ADLINK TECHNOLOGY INC. Patent applications |
Patent application number | Title | Published |
20150048073 | HEATING ELEMENT AND CIRCUIT MODULE STACK STRUCTURE - A heating element and circuit module stack structure includes a circuit module carrying a chip unit, a heat sink having a flat bottom block protruded from a thermally conductive base member and in contact with the chip unit, a heat transfer layer set between the thermally conductive base member and the chip unit around the flat bottom block, an electric heating element mounted in between the heat transfer layer and the thermally conductive base member around the flat bottom block for heating the chip unit, and a thermal insulation component isolating the thermally conductive base member from the electric heating element. The circuit module turns on the electrical heating element when the temperature of the chip unit drops blow 0° C., and turns off the electrical heating element when the temperature reaches the normal operating temperature range, enabling the computer to be used in a low temperature or cold outdoor environment. | 02-19-2015 |
20140308840 | USB FLASH DRIVE POSITIONING STRUCTURE - A USB flash drive positioning structure includes a circuit board carrying an electrical connector that defines therein an insertion slot for receiving a USB flash drive, and a USB flash drive positioning guide including a rectangular cage disposed above the electrical connector, an insertion passage defined in the rectangular cage in communication and alignment with the insertion slot of the electrical connector for the insertion of a USB flash drive into the insertion slot of the electrical connector and curved springy retaining arms suspending inside the rectangular cage around the insertion passage for retaining the inserted USB flash drive in the insertion passage. | 10-16-2014 |
20140308838 | USB CONNECTOR POSITIONING STRUCTURE - A USB connector positioning structure includes a protective casing affixed to a frame shell of a machine case around a USB connector insertion slot for guiding insertion of a male USB connector through the USB connector insertion slot into a plug hole in a female USB connector at a circuit board inside the machine case, and a positioning holder shell pivotally coupled to the protective casing and biasable between a close horizontal position and an opened vertical position and movable along two horizontal guide slots of the protective casing for holding an inserted male USB connector in connection with the female USB connector in the machine case and protecting the inserted male USB connector against external pressure, and holding screws for locking the protective casing and the inserted gale USB connector in position. | 10-16-2014 |
20140182817 | LOW THERMAL RESISTANCE COOLER MODULE FOR EMBEDDED SYSTEM - A low thermal resistance cooler module includes a heat-transfer base member defining a recess and multiple elongated, curved locating grooves, flat heat pipes set in the elongated, curved locating grooves with respective hot interfaces thereof suspending in the recess and respective cold interfaces thereof bonded to the heat-transfer base member, a heat-transfer block fixedly mounted with the hot interfaces of the flat heat pipes in the recess of the heat-transfer base member for transferring waste heat from a heat source of an external circuit board by direct contact, and connection plates respectively connected between the heat-transfer block and the heat-transfer base member. | 07-03-2014 |
20140063731 | ADJUSTABLE HEAT SINK ASSEMBLY - An adjustable heat sink assembly includes a thermo-conductive bottom panel having a flat contact face protruded from the bottom wall thereof, elevation-adjustment fasteners mounted in the thermo-conductive bottom panels and fastened to a circuit board and vertically adjusted to keep the flat contact face in positive contact with a heat source at the circuit board, a thermo-conductive top panel, pitch-adjustment fasteners joining the thermo-conductive bottom panel and the thermo-conductive top panel and adjustable to control the distance between the thermo-conductive bottom panel and the thermo-conductive top panel and to keep the thermo-conductive top panel in positive contact with the housing, face panel or radiation fin of the electronic apparatus using the circuit board, and heat pipes connected between the thermo-conductive bottom panel and the thermo-conductive top panel. | 03-06-2014 |
20130294039 | WALL-MOUNTING STRUCTURE FOR WALL-MOUNTED ELECTRONIC DEVICE - A wall mounting structure for wall-mounted electronic device includes a device shell having a coupling structure disposed in an accommodation open chamber therein at two opposite lateral sides, a circuit board mounted in the accommodation open chamber, a cover plate having sliding coupling rods respectively extended from two side flanges thereof and detachably coupled to the coupling structure of the device shell and a bottom flange attached to the bottom side of the device shell to support the device shell, and two mounting brackets affixed to the cover plate at two opposite lateral sides for fastening to a wall of an external object. | 11-07-2013 |
20100064278 | PROGRAMMING SYSTEM AND PROGRAM EXPANDING METHOD - The invention provides a programming system comprising a software component, a client side, and N expanding module. The software component comprises a receiving/processing interface and N first link interface; the client side could be used for transferring client information to the software component through the receiving/processing interface; and each expanding module is corresponding to one of the first link interface and comprises an expanding content. Accordingly, a connecting relation could be built between the software component and one expanding module, corresponding to the client information, of the N expanding module through the first link module, so that the software component can communicate with the expanding module to obtain the expanding content. | 03-11-2010 |
20090021918 | STACKED HEAT-TRANSFER INTERFACE STRUCTURE - A stacked heat-transfer interface structure for dissipating heat from a circuit board is disclosed to include a heat plate affixed to the circuit board, and relatively thinner first heat transfer devices and relatively thicker second heat transfer devices respectively attached to first and second heat generating electronic devices of the circuit board that have different heights for transferring heat from the first and second heat generating electronic devices of the circuit board to the heat plate for dissipation. Each first heat transfer device comprises a first heat-transfer sheet member having a high heat conductivity and a low thermal resistance and bonded to one first heat generating electronic device, an elastically deformable second heat-transfer sheet member having a low heat conductivity and a high thermal resistance and bonded to the heat plate to compensate for height tolerance of the respective first heat generating electronic device, and a heat-transfer block for spreading heat energy from the first heat-transfer sheet member onto the heat plate through the second heat-transfer sheet member. | 01-22-2009 |
20080310095 | Multi-stack storage module board assembly - A multi-stack storage module board assembly includes a host board having an electric connector, multiple brackets mounted on the host board and fastened to one another in a stack, multiple multimedia storage devices respectively mounted in the brackets, and adapter modules mounted on support arms in the brackets to electrically connect the multimedia storage devices to the connector of the host board. Each adapter module has a first connector, which receives one multimedia storage device, a second connector connectable to the connector of the host board, and a third connector for receiving the second connector of another adapter module. | 12-18-2008 |