AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Patent applications |
Patent application number | Title | Published |
20160105953 | METHOD FOR PRODUCING A CIRCUIT BOARD CONSISTING OF A PLURALITY OF CIRCUIT BOARD AREAS AND CIRCUIT BOARD - For a method for producing a circuit board consisting of a plurality of circuit board areas, wherein the individual circuit board areas comprise at least one layer made of an in insulating base material and a conducting pattern located on or in, the base material, the following is provided: a substrate material, at least one registration mark formed in the substrate material, a first circuit board area arranged on the substrate material, at least one additional circuit board area, which substantially adjoins the first circuit board area or at least partially overlaps the first circuit board, the additional circuit board areas being oriented relative to the registration mark, and a plurality of connections of the conducting patterns of the first circuit board area and of the at least one additional circuit board area. Thus improved registration and orientation can be achieved when circuit board areas are coupled. | 04-14-2016 |
20160044794 | METHOD FOR PRODUCING A CIRCUIT BOARD ELEMENT - The invention relates to a method for producing a circuit board element having at least one electronic component, which component has a connection side defined by electrical contacts or a conductive layer and is connected to a temporary carrier for positioning and embedded in an insulating material; the component is attached in a specified position directly to a plastic film as a temporary carrier, whereupon a composite layer having at least a carrier and an electrical conductor, preferably also having an insulating material, is attached on the side of the component opposite the plastic film, with the carrier facing away from the component, and thereafter the plastic film is removed; then the component is embedded in insulating material, After the embedding of the component in the insulating material, an additional composite layer is preferably attached to the component and the embedding of the component on the side opposite the first composite layer. | 02-11-2016 |
20150327359 | Printed Circuit Board - A printed circuit board that includes conductive layers separated by insulation layers of dielectric material, at least one conductive layer being patterned and having at least one signal line embedded in an insulation material, whereby a conductive ground plan layer, separated by the insulation material and lying in a predetermined distance (d) from the at least one signal line includes a ground plane area associated to and extending along the at least one signal line, the conductive layer associated to and extending along the at least one signal line is provided with openings therein. Preferably the openings are spaces between conducting stripes, extending, seen from above, across the at least one signal line, the conducting stripes being integrally connected with the conductive remainder of the conductive layer. | 11-12-2015 |
20150083191 | PHOTOVOLTAIC MODULE AND USE THEREOF - In the case of a photovoltaic module which comprises a plurality of solar cells which are each coupled to an electrically conductive, structured layer for discharging the electrical energy generated in the solar cells, wherein at least two subregions of the photovoltaic module are coupled to one another via a flexible connecting region, provision is made for the solar cells to be coupled on the rear side of said solar cells to the electrically conductive, structured layer, and for the electrically conductive, structured layer to be integrated in a multilayered film arranged on the rear side of the solar cells, wherein the multilayered film forms the flexible connecting region between the at least two subregions of the photovoltaic module, as a result of which a photovoltaic module which can be tilted or folded can be made available. | 03-26-2015 |
20140216795 | METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT BOARD, ADHESION PREVENTION MATERIAL AND MULTILAYER PRINTED CIRCUIT BOARD AND USE OF SUCH A METHOD - In a method for producing a multilayer printed circuit board from a plurality of conducting or conductive and non-conducting or insulating layers or plies to be connected to each other, in particular to be pressed together, wherein after connecting at least partially planar layers at least a partial region ( | 08-07-2014 |
20140216793 | METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD OR A SUB-ASSEMBLY THEREOF AS WELL AS PRINTED CIRCUIT BOARD OR A SUB-ASSEMBLY THEREOF AND USE THEREOF - A method of manufacturing a printed circuit board or a sub-assembly thereof comprises the following steps:
| 08-07-2014 |
20140216792 | METHOD OF MANUFACTURING A RIGID-FLEX PRINTED CIRCUIT BOARD OR A SUB-ASSEMBLY THEREOF AS WELL AS RIGID-FLEX PRINTED CIRCUIT BOARD OR A SUB-ASSEMBLY THEREOF - A method of manufacturing a rigid-flex printed circuit board or a sub-assembly thereof comprises the following steps:
| 08-07-2014 |
20140000941 | METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCUIT BOARD OR A PRINTED CIRCUIT BOARD INTERMEDIATE PRODUCT, AND PRINTED CIRCUIT BOARD OR PRINTED CIRCUIT BOARD INTERMEDIATE PRODUCT | 01-02-2014 |
20130193828 | HEIGHT ADJUSTABLE RESTING DEVICE FOR AN INTERNAL SHELF OF AN ELECTRIC HOUSEHOLD APPLIANCE - A height adjustable resting device including a first plate fixable in use against a wall of an electric household appliance; a the second plate having a resting guide slidingly carried along longitudinal edges vertical to the first; a slider sliding on a first face of the first plate, facing an opposite second face of the second plate, transversally to the longitudinal edges, integrally provided with a pin which overhangingly protrudes from the first face; a channel-shaped track on the second face, slidingly engaged by the pin and having two branches parallel to the longitudinal edges, having on an upper edge a plurality of recesses adapted to engage the pin resting thereon and for each recess, at least one pair of abutting surfaces obtained on a lower edge to guide the pin from a recess to the next as a consequence of a vertical movement of the second plate. | 08-01-2013 |
20130149506 | NONSTICK MATERIAL, METHOD FOR REMOVING A PART OF A PLANAR MATERIAL LAYER AND MULTILAYER STRUCTURE AND USE THEREFOR - The invention relates to a nonstick material for use during removal of a part ( | 06-13-2013 |
20130126091 | ADHESIVE FOR FIXING AND/OR EMBEDDING AN ELECTRONIC COMPONENT AND METHOD AND USE - In the case of an adhesive for fixing an electronic component on a circuit board and/or for embedding an electronic component into a circuit board, the electronic component to be fixed and/or embedded being fixed by means of an adhesive bond on a ply or layer of a circuit board, and fixing optionally being followed by jacketing by plies, and/or by covering by at least one further ply, an epoxy resin-based adhesive is selected, which has at least one added additive to adjust the surface tension and/or viscosity, especially a defoamer and/or an additive for adjusting the levelling properties, which can achieve reliable fixing of a component, especially with avoidance of cavities or air inclusions below the surface of the component to be fixed. Also provided are a method and a use. | 05-23-2013 |