjust the bias current provided to the mixing transistor circuitry in response to an adaptive bias signal. | 05-08-2014 |
20140125203 | BULK ACOUSTIC WAVE (BAW) RESONATOR STRUCTURE HAVING AN ELECTRODE WITH A CANTILEVERED PORTION AND A PIEZOELECTRIC LAYER WITH VARYING AMOUNTS OF DOPANT - A bulk acoustic wave (BAW) resonator, comprises: a first electrode; a second electrode comprising a plurality of sides. At least one of the sides comprises a cantilevered portion. The bulk acoustic wave (BAW) resonator also comprises a piezoelectric layer disposed between the first and second electrodes. The piezoelectric layer comprises a piezoelectric material doped with a plurality of rare earth elements, and the cantilevered portion extends above the piezoelectric layer. The bulk acoustic wave (BAW) resonator comprises a gap between the cantilevered portion and the piezoelectric layer. | 05-08-2014 |
20140125202 | BULK ACOUSTIC WAVE (BAW) RESONATOR STRUCTURE HAVING AN ELECTRODE WITH A CANTILEVERED PORTION AND A PIEZOELECTRIC LAYER WITH MULTIPLE DOPANTS - A bulk acoustic wave (BAW) resonator, comprises: a first electrode; a second electrode comprising a plurality of sides. At least one of the sides comprises a cantilevered portion. The bulk acoustic wave (BAW) resonator also comprises a piezoelectric layer disposed between the first and second electrodes. The piezoelectric layer comprises a piezoelectric material doped with a plurality of rare earth elements, and the cantilevered portion extends above the piezoelectric layer. The bulk acoustic wave (BAW) resonator comprises a gap between the cantilevered portion and the piezoelectric layer. | 05-08-2014 |
20140119740 | Opto-Isolator With Compensation Circuit - An opto-isolator with a compensation circuit is disclosed. The compensation circuit may be configured to compensate degradation of the light source of the opto-isolator. The compensation circuit may comprise a circuit for counting an extended use of the isolator. When the count value exceeds a predetermined count value, the compensation circuit may be configured to compensate the degradation of the light source by adjusting the driver of the light source. In another embodiment, an electrical control system having such opto-isolator is illustrated. | 05-01-2014 |
20140119739 | Opto-Isolator With Correction Circuit - An opto-isolator with a correction circuit is disclosed. The correction circuit is configured to make adjustments for degradation of the light source of the opto-isolator. The correction circuit may comprise a photodetector for detecting degradation of the light source of the opto-isolator. When the light source degrades below a predetermined level, the correction circuit may be configured to make adjustments. | 05-01-2014 |
20140119691 | OPTO-COUPLER WITH LIGHT GUIDE - An optoelectronic device is disclosed. The optoelectronic device may be employed as a single or multi-channel opto-coupler that electrically isolates one circuit from another circuit. The opto-coupler may include one or more light guides that facilitate an efficient transfer of optical signals from a light source to a light detector. | 05-01-2014 |
20140118092 | ACCOUSTIC RESONATOR HAVING INTEGRATED LATERAL FEATURE AND TEMPERATURE COMPENSATION FEATURE - A bulk acoustic wave (BAW) resonator device includes a bottom electrode on a substrate over one of a cavity and an acoustic mirror, a piezoelectric layer on the bottom electrode, a top electrode on the piezoelectric layer, and a temperature compensation feature having positive temperature coefficient for offsetting at least a portion of a negative temperature coefficient of the piezoelectric layer. At least one of the bottom electrode and the top electrode includes an integrated lateral feature configured to create at least one of a cut-off frequency mismatch and an acoustic impedance mismatch. | 05-01-2014 |
20140118091 | ACOUSTIC RESONATOR HAVING COLLAR STRUCTURE - A bulk acoustic wave (BAW) resonator structure comprises a first electrode disposed over a substrate, a first piezoelectric layer disposed over the first electrode, a second electrode disposed over the first piezoelectric layer, and a collar structure disposed around a perimeter of an active region defined by an overlap between the first electrode, the second electrode, and the piezoelectric layer. | 05-01-2014 |
20140118090 | BULK ACOUSTIC WAVE RESONATOR HAVING PIEZOELECTRIC LAYER WITH MULTIPLE DOPANTS - A bulk acoustic wave (BAW) resonator structure includes a first electrode disposed over a substrate, a piezoelectric layer disposed over the first electrode and a second electrode disposed over the first piezoelectric layer. The piezoelectric layer is formed of a piezoelectric material doped with multiple rare earth elements for improving piezoelectric properties of the piezoelectric layer. | 05-01-2014 |
20140118088 | ACCOUSTIC RESONATOR HAVING COMPOSITE ELECTRODES WITH INTEGRATED LATERAL FEATURES - A bulk acoustic wave (BAW) resonator device includes a bottom electrode on a substrate over one of a cavity and an acoustic reflector, a piezoelectric layer on the bottom electrode, and a top electrode on the piezoelectric layer. At one of the bottom electrode and the top electrode is a composite electrode having an integrated lateral feature, arranged between planar top and bottom surfaces of the composite electrode and configured to create a cut-off frequency mismatch. | 05-01-2014 |
20140117815 | TEMPERATURE COMPENSATED RESONATOR DEVICE HAVING LOW TRIM SENSITIVY AND METHOD OF FABRICATING THE SAME - A temperature compensated bulk acoustic wave (BAW) resonator device has low trim sensitivity for providing an accurate resonant frequency. The BAW resonator device includes a first electrode deposited on a substrate, a piezoelectric layer deposited on the first electrode, a second electrode deposited on the piezoelectric layer, and a mirror pair deposited on the second electrode. At least one of the first electrode and the second electrode includes an electrode layer, and a temperature compensating layer configured to compensate for a temperature coefficient of at least the piezoelectric layer. | 05-01-2014 |
20140117383 | Optocoupler Having Lens Layer - An optocoupler having optical lens layer is disclosed. The optocoupler may comprise an optical emitter, an optical receiver, an isolation layer, a lens layer and a substantially transparent encapsulant. The lens layer may be integrally formed within the optical receiver. Alternatively, the lens layer may be formed integrally with the isolation layer, or the lens layer may be an optical film attached on the optical receiver. The substantially transparent encapsulant may encapsulate at least partially the optical emitter, the optical receiver and the isolation layer. The isolation layer may be inserted to the substantially transparent encapsulant, making the substantially transparent encapsulant into two compartments. In another embodiment, an electronic system having optocoupler is disclosed. | 05-01-2014 |
20140111288 | ACOUSTIC RESONATOR HAVING GUARD RING - A bulk acoustic wave (BAW) resonator structure comprises a first electrode disposed over a substrate, a piezoelectric layer disposed over the first electrode, a second electrode disposed over the first piezoelectric layer, and a guard ring structure formed around a perimeter of an active region corresponding to an overlap of the first electrode, the first piezoelectric layer, and the second electrode. | 04-24-2014 |
20140108683 | MEMORY SYSTEM THAT UTILIZES A WIDE INPUT/OUTPUT (I/O) INTERFACE TO INTERFACE MEMORY STORAGE WITH AN INTERPOSER - A memory system is provided in which at least one memory chip and a memory controller chip are mounted in a side-by-side relationship on an interposer. The memory chip is connected to the interposer via a Wide I/O interface to enable the memory chip and the memory controller chip to communicate with each other via the Wide I/O interface. The memory controller chip has an interface for communicating with an interface of an integrated circuit (IC) chip of the memory system. | 04-17-2014 |
20140105535 | LENS STANDOFF AND PROTECTION FOR OPTICAL COMMUNICATION SYSTEMS - An opto-electronic system includes a substrate, an opto-electronic chip mounted on the substrate, a frame, and a lens device retained in the frame. A frame mounting portion of the frame is in contact with an upper surface of the opto-electronic chip. A lens mounting portion of the frame is spaced above the frame mounting portion. A lower surface of the lens device is in contact with the lens mounting portion. The spacing of the lens mounting portion and frame mounting portion determines the spacing between the upper surface of the opto-electronic chip and the lower surface of the lens device. | 04-17-2014 |
20140103507 | Optical Device Package And System - Optical device packages and systems are disclosed. In one embodiment, a system may comprise first and second optical device packages. A respective first and second optical path length may be associated with the first and second optical device packages. The first and second optical path lengths may be adjusted differently. However, respective first and second sets of external dimensions of the first and second optical device packages may be the same or substantially the same. In one embodiment, one or more Quad Flat No Lead (QFN) packages may be employed. | 04-17-2014 |
20140103199 | Proximity Sensor Device With Internal Channeling Section - A proximity sensor device, which may detect the presence of external objects at close proximity is disclosed. The proximity sensor device may comprise an emitter, a detector, a separation wall and an internal channeling section. In one embodiment, the internal channeling section may be configured to direct light from the emitter to the detector when the external object is present at close proximity. In other embodiments, a proximity sensor assembly, an optical structure and an electronic device having similar internal channeling section are disclosed. | 04-17-2014 |
20140100002 | Power Amplifier Having An Integrated Microcontroller - In an embodiment, a power amplifier (PA) includes a signal processing path including gain stages to receive a radio frequency (RF) signal and to output an amplified RF signal, sensors coupled to the signal processing path each to sense a characteristic of operation of the PA, and a microcontroller configured to execute instructions and to receive the operation characteristic(s) and to control one or more parameters of the signal processing path responsive this operation characteristic. | 04-10-2014 |
20140099106 | Method and Apparatus for Aligning and Integrating Serial Data Streams - An integrated circuit is incorporated into a communications system to enable a channel to achieve data rates that are at least double that which are currently achievable. The integrated circuit combines serial data signals using recovered clock and serial data signals in reference and non-reference clock domains. The integrated circuit rate converts recovered serial data in one of the clock domains, performs a phase alignment at the converted data rate, and returns the rate converted and phase-aligned serial data to the recovered data rate in response to the recovered clock from the remaining clock domain. Thereafter, the recovered and aligned serial data signals are combined. The phase alignment is monitored in circuitry that detects when a threshold offset is violated. When the threshold offset is violated a synchronization circuit is enabled. | 04-10-2014 |
20140097536 | TWO-SIDED-ACCESS EXTENDED WAFER-LEVEL BALL GRID ARRAY (eWLB) PACKAGE, ASSEMBLY AND METHOD - A two-sided-access (TSA) eWLB is provided that makes it possible to easily access electrical contact pads disposed on both the front and rear faces of the die(s) of the eWLB package. When fabricating the IC die wafer, metal stamps are formed in the IC die wafer in contact with the rear faces of the IC dies. When the IC dies are subsequently reconstituted in an artificial wafer, portions of the metal stamps are exposed through the mold of the artificial wafer. When the artificial wafer is sawed to singulate the TSA eWLB packages and the packages are mounted on PCBs, any electrical contact pad that is disposed on the rear face of the IC die can be accessed via the respective metal stamp of the IC die. | 04-10-2014 |
20140091340 | PLASTIC LEADED CHIP CARRIER WITH DIAGONALLY ORIENTED LIGHT SOURCES FOR FINE-PITCHED DISPLAY - A Plastic Leaded Chip Carrier (PLCC) package is disclosed. The PLCC package is configured to support a plurality of light sources. The light sources may be mounted on a mounting section of the PLCC package's lead frame and the mounting section of the lead frame may extend diagonally with respect to the housing of the lead frame. | 04-03-2014 |
20140086579 | OPTICAL COUPLING SYSTEM, AN OPTICAL COMMUNICATIONS MODULE THAT INCORPORATES THE OPTICAL COUPLING SYSTEM, AND A METHOD OF USING THE OPTICAL COUPLING SYSTEM - An optical coupling system is provided that includes a unitary, or integrally-formed, optical body having lenses formed on its lower end and a diffractive grating formed on its upper end. The unitary optical body is made of a material that is transparent to an operating wavelength of light. Some of the lenses are collimating lenses and some of the lenses are focusing lenses. Diverging light beams emitted by respective laser diodes of a parallel optical transmitter module are incident on the respective collimating lenses, which collimate the respective diverging light beams to produce respective collimated light beams. The respective collimated light beams are then incident on the diffractive grating. The diffractive grating divides each collimated beam into at least a first beam that is transmitted through the grating and a second beam that is reflected by the grating onto the monitor photodiode. | 03-27-2014 |
20140084148 | OPTICAL-QUALITY COVER FOR USE WITH AN OPTICAL COUPLING SYSTEM, AND AN OPTICAL COMMUNICATIONS MODULE THAT INCORPORATES THE OPTICAL-QUALITY COVER - In an optical communications module, an optical-quality (O-Q) cover is provided for use with an optical coupling system for protecting a diffractive grating of the optical coupling system from environmental contamination. In accordance with illustrative embodiments, the O-Q cover is used with an optical coupling system that includes a unitary, or integrally-formed, optical body having lenses formed on its lower end and a diffractive grating formed on its upper end. The O-Q cover is disposed in proximity to the diffractive grating and is mechanically coupled to the optical coupling system in a way that seals the portion of the optical coupling system comprising the diffractive grating in order to protect the diffractive grating from environmental contamination. | 03-27-2014 |
20140084145 | OPTICAL PACKAGE WITH REMOVABLY ATTACHABLE COVER - An optical package having a removably attachable cover and a body is disclosed. The body comprises a ridge whereas the cover comprises a ridge opposing structure. The cover may be form-fitted onto the body defining therein a compartment for receiving an optical sensor. The optical sensor may receive light from an aperture located on the cover. The cover may be secured onto the body through an interlocking structure. Depending on the application, the optical package may further comprise a radiation source, and/or an additional compartment for the radiation source. The optical package may be suitable for navigation sensors, proximity sensors, ambient optical sensors or any other optical devices. | 03-27-2014 |
20140064676 | PARALLEL OPTICAL COMMUNICATION MODULE CONNECTOR - An optical connector includes a connector housing and an optics device. A plurality of optical fibers are retained in a fiber port of the connector. The fiber port has two fiber guide arrays oriented at an angle with respect to each other. Portions of the fibers between the two fiber guide arrays flex as the optics device and connector housing are assembled together. The resilient force of the flexed fibers maintains the fiber ends seated within the fiber guide arrays to facilitate further handling, such as applying an adhesive to further secure the fiber ends in the connector. | 03-06-2014 |
20140063743 | METHODS AND SYSTEMS FOR DISSIPATING HEAT IN OPTICAL COMMUNICATIONS MODULES - Heat dissipation resources are allocated in an optical communications module based on the sensitivity of electrical and optoelectronic components of the module to temperature. Components that have a higher sensitivity to temperature are allocated a greater proportion of available heat dissipation resources than components that have a lower sensitivity to temperature. In addition, heat dissipation resources that are allocated to components that have different sensitivities to temperature are thermally decoupled from one another. | 03-06-2014 |
20140056592 | AIR-COOLED OPTICAL TRANSCEIVER MODULE SYSTEM - In an opto-electronic system having one or more optical transceiver modules and an enclosure, air is forced through the interior of the transceiver module to dissipate heat generated by the opto-electronic and electronic elements. | 02-27-2014 |
20140056591 | THERMALLY COMPENSATED PARALLEL OPTICAL COMMUNICATION MODULE - In a parallel optical communication module, an array of opto-electronic devices secured with respect to a mount and an array of optical elements of an optical device that is also secured with respect to the mount are unconstrained against relative movement due to thermal expansion of the mount and optical device. The mount and optical device can be made of materials having similar coefficients of thermal expansion. As thermal expansion in the mount causes the opto-electronic devices to move, similar thermal expansion in the optical device causes the optical elements to move to a similar extent. This co-movement of the opto-electronic devices and optical elements to similar extents promotes continued maintenance of optical alignment between opto-electronic elements and corresponding optical elements. | 02-27-2014 |
20140055170 | METHOD, SYSTEM, AND APPARATUS FOR EFFICIENTLY DRIVING A TRANSISTOR WITH A BOOSTER IN VOLTAGE SUPPLY - A method, system, and apparatus for driving a Silicon Carbide (SiC) Junction Field Effect Transistor (JFET) are provided. A boosting capacitor is used in combination with two drivers to efficiently provide a boosting current to the SiC JFET and then a holding current to the SiC JFET. The boosting capacitor, upon discharge, creates the boosting current and once discharged the holding current is provided by one of the first and second drivers. | 02-27-2014 |
20140049322 | POWER AMPLIFIER - A power amplifier comprises a common source amplification stage and a first common gate amplification stage. The common source amplification stage includes a common source transistor for receiving a radio frequency (RF) input signal via a gate. The first common gate amplification stage is connected in cascode between a variable supply voltage source and the common source amplification stage, and amplifies an output of the common source amplification stage. The first common gate amplification stage includes a first common gate transistor, and a first gate bias controller configured to generate a first divided voltage based on a variable supply voltage of the variable supply voltage source, and to supply a first gate bias voltage generated by buffering the first divided voltage to a gate of the first common gate transistor. | 02-20-2014 |
20140044388 | OPTO-ELECTRONIC SYSTEM HAVING FLIP-CHIP SUBSTRATE MOUNTING - An opto-electronic system includes a system substrate, a lens, a bridging device, and an opto-electronic chip mounted in a cavity in the system substrate. The bridging device, which can be another chip, a lens block, or an interposer, is mounted in flip-chip orientation to the opto-electronic chip and provides electrical interconnection with signal conductors of the system substrate. | 02-13-2014 |
20140042344 | FACE-TO-FACE OPTOCOUPLER DEVICE AND METHOD OF MANUFACTURE - An optoelectronic device is disclosed. The optoelectronic device may be employed as a single or multi-channel opto-coupler that electrically isolates one circuit from another circuit. The opto-coupler may include one or more folded leads that establish an enhanced isolation gap. The enhanced isolation gap may include an interruption in the insulation of the opto-coupler between the light source and the light detector. In addition, this interruption may further include a efficiency enhancer, or lens, to direct light emitted from the light source. Accordingly, the creepage distance and operational voltages of the opto-coupler can be increased while maintaining high efficiency levels. | 02-13-2014 |
20140010514 | METAL STRAIN RELIEF DEVICE FOR USE IN AN OPTICAL COMMUNICATIONS SYSTEM, AN OPTICAL FIBER CABLE THAT EMPLOYS THE STRAIN RELIEF DEVICE, AND A METHOD - A strain relief device and method are provided for use with an optical fiber cable of an optical communications system. The strain relief device comprises a plurality of metal wires, or rods, grouped into a bundle of parallel metal wires and a clamping mechanism for clamping first and second ends of the metal wires to an optical fiber cable. The clamped bundle of metal wires forms a spring having a spring constant that provides it with a desired stiffness and a desired flexibility. | 01-09-2014 |
20130318385 | METHOD FOR PERFORMING POWER MANAGEMENT IN AN ACTIVE OPTICAL CABLE (AOC) - An active optical cable is provided that incorporates a power management solution. The AOC has plugs are configured to mate with respective USB sockets. The AOC is used to interconnect a USB host with a USB device. To the USB host and to the USB device, the AOC appears to be a standard USB electrical cable. Each of the plugs of the AOC has an optical-to-electrical and an electrical-to-optical (OE/EO) conversion module that converts electrical USB signals output from the USB host or USB device into optical signals and converts optical signals carried on the optical fibers of the AOC into electrical USB signals. The plugs include controllers that monitor certain conditions of the AOC and that select the power levels to be used in the plugs based on detected conditions. | 11-28-2013 |
20130314177 | ACOUSTIC RESONATOR COMPRISING COLLAR, FRAME AND PERIMETER DISTRIBUTED BRAGG REFLECTOR - An acoustic resonator includes a bottom electrode disposed over a substrate, a piezoelectric layer disposed over the bottom electrode, a top electrode disposed over the piezoelectric layer, and a cavity disposed beneath the bottom electrode. An overlap of the bottom electrode, the piezoelectric layer and the top electrode defines a main membrane region of the acoustic resonator structure. The acoustic resonator further includes an acoustic reflector disposed over the substrate adjacent to the cavity, the acoustic reflector including a layer of low acoustic impedance material stacked on a layer of high acoustic impedance material. | 11-28-2013 |
20130313447 | OPTO-COUPLER - An optoelectronic device is disclosed. The optoelectronic device may be employed as a single or multi-channel opto-coupler that electrically isolates one circuit from another circuit. The opto-coupler may include one or more light guides and an insulative tape that helps define a shape of the one or more light guides. | 11-28-2013 |
20130251376 | MODULAR CONNECTOR ASSEMBLY CONFIGURED WITH BOTH OPTICAL AND ELECTRICAL CONNECTIONS FOR PROVIDING BOTH OPTICAL AND ELECTRICAL COMMUNICATIONS CAPABILITIES, AND A SYSTEM THAT INCORPORATES THE ASSEMBLY - A modular connector assembly is provided that has both an electrical coupling configuration that complies with the RJ-45 wiring standard and an optical coupling configuration that provides the assembly with optical communications capabilities. In addition, the modular connector assembly is configured to have backwards compatibility with existing 8P8C jacks and plugs that implement the RJ-45 wiring standard. Consequently, the modular connector assembly may be used to communicate optical data signals at higher data rates (e.g., 10 Gb/s and higher) or to communicate electrical data signals at lower data rates (e.g., 1 Gb/s). | 09-26-2013 |
20130177036 | THREE-TERMINAL VERTICAL CAVITY SURFACE EMITTING LASER (VCSEL) AND A METHOD FOR OPERATING A THREE-TERMINAL VCSEL - A three-terminal VCSEL is provided that has a reduced fall time that allows the VCSEL to be operated at higher speeds. Methods of operating the three-terminal VCSEL are also provided. The VCSEL can be operated at higher speeds without decreasing the optical output of the VCSEL when its in the logical HIGH state. | 07-11-2013 |
20130176086 | DOUBLE BULK ACOUSTIC RESONATOR COMPRISING ALUMINUM SCANDIUM NITRIDE - A method of forming a double bulk acoustic resonator structure comprises forming a first electrode on a substrate, forming a first piezoelectric layer on the first electrode, forming a second electrode on the first piezoelectric layer, forming a second piezoelectric layer on the second electrode, and forming a third electrode on the second piezoelectric layer. The first and second piezoelectric layers are formed by a sputter deposition process using at least one sputter target comprising a combination of scandium and aluminum. | 07-11-2013 |
20130176085 | HYBRID BULK ACOUSTIC WAVE RESONATOR - A hybrid bulk acoustic wave (BAW) resonator comprises a first electrode, a second. electrode, a piezoelectric layer disposed between the first and second electrodes, and a single mirror pair disposed adjacent the second electrode. In one example, the hybrid bulk acoustic wave resonator further comprises a substrate, and the first electrode is disposed adjacent the substrate. A method of fabricating a hybrid BAW resonator is also disclosed. | 07-11-2013 |
20130163938 | CONNECTOR SYSTEM HAVING ELECTRICAL AND OPTICAL LINKS WITH OPTICAL LINK CLEANER - In a connector system, a first connector is mechanically and optically mateable with a second connector to form one or more optical signal communication links. A wiping cleaner is included on at least one of the first and second connectors for cleaning an optical port of the other of the first and second connectors when the connectors are plugged together. The first and second connectors can further be electrically mateable to provide both optical and electrical signal communication links. | 06-27-2013 |
20130156442 | PARALLEL OPTICAL TRANSCEIVER MODULE THAT UTILIZES A FOLDED FLEX CIRCUIT THAT REDUCES THE MODULE FOOTPRINT AND IMPROVES HEAT DISSIPATION - A parallel optical transceiver module is provided that uses a folded flex circuit arrangement that reduces the footprint of the transceiver module while also providing the module with improved heat dissipation characteristics. In addition, the manner in which components are mounted on the flex circuit facilitates assembly of the module, reducing the overall cost of the module while improving manufacturing yield. | 06-20-2013 |
20130114822 | PIEZOELECTRIC MICROPHONES - Electronic devices and microphone devices are described. | 05-09-2013 |
20130050982 | Method And Apparatus For A Light Source - A light-emitting device having a light source die mounted within an aperture is disclosed. The aperture is covered by a die attach pad on one side. The light source die is mounted on a die attach pad within the aperture. In one embodiment, an optical coupling layer can be formed within an aperture encapsulating a light source die. A wavelength converting layer can be formed on the substrate above the optical coupling layer. The wavelength converting layer can comprise a high density layer and a low density layer. The high density layer can comprise wavelength-converting material precipitated on one side of the wavelength converting layer. The low density layer can comprise the wavelength-converting material in particle form suspended within the wavelength converting layer. In one embodiment, the wavelength converting layer may be confined within the aperture of the substrate. | 02-28-2013 |
20130049545 | RESONATOR DEVICE INCLUDING ELECTRODES WITH BURIED TEMPERATURE COMPENSATING LAYERS - An acoustic resonator includes a substrate and a first composite electrode disposed over the substrate. The first composite electrode includes first and second electrically conductive layers and a first temperature compensating layer disposed between the first and second electrically conductive layers. The second electrically conductive layer forms a first electrical contact with the first electrically conductive layer on at least one side of the first temperature compensating layer, and the first electrical contact electrically shorts a first capacitive component of the first temperature compensating layer. | 02-28-2013 |
20110140133 | LIGHT EMITTING DEVICE HAVING INCREASED LIGHT OUTPUT - The light intensity emitted from a package is increased by adjusting a portion of the package encapsulant so that light impacting the side walls of the adjusted encapsulant portion will encounter total internal reflection (TIR) with the reflected light directed toward the top surface of the package. The adjusted portion of the package is positioned so that air can be used as the second (exterior) medium with the critical TIR angle being such that light emitted from a light source (such as from an LED die) will be directed primarily so as to escape the package from the top surface as opposed to being scattered internal to the package. In one embodiment, a lower portion of the encapsulant is surrounded by a casing to inwardly direct light from the light source that impacts the side of the encapsulant with an angle less than the critical TIR angle. | 06-16-2011 |
20100149578 | PRINTER FORMATTER IN A CABLE - A printer cable that is configured for coupling to a printer having an enclosure and a printer port. The printer cable includes a first connector for connecting to the printer port and a second connector for coupling to a host device (e.g., a personal computer (PC)). The printer cable includes a printer formatter for providing formatting services to the printer via the first connector. Since the printer formatter is integrated into the printer cable, the printer formatter is external to the printer enclosure and is easily removable and configurable by a user. | 06-17-2010 |
20100139852 | METHOD FOR HIGH-VOLUME PRODUCTION OF LIGHT EMITTING DIODES WITH ATTACHED LENSES - A method for high-volume production of light emitting diodes with attached lenses involves providing pre-fabricated lenses, wherein the pre-fabricated lenses are held by a common transfer structure, simultaneously attaching the pre-fabricated lenses to respective ones of light emitting diodes, and releasing the pre-fabricated lenses from the common transfer structure. In an embodiment, the light emitting diodes are distributed in a pattern on a common substrate and the common transfer structure is configured to hold the pre-fabricated lenses in a pattern that corresponds to the pattern of the light emitting diodes on the common substrate. Further, to attach the pre-fabricated lenses to the light emitting diodes, the common transfer structure is positioned relative to the common substrate such that the pre-fabricated lenses are aligned with the light emitting diodes. | 06-10-2010 |
20100066680 | METHODS AND SYSTEMS FOR MEASURING SPECKLE TRANSLATION WITH SPATIAL FILTERS - Two or more spatial filters are used in determining velocity based on speckle translation. A light source may be turned on, turned off, or both for a variable amount of time during operation. The velocity may then be determined with trend identification, correlation, recursive frequency estimation, or measurement bandwidth variation. A confidence level may also be calculated for the measured velocity, and the measured velocity reported or used only when the calculated confidence level meets or exceeds a given value. | 03-18-2010 |
20090201108 | Switched Length Match Transmission Path Instrument - A testing apparatus includes one or more trace banks. Each trace bank includes (1) an input switch operable to couple an input port to one of multiple output ports, (2) an output switch operable to couple one of multiple input ports to one output port, and (3) transmission lines of different lengths coupled between the output ports of the input switch and the input ports of the output switch. The trace banks can be cascaded using cables to connect their output and input ports. The input and output switches in the trace banks are controlled to provide a transmission path of the desired length. | 08-13-2009 |
20090127446 | Optical Encoder Apparatus for Removable Connection with Printed Circuit Board and Methods of Assembling Optical Encoder - There is disclosed optical encoder apparatus for removable connection with a printed circuit board. In an embodiment, the apparatus includes a light emitting component, a light detecting component, a mounting component for attaching the light emitting component thereon, and another mounting component for attaching the light detecting component thereon, wherein each of the mounting components have a removable connection with the printed circuit board. A method of assembling optical encoder apparatus is disclosed. In an embodiment, the method includes attaching a light emitting component and a terminal of a first mounting component to one another; attaching a light detecting component and a terminal of a second mounting component to one another; attaching a terminal of the first mounting component to a printed circuit board; and attaching a terminal of the second mounting component to the printed circuit board. Other embodiments are also disclosed. | 05-21-2009 |
20090061929 | Cell Phone Based Product Research - A cell phone is used to access product information. The cell phone obtains a universal product code (UPC) for a product. A product identifier for the product along with a request for information about the product is sent from the cell phone to a remote site. The remote site obtains the requested information. The remote site sends the requested information to the cell phone. The cell phone communicates the requested information to the user. | 03-05-2009 |
20090057542 | ABSOLUTE ENCODER UTILIZING LIGHT OF DIFFERENT WAVELENGTHS TO RECUDE CROSS TALK - An encoder having a code scale, an illumination system, and a plurality of photodetectors is disclosed. The code scale has a plurality of tracks that are illuminated by the illumination system. Each photodetector receives light from a corresponding one of the tracks and generates a signal indicative of a quantity of light received from that track. Each photodetector is limited to detecting light in a band of wavelengths corresponding to that track. Each track generates light in a band of wavelengths corresponding to that track, and the band of wavelengths corresponding to one of the tracks is different from the band of wavelengths corresponding to the tracks that are next to that track. The tracks can include alternating reflective and absorptive stripes, alternating transmissive and reflective stripes, or alternating luminescent and absorptive stripes. | 03-05-2009 |