ARKANSAS POWER ELECTRONICS INTERNATIONAL, INC. Patent applications |
Patent application number | Title | Published |
20150216067 | LOW PROFILE, HIGHLY CONFIGURABLE, CURRENT SHARING PARALLELED WIDE BAND GAP POWER DEVICE POWER MODULE - A power module with multiple equalized parallel power paths supporting multiple parallel bare die power devices constructed with low inductance equalized current paths for even current sharing and clean switching events. Wide low profile power contacts provide low inductance, short current paths, and large conductor cross section area provides for massive current carrying. An internal gate & source kelvin interconnection substrate is provided with individual ballast resistors and simple bolted construction. Gate drive connectors are provided on either left or right size of the module. The module is configurable as half bridge, full bridge, common source, and common drain topologies. | 07-30-2015 |
20150131236 | HIGH VOLTAGE POWER CHIP MODULE - A power die module using a compression connection to a power die in a small package with corona extenders positioned around short efficient path exterior electrical connections. The module is built from a baseplate with connected sidewalls forming an interior compartment holding a power substrate with attached threaded inserts. A printed circuit board bolted to the power substrate with high voltage power die compressively held between the board and the substrate. The compressive hold enhances the electrical connections between the contacts on the top and bottom of the power die and either the power substrate or the printed circuit board. Exterior blade connectors extend upward from the printed circuit board through blade apertures in a lid that covers the interior compartment. The lid includes corona extenders positioned around the blade apertures to allow for high voltage applications while maintaining a small size lightweight package. The sidewall has a perimeter that also includes one or more corona extenders. | 05-14-2015 |
20130221514 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR THE SAME - Provided is a double-sided cooling structure for a semiconductor device using a low processing temperature and reduced processing time utilizing solid phase diffusion bonding. The fabrication method for this system is provided. The semiconductor device | 08-29-2013 |
20110079792 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE - Provided are a semiconductor device and a method of fabricating the semiconductor device, the semiconductor device including: a source trace, a drain trace, and a gate trace placed on a substrate; a transistor which is placed on the drain trace and includes a source pad and a gate pad; insulating films placed between the drain and source traces and between the drain and gate traces on the substrate so as to cover sidewall surfaces of the transistor; a source spray electrode which is placed on the insulating film between the source and drain traces and connects the source pad of the transistor and the source trace; and a gate spray electrode placed on the insulating film between the gate and drain traces and connects the gate pad of the transistor and the gate trace. | 04-07-2011 |
20100039779 | Wireless Telemetry Electronic Circuit Board for High Temperature Environments - A circuit assembly ( | 02-18-2010 |
20100039290 | Wireless Telemetry Electronic Circuitry for Measuring Strain in High-Temperature Environments - In a telemetry system for use in an engine, a circuit structure ( | 02-18-2010 |
20100039289 | Wireless Telemetry Electronic Circuit Package for High Temperature Environments - A circuit assembly ( | 02-18-2010 |
20100039288 | Wireless Telemetry Circuit Structure for Measuring Temperature in High Temperature Environments - A circuit affixed to a moving part of an engine for sensing and processing the temperature of the part. The circuit generates a signal representative of the temperature sensed by a thermocouple ( | 02-18-2010 |
20090121896 | Instrumented Component for Wireless Telemetry - A telemetry system for use in a combustion turbine engine ( | 05-14-2009 |