Ajinomoto Co., Inc.
|Ajinomoto Co., Inc. Patent applications|
|Patent application number||Title||Published|
|20150254411||METHOD OF EVALUATING PANCREATIC CANCER, PANCREATIC CANCER-EVALUATING APPARATUS, PANCREATIC CANCER-EVALUATING METHOD, PANCREATIC CANCER-EVALUATING PROGRAM PRODUCT, PANCREATIC CANCER-EVALUATING SYSTEM, AND INFORMATION COMMUNICATION TERMINAL APPARATUS - A method of evaluating pancreatic cancer includes (I) an obtaining step of obtaining amino acid concentration data on a concentration value of an amino acid in blood collected from a subject to be evaluated, and (II) an evaluating step of evaluating a state of pancreatic cancer in the subject by calculating a value of a formula using the amino acid concentration data of the subject obtained at the obtaining step and the formula previously established for evaluating the state of pancreatic cancer, including an explanatory variable to be substituted with the concentration value of the amino acid. The amino acid concentration data includes the concentration values of at least two amino acids of Asn, His, Thr, Ala, Cit, Arg, Tyr, Val, Met, Lys, Trp, Gly, Pro, Orn, Ile, Leu, Phe, Ser, and Gln, and the formula includes at least two explanatory variables to be substituted with the concentration values of at least two amino acids of Asn, His, Thr, Ala, Cit, Arg, Tyr, Val, Met, Lys, Trp, Gly, Pro, Orn, Ile, Leu, Phe, Ser, and Gln.||09-10-2015|
|20150250052||METHOD FOR PRODUCING PRINTED WIRING BOARD - Printed wiring boards, in which the insulating layer exhibits excellent peel strength with respect to a conductive layer after a roughening treatment, even when using a resin composition having a high content of inorganic filler, may be obtained by: (A) laminating, onto an internal layer substrate, an adhesive sheet which includes a support and a resin composition layer in contact with the support, so that the resin composition layer is in contact with the internal layer substrate; (B) thermally curing the resin composition layer to form an insulating layer; and (C) removing the support, when the support satisfies certain conditions (TD1) and (TD2) in a TD direction thereof when it is heated under specific heating conditions.||09-03-2015|
Patent applications by Ajinomoto Co., Inc.