ADPV TECHNOLOGY LIMITED Patent applications |
Patent application number | Title | Published |
20140220878 | GAS RELEASE DEVICE FOR COATING PROCESS - A gas release device for a coating process includes an upper plate, a first intermediate plate, a second intermediate plate, and a lower plate, four of which are superposed on each other from top to bottom. The upper plate is linked and communicates with the first intermediate plate through a first passage. The first intermediate plate is linked and communicates with the second intermediate plate through at least two second passages. The second intermediate plate is linked with the lower plate through at least four third passages. The lower plate includes at least four ventholes. In light of this, after a gas of a vapor deposition source enters the inlet, the gas of the same amount can be released out of each venthole to make the thickness of a thin film uniform for relatively higher quality of the coating process. | 08-07-2014 |
20140216577 | GAS RELEASE DEVICE FOR COATING PROCESS - A gas release device is formed of two plates combined together. Each of the plates includes an intake groove. Each of the intake grooves is linked with a first distribution groove. Each of the first distribution grooves is linked with two second distribution grooves. Each of the second distribution grooves is linked with two third distribution grooves. Each of the third distribution grooves is linked with two fourth distribution grooves. Each of the fourth distribution grooves is linked with two fifth distribution grooves. Each of the fifth distribution grooves has a venthole. After a gas of a vapor deposition source enters the intake groove, the gas passes through the first, second, third, fourth, and fifth distribution grooves in order and then substantially equal amount of the gas is finally released out of each of the ventholes. | 08-07-2014 |
20130240189 | COOLING PLATE - A cooling plate includes a casing being internally divided into an upper chamber and a lower chamber; an air inlet deposited on at least one lateral wall of the casing enclosing the upper chamber; a plurality of through holes being formed on the partition board and such arranged that the through holes closer to the air inlet are smaller in diameter and the through holes farther from the air inlet are larger in diameter, wherein the upper chamber and the lower chamber are communicated to each other via the through holes; and a plurality of air outlets provided on a lower board below the lower chamber for communicating the lower chamber to an exterior of the casing, wherein the air outlets are identical in diameter and arranged into a matrix-like pattern. | 09-19-2013 |