Asahi Denka Kenkyusho Co., Ltd. Patent applications |
Patent application number | Title | Published |
20150295334 | CONNECTOR STRUCTURE, FEMALE CONNECTOR, AND MALE CONNECTOR - A device including male and female connectors each including mounting pad terminals arranged on both side portions of a surface mounted on a circuit board, and a connector structure. The female connector includes: an insulating film; pad portions formed on one surface of the insulating film; a metal guide member fixedly disposed to cover the other surface of the insulating film and insulatingly coated; female terminal portions including slit openings penetrating in a thickness direction through the pad portions and portions of the insulating film; through-holes penetrating through the metal guide member; and mounting pad terminals formed on both side portions of the other surface of the insulating film, with surfaces projecting more than a surface of the metal guide member and electrically connected to the pad portions respectively. The connector structure includes male terminal portions inserted to the slit openings from the female connector's one surface side. | 10-15-2015 |
20110269321 | CONNECTOR STRUCTURE - A connector structure which can realize height reduction of connecting portions and space saving and which prevents separation of a female connector and a male connector from each other due to an impact or vibrations, wherein a conduction structure is formed by bringing connecting pins ( | 11-03-2011 |
20110039427 | FEMALE CONNECTOR, MALE CONNECTOR ASSEMBLED TO THE SAME, AND ELECTRIC/ELECTRONIC APPARATUS USING THEM - A female connector which is useful for space saving and height reduction of a connector connection portion is a female connector including: an insulating film having flexibility; a plurality of pad portions formed at predetermined positions on one face of the insulating film in an arranged manner; female terminal portions composed of openings formed at one lateral portions within faces of the pad portions so as to extend up to the other face of the insulating film; and spacer bumps formed at positions corresponding to the other lateral positions within the faces of the pad portions in a standing manner within the other face of the insulating film, proximal portions of the spacer bumps being electrically connected to the pad portions. | 02-17-2011 |